JPS6135345Y2 - - Google Patents
Info
- Publication number
- JPS6135345Y2 JPS6135345Y2 JP1138381U JP1138381U JPS6135345Y2 JP S6135345 Y2 JPS6135345 Y2 JP S6135345Y2 JP 1138381 U JP1138381 U JP 1138381U JP 1138381 U JP1138381 U JP 1138381U JP S6135345 Y2 JPS6135345 Y2 JP S6135345Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- heat
- soldering iron
- iron
- cylindrical body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 110
- 239000004065 semiconductor Substances 0.000 claims description 58
- 229910052742 iron Inorganic materials 0.000 claims description 55
- 238000005476 soldering Methods 0.000 claims description 38
- 239000011810 insulating material Substances 0.000 claims description 5
- 238000010409 ironing Methods 0.000 claims 1
- 239000010445 mica Substances 0.000 description 15
- 229910052618 mica group Inorganic materials 0.000 description 15
- 229920001721 polyimide Polymers 0.000 description 6
- 238000009413 insulation Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Resistance Heating (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1138381U JPS6135345Y2 (US07582779-20090901-C00044.png) | 1981-01-29 | 1981-01-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1138381U JPS6135345Y2 (US07582779-20090901-C00044.png) | 1981-01-29 | 1981-01-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57127373U JPS57127373U (US07582779-20090901-C00044.png) | 1982-08-09 |
JPS6135345Y2 true JPS6135345Y2 (US07582779-20090901-C00044.png) | 1986-10-14 |
Family
ID=29809524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1138381U Expired JPS6135345Y2 (US07582779-20090901-C00044.png) | 1981-01-29 | 1981-01-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6135345Y2 (US07582779-20090901-C00044.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5985673U (ja) * | 1982-11-29 | 1984-06-09 | 高千穂電気株式会社 | 電気半田ごてのチツプ |
-
1981
- 1981-01-29 JP JP1138381U patent/JPS6135345Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS57127373U (US07582779-20090901-C00044.png) | 1982-08-09 |