JPS6135149B2 - - Google Patents
Info
- Publication number
- JPS6135149B2 JPS6135149B2 JP57177266A JP17726682A JPS6135149B2 JP S6135149 B2 JPS6135149 B2 JP S6135149B2 JP 57177266 A JP57177266 A JP 57177266A JP 17726682 A JP17726682 A JP 17726682A JP S6135149 B2 JPS6135149 B2 JP S6135149B2
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- diamond
- parts
- binder
- hours
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000227 grinding Methods 0.000 claims description 25
- 239000010432 diamond Substances 0.000 claims description 22
- 229910003460 diamond Inorganic materials 0.000 claims description 21
- 239000011230 binding agent Substances 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 8
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 4
- 239000011707 mineral Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical compound OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920001353 Dextrin Polymers 0.000 description 2
- 239000004375 Dextrin Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 235000019425 dextrin Nutrition 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 208000013201 Stress fracture Diseases 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009837 dry grinding Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229910052629 lepidolite Inorganic materials 0.000 description 1
- 229920005610 lignin Polymers 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052628 phlogopite Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Ceramic Products (AREA)
Description
【発明の詳細な説明】
本発明は、容易に摩滅し、剛性の高いセラミツ
クを結合剤とする切れ味の良好なダイヤモンド砥
石に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a diamond whetstone that is easily worn out and has good sharpness and uses a highly rigid ceramic as a binder.
ダイヤモンドは、硬脆材料であるセラミツクの
研削に必須のものであり、金属やプラスチツクに
代る新しい素材としてセラミツクが多用されると
共に、ダイヤモンド砥石の需要は増々ふえる傾向
にある。 Diamond is essential for grinding ceramics, which are hard and brittle materials, and as ceramics are increasingly used as a new material to replace metals and plastics, the demand for diamond grinding wheels is increasing.
ダイヤモンドは、本質的には炭素であり、空気
中では高温で酸化して消滅する性質を有してい
る。また、その表面は不活性で、他物質との接合
力は弱い。これらの理由から、ダイヤモンド砥石
の中のダイヤモンドは、合成樹脂または金属のマ
トリツクスの中に、かしめられた状態で把握され
ている。 Diamond is essentially carbon, and has the property of oxidizing and disappearing at high temperatures in air. In addition, its surface is inert and its bonding force with other substances is weak. For these reasons, the diamonds in diamond wheels are held caulked in a synthetic resin or metal matrix.
これらのダイヤモンド砥石は、結合剤マトリツ
クスの弾性または塑性のため、研削点近傍におい
て局部変形し、切削に有効なダイヤモンド切れ刃
の突出を阻害し、また、研削中にマトリツクスが
加工物と摩擦して、加工エネルギーの大部分が摩
擦エネルギーとして消費され、従つてダイヤモン
ドのすぐれた研削能力が生かされていない。これ
らのダイヤモンド砥石は、乾式研削では、結合剤
の熱劣化または熱軟化により、砥石の減耗が甚し
い。 Due to the elasticity or plasticity of the binder matrix, these diamond grinding wheels undergo local deformation near the grinding point, which inhibits the protrusion of the diamond cutting edge that is effective for cutting, and also causes friction between the matrix and the workpiece during grinding. Most of the machining energy is consumed as frictional energy, so the excellent grinding ability of diamond is not utilized. In dry grinding, these diamond grinding wheels suffer from severe wear due to thermal deterioration or thermal softening of the binder.
このため、剛性に富み耐熱性の高いセラミツク
質の結合剤が開発されたが、結合剤自体が強固で
耐摩耗性に富むため、研削時に切削作用の邪魔を
して、その研削能力は、従来のダイヤモンド砥石
に比べ、大きな差は認められなかつた。 For this reason, a ceramic binder with high rigidity and high heat resistance was developed, but since the binder itself is strong and wear-resistant, it interferes with the cutting action during grinding, and its grinding ability is No major difference was observed compared to the diamond grinding wheel.
本発明によるセラミツクボンドダイヤモンド砥
石は、このような欠点を改良したものである。 The ceramic bonded diamond grindstone according to the present invention improves these drawbacks.
すなわち、セラミツクとしての特性である高強
度、高弾性率、耐熱性を有しているのは勿論であ
るが、摩滅して気孔の生成と切れ刃の突出をもた
らす特性を有している。このため、切り粉が容易
に排出されて目詰りを防ぎ、時間当り研削量が増
大し、良好な研削性が長時間維持される。 That is, it naturally has the characteristics of ceramic, such as high strength, high modulus of elasticity, and heat resistance, but it also has characteristics that cause it to wear out, resulting in the formation of pores and protrusion of cutting edges. Therefore, chips are easily discharged to prevent clogging, increase the amount of grinding per hour, and maintain good grindability for a long time.
本発明ではこのようなセラミツクとして、各種
の雲母系の鉱物や滑石などの層状鉱物の焼結体を
用いた。これらの鉱物の硬さは、モース硬度４以
下であり、また、微小破砕や摩滅によつて減耗
し、すぐれた研削能力が持続する。 In the present invention, sintered bodies of layered minerals such as various mica-based minerals and talc are used as such ceramics. The hardness of these minerals is 4 or less on the Mohs hardness scale, and they are worn away by micro-fractures and abrasion, and maintain excellent grinding ability.
以下、本発明の効果を実施例に基づき説明す
る。 Hereinafter, the effects of the present invention will be explained based on Examples.
実施例 １
人造ダイヤモンド砥粒（粒度#100/120）64部
とほう化チタン（粒度#80）36部を混合し、水６
部でしめらす。一方、滑石（平均粒径６μ）45
部、レピドライト（粒度#325以下）45部、フリ
ツト（軟化点395℃、熱膨脹係数５×10-6／℃）
27部、黄色デキストリン４部を混合し結合剤を調
整する。これを前者と混合し、網通し後、かさ密
度2.48で圧搾成型し、110℃で３時間乾燥する。
これを昇温速度毎時100℃で680℃に昇温し、４時
間保持後、再び同じ昇温速度で850℃に昇温し、
４時間保持後徐冷する。この砥石で炭化けい素焼
結体を、治具研削盤で乾式で内面研削を行なつた
結果、従来のレジンボンドダイヤモンド砥石に比
べ、15.1倍の時間当り研削量と2.5倍の研削比が
得られた。また、単石ダイヤモンドドレツサーを
用い、乾式でドレスが可能であつた。Example 1 64 parts of artificial diamond abrasive grains (grain size #100/120) and 36 parts of titanium boride (grain size #80) were mixed, and 64 parts of water was added.
I'll show it off at the club. On the other hand, talc (average particle size 6 μ) 45
part, lepidolite (particle size #325 or less) 45 parts, frit (softening point 395℃, coefficient of thermal expansion 5 x 10 -6 /℃)
Mix 27 parts of yellow dextrin and 4 parts of yellow dextrin to prepare a binder. This is mixed with the former, passed through a screen, compressed to a bulk density of 2.48, and dried at 110°C for 3 hours.
The temperature was raised to 680°C at a heating rate of 100°C per hour, and after holding for 4 hours, the temperature was raised again to 850°C at the same heating rate.
After holding for 4 hours, slowly cool. As a result of dry internal grinding of a silicon carbide sintered body using this grinding wheel using a jig grinder, a grinding amount of 15.1 times more per hour and a grinding ratio of 2.5 times were obtained compared to a conventional resin bonded diamond grinding wheel. Ta. In addition, dry dressing was possible using a single-stone diamond dresser.
実施例 ２
人造ダイヤモンド（粒度#270/325）70部と炭
化ケイ素（粒度#180）の混合物をフルフリール
アルコール6.5部でしめらす。一方、フツ素金雲
母（粒度#325以下）、フリツト（軟化点720℃、
熱膨脹係数3.6×10-6／℃）、粉末エポキシ樹脂
（Epon1004、粒度#220以下）を混合して結合剤
を調整する。これを前者と混合し、網通し後、か
さ密度2.40で圧搾成型し、110℃で３時間乾燥す
る。これを昇温速度毎時100℃で800℃まで昇温
し、４時間保持後、窒素ガスを注入しながら同じ
昇温速度で1100℃迄昇温し、３時間保持後徐冷す
る。この砥石でサフアイヤを横軸平面研削盤で湿
式で平面研削作業を行なつた結果、従来のメタル
ボンドダイヤモンド砥石に比べ、同一設定切り込
みで単位時間当り研削量が2.8倍に増加し、メタ
ルボンドダイヤモンド砥石で発生する割れ、欠
け、スクラツチが全く発生しなかつた。また、単
石ダイヤモンドドレツサーを用い、湿式でドレス
が可能であつた。Example 2 A mixture of 70 parts of artificial diamond (grain size #270/325) and silicon carbide (grain size #180) is diluted with 6.5 parts of furfuryl alcohol. On the other hand, fluorine phlogopite (particle size #325 or less), frit (softening point 720℃,
Adjust the binder by mixing powdered epoxy resin (Epon1004, particle size #220 or less) with a thermal expansion coefficient of 3.6×10 -6 /℃). This is mixed with the former, passed through a screen, compressed to a bulk density of 2.40, and dried at 110°C for 3 hours. The temperature is raised to 800°C at a heating rate of 100°C per hour, held for 4 hours, and then heated to 1100°C at the same heating rate while injecting nitrogen gas, held for 3 hours, and then slowly cooled. As a result of performing wet surface grinding work on Sapphire using this grinding wheel on a horizontal axis surface grinding machine, compared to the conventional metal bond diamond grinding wheel, the amount of grinding per unit time was increased by 2.8 times with the same setting cutting depth, and the metal bond diamond There were no cracks, chips, or scratches that occur with whetstones. In addition, wet dressing was possible using a single-stone diamond dresser.
実施例 ３
人造ダイヤモンド（粒度#1200）36部と溶融ア
ルミナ（粒度#320）64部の混合物を燐酸10部で
しめらす。一方、セリサイト（島根県産、#200以
下）90部、フリツト（軟化点470℃、熱膨脹係数
3.3×10-6／℃）10部、リグニン粉末４部を混合
し結合剤を調整する。これを前者と混合し網通し
後、かさ密度2.35で圧搾成型し、110℃で３時間
乾燥する。これを昇温速度毎時１時間で820℃に
昇温し、３時間保持後、窒素ガスを注入しながら
同じ昇温速度で1020℃に昇温し、３時間保持後徐
冷する。これをガラス曲面研磨機に取り付け、加
工圧力0.5Kg／cm2、毎分回転数1500でガラスを湿
式研削した結果従来のメタルボンドダイヤモンド
砥石に比べ、加工時間は26％に短縮し、研削比は
2.2倍に向上した。また、表面粗さも向上し、ス
クラツチは全く認められなかつた。Example 3 A mixture of 36 parts of artificial diamond (grain size #1200) and 64 parts of fused alumina (grain size #320) is soaked with 10 parts of phosphoric acid. On the other hand, 90 parts of sericite (produced in Shimane Prefecture, #200 or less), Fritz (softening point 470℃, coefficient of thermal expansion
3.3×10 -6 /℃) and 4 parts of lignin powder to prepare a binder. This is mixed with the former, passed through a mesh, compressed to a bulk density of 2.35, and dried at 110°C for 3 hours. The temperature was raised to 820°C at a heating rate of 1 hour per hour, and after holding for 3 hours, the temperature was raised to 1020°C at the same heating rate while injecting nitrogen gas, and after holding for 3 hours, it was slowly cooled. This was attached to a glass curved surface polishing machine and the glass was wet-ground at a processing pressure of 0.5Kg/cm 2 and a rotation speed of 1500 per minute.As a result, the processing time was shortened to 26% compared to conventional metal bond diamond grinding wheels, and the grinding ratio was
Improved by 2.2 times. Furthermore, the surface roughness was improved and no scratches were observed at all.
特に本発明は、これらの実施例に記載されたも
のに限定されるものではない。 In particular, the invention is not limited to what is described in these examples.
Claims (1)
ボンドダイヤモンド砥石。1. A ceramic bonded diamond grinding wheel that uses a sintered layered mineral as a binder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57177266A JPS5969483A (en) | 1982-10-07 | 1982-10-07 | Ceramic bond diamond grinding stone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57177266A JPS5969483A (en) | 1982-10-07 | 1982-10-07 | Ceramic bond diamond grinding stone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5969483A JPS5969483A (en) | 1984-04-19 |
| JPS6135149B2 true JPS6135149B2 (en) | 1986-08-11 |
Family
ID=16028049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57177266A Granted JPS5969483A (en) | 1982-10-07 | 1982-10-07 | Ceramic bond diamond grinding stone |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5969483A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005072912A1 (en) * | 2004-01-28 | 2005-08-11 | Kure-Norton Co., Ltd. | Method for producing vitrified diamond whetstone |
| JP5551040B2 (en) * | 2010-09-30 | 2014-07-16 | 本田技研工業株式会社 | Metal bond grinding wheel |
| CN114102451B (en) * | 2021-11-10 | 2022-09-30 | 华侨大学 | Natural raw lacquer ceramic composite diamond tool and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5127244A (en) * | 1974-08-29 | 1976-03-06 | Kamei Daikasuto Kogyo Kk | Toshimasukotsuto oyobi toshibatsukumiraanadono anzenshagaiakusesarii narabini gaihinosochakushita norimono |
| JPS5536467A (en) * | 1978-07-15 | 1980-03-14 | Basf Ag | Manufacture of diketone |
-
1982
- 1982-10-07 JP JP57177266A patent/JPS5969483A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5127244A (en) * | 1974-08-29 | 1976-03-06 | Kamei Daikasuto Kogyo Kk | Toshimasukotsuto oyobi toshibatsukumiraanadono anzenshagaiakusesarii narabini gaihinosochakushita norimono |
| JPS5536467A (en) * | 1978-07-15 | 1980-03-14 | Basf Ag | Manufacture of diketone |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5969483A (en) | 1984-04-19 |
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