JPH074123Y2 - Abrasive material - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to an improvement of an abrasive for dressing the ground surface of a diamond grindstone for grinding the end surface of a glass plate, that is, for correcting the sharpening and the shape.

(Prior Art) Conventionally, for example, when finishing an end surface of a glass plate for an automobile window by grinding, it is usual to mix diamond powder and metal powder in the circumferential portion of the disk and finish with a bonded diamond grindstone. .

The grinding surface of such a grindstone causes clogging or crushing of the grindstone when the grinding amount of the glass plate end surface reaches a certain amount,
A dressing is generally known in which the surface of the abrasive grains is exposed by the sharpness of the abrasive grains being lowered, the grinding performance being lowered, and the abrasion deformation of the grinding surface being caused.

As this dressing material, an abrasive material using silicon carbide-based green carborundum as abrasive grains (hereinafter referred to as GC abrasive grains) or aluminum oxide-based commonly known as white alundum as abrasive grains (hereinafter referred to as WA abrasive grains) is used. The polishing surface is used for polishing to regenerate the grinding surface of the diamond grindstone.

Such an abrasive has a Vickers hardness of approximately 1700-35.
On the surface of the abrasive grains of 00, the abrasive grains that are smaller than the above-mentioned abrasive grains and have a hardness greater than that of the abrasive grains are bonded via a bonding layer such as a thermosetting resin. It is disclosed.

(Problems to be solved by the invention) The former GC abrasive grains of the above-mentioned conventional products have high hardness of abrasive grains, and diamond abrasives and other clogged abrasives, binders,
Furthermore, even hard foreign substances mixed in the grindstone layer are polished, and the sharp corners of the diamond are rounded due to friction, the sharpness is reduced, and the amount of grinding on the grinding surface consisting of diamond abrasive grains is large. , The latter WA abrasive grains, due to the low hardness of the abrasive grains, only polish the clogged portion without polishing the diamond abrasive grains, but once foreign matter with high hardness is mixed, that portion is polished, that is, I could not shape the grinding surface of the diamond grindstone,
There is a problem that polishing with a polishing material composed of GC abrasive grains is required again, the polishing material is replaced, continuous grinding by a series of automation, and a line stop of polishing occur.

In the above-described composite abrasive grain, the manufacturing process is bulky because the hardness is small and the small abrasive grain is bonded to the surface of the abrasive grain having a large shape, and since the thermosetting resin or the like is used as the binder, it is fired. It cannot be used as an abrasive material.

(Means for Solving Problems) The present invention has been made in view of such problems in the past,
Provided is an abrasive material in which dispersed abrasive particles are combined with a binder to correct the sharpness and shape, and the abrasive material is mainly composed of a mixture of the abrasive particles in a volume ratio of 1 to 1.5 aluminum oxide to 1 silicon carbide. To do.

(Example) Hereinafter, the present invention will be specifically described based on Examples.

FIG. 1 is an enlarged cross-sectional view of a surface portion of an abrasive material showing an embodiment of the present invention, and FIG. 2 is a perspective view showing the relationship between the abrasive material and a diamond grindstone.

The abrasive 3 that comes into contact with the circumferential grinding surface 2 of the rotating diamond grindstone 1 is one in which GC abrasive grains 4 and WA abrasive grains 5 are firmly bonded via a binder 6, and each abrasive grain is on the surface portion. 4 and 5 are dispersed and projected.

The GC abrasive grains 4 of the abrasive 3 to be in contact with pressure have a high hardness but are relatively brittle, and the WA abrasive grains 5 have a low hardness and a toughness characteristic. To make the best use of each characteristic, each abrasive grain is dispersed and mixed. It is preferable to set the volume ratio to GC1 to be approximately the same as the volume ratio of WA1 to 1.5, and the GC abrasive grains 4 scrape away foreign matter with high hardness mixed into the grindstone while abrading a part of the diamond abrasive grain surface, The shape of the grinding surface 2 is shaped, and the WA abrasive grains 5 grind only the binder 6 and the grinding wear material that causes clogging.

Therefore, the grinding surface 2 of the diamond grindstone 1 is dressed by appearance of new diamond abrasive grains and the surface shape is shaped, and the grinding surface 2 is corrected and reused.

Examples will be described below.

Example 1 Dressing material GC Abrasive grains SiC 99.5% C Other Knoop hardness 2500 Grain size # 120 WA Abrasive grains Al ₂ O ₃ 99.7% SiO ₂ Other Knoop hardness 2070 Grain size # 120 Abrasive grain volume mixing ratio 1 to 1 Binder binder Id bond Bonding degree I Abrasive shape 30 Width x 5.3 thickness x 75 length (mm) Material to be ground Diamond wheel for glass edge grinding "Made by Asahi Diamond Industry Co., Ltd." Rotational peripheral speed 1500 to 1600 m / min (6 inΦ) 2000 to 2100m / min (8inΦ) Grinded product 5mm glass plate Grinding glass circumference 2.5m / 1 piece Abrasive pressure load 8kg Polish the grinding surface of the diamond grindstone under the above conditions, and use the diamond grindstone to grind the glass plate It was 15 when the number of finished plates was confirmed after processing.

Example 2 The grinding amount was confirmed under the same conditions as above except that the shape of the glass plate was 3 mm and the shape of the abrasive material was 30 × 3.8 × 75 (mm), and it was 17 pieces.

Comparative Example When a 5 mm plate was polished based on the polishing specifications of Example 1 described above with a conventional abrasive containing only GC abrasive grains, the number of diamond wheels to be processed was 10.

Next, when comparing the polishing loss of the diamond abrasive grain layer by dressing, the number of sheets of rolled glass plate processed by one of the whetstones is 1500 to 1600 with the conventional GC abrasive grain, GC and WA abrasive grains 4 and 5 are mixed. The body has 1800 to 2000 sheets, and the amount of polishing by dressing is obviously small.

The abrasive according to the constitution of the present invention has the characteristics of each abrasive grain, that is, the GC abrasive grain 4 having high hardness and relatively brittleness and the low hardness and toughness.
By mixing the WA abrasive grains 5 and combining them in a dispersed state, the GC abrasive grains 4 shape the grinding surface 2 and at the same time wear off the surface of the diamond abrasive grains, which are the objects to be abraded, which are strongly detached due to chipping Since the weight loss of the grinding surface 2 due to the dressing is small, the life of the grindstone is extended, and the WA abrasive grains 5 are dressed with a binder or the like to allow the diamond abrasive grains to appear.

If the mixing ratio of the WA abrasive grains 5 exceeds 1.5, the grinding time becomes long and the continuous grinding operation is hindered.

(Effect of the Invention) The present invention is to grind and shape the grinding surface of the grindstone by utilizing the characteristics of each other by mixing abrasive grains having different hardness and characteristics to form a bonded state in a dispersed state.
The amount of expensive diamond abrasive grain layers to be dressed can be reduced as much as possible, and the number of grinding treatments of the glass plate by the regenerated grindstone is significantly increased.

[Brief description of drawings]

The drawings show one embodiment of the present invention, FIG. 1 is an enlarged cross-sectional view of a surface portion of an abrasive material showing the embodiment of the present invention, and FIG. 2 is a perspective view showing the relationship between the abrasive material and a diamond grindstone. 1 ... Whetstone, 3 ... Abrasive material, 4 ... GC abrasive grain, 5 ... WA abrasive grain, 6 ... Binder

Claims (1)

[Scope of utility model registration request] 1. A polishing material in which dispersed abrasive grains are combined with a binder to correct the setting and shape of the abrasive grains, and the abrasive grains are mainly composed of a mixture having a volume ratio of 1 to 1.5 aluminum oxide to 1 silicon carbide. Polished material.