JPS6131368A - セラミツクスと金属の接合方法 - Google Patents
セラミツクスと金属の接合方法Info
- Publication number
- JPS6131368A JPS6131368A JP15445484A JP15445484A JPS6131368A JP S6131368 A JPS6131368 A JP S6131368A JP 15445484 A JP15445484 A JP 15445484A JP 15445484 A JP15445484 A JP 15445484A JP S6131368 A JPS6131368 A JP S6131368A
- Authority
- JP
- Japan
- Prior art keywords
- strength
- metal
- ceramics
- coefficient
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 26
- 238000000034 method Methods 0.000 title claims description 19
- 229910052751 metal Inorganic materials 0.000 title claims description 17
- 239000002184 metal Substances 0.000 title claims description 17
- 238000005304 joining Methods 0.000 claims description 15
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 239000011195 cermet Substances 0.000 claims 1
- 229910000601 superalloy Inorganic materials 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical group [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 description 7
- 238000001816 cooling Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 229910052575 non-oxide ceramic Inorganic materials 0.000 description 2
- 239000011225 non-oxide ceramic Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910009043 WC-Co Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15445484A JPS6131368A (ja) | 1984-07-25 | 1984-07-25 | セラミツクスと金属の接合方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15445484A JPS6131368A (ja) | 1984-07-25 | 1984-07-25 | セラミツクスと金属の接合方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6131368A true JPS6131368A (ja) | 1986-02-13 |
| JPH0573715B2 JPH0573715B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-10-14 |
Family
ID=15584573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15445484A Granted JPS6131368A (ja) | 1984-07-25 | 1984-07-25 | セラミツクスと金属の接合方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6131368A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4890783A (en) * | 1988-11-29 | 1990-01-02 | Li Chou H | Ceramic-metal joining |
| WO1990006208A1 (en) * | 1988-11-29 | 1990-06-14 | Li Chou H | Materials joining |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59203779A (ja) * | 1983-04-28 | 1984-11-17 | 株式会社東芝 | 熱膨張係数の異なるセラミックス焼結体どうしあるいはセラミックス焼結体と金属部材との接合方法、およびセラミックス接合体 |
| JPS6090878A (ja) * | 1983-10-26 | 1985-05-22 | 三菱重工業株式会社 | セラミツクと金属の接合法 |
-
1984
- 1984-07-25 JP JP15445484A patent/JPS6131368A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59203779A (ja) * | 1983-04-28 | 1984-11-17 | 株式会社東芝 | 熱膨張係数の異なるセラミックス焼結体どうしあるいはセラミックス焼結体と金属部材との接合方法、およびセラミックス接合体 |
| JPS6090878A (ja) * | 1983-10-26 | 1985-05-22 | 三菱重工業株式会社 | セラミツクと金属の接合法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4890783A (en) * | 1988-11-29 | 1990-01-02 | Li Chou H | Ceramic-metal joining |
| WO1990006208A1 (en) * | 1988-11-29 | 1990-06-14 | Li Chou H | Materials joining |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0573715B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-10-14 |