JPS6130750B2 - - Google Patents
Info
- Publication number
- JPS6130750B2 JPS6130750B2 JP55173525A JP17352580A JPS6130750B2 JP S6130750 B2 JPS6130750 B2 JP S6130750B2 JP 55173525 A JP55173525 A JP 55173525A JP 17352580 A JP17352580 A JP 17352580A JP S6130750 B2 JPS6130750 B2 JP S6130750B2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- resin
- semiconductor device
- screw hole
- distance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W74/111—
-
- H10W40/778—
-
- H10W74/127—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55173525A JPS5796559A (en) | 1980-12-09 | 1980-12-09 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55173525A JPS5796559A (en) | 1980-12-09 | 1980-12-09 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5796559A JPS5796559A (en) | 1982-06-15 |
| JPS6130750B2 true JPS6130750B2 (cg-RX-API-DMAC10.html) | 1986-07-15 |
Family
ID=15962132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55173525A Granted JPS5796559A (en) | 1980-12-09 | 1980-12-09 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5796559A (cg-RX-API-DMAC10.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58170044A (ja) * | 1982-03-31 | 1983-10-06 | Fujitsu Ltd | 半導体素子 |
| IT1252704B (it) * | 1991-12-20 | 1995-06-26 | Sgs Thomson Microelectronics | Struttura di dispositivo a semiconduttore con dissipatore metallico e corpo in plastica avente superfici di contatto a rugosita' controllata e procedimento per la sua fabbricazione |
| JP2531382B2 (ja) * | 1994-05-26 | 1996-09-04 | 日本電気株式会社 | ボ―ルグリッドアレイ半導体装置およびその製造方法 |
-
1980
- 1980-12-09 JP JP55173525A patent/JPS5796559A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5796559A (en) | 1982-06-15 |
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