JPS6130424B2 - - Google Patents
Info
- Publication number
- JPS6130424B2 JPS6130424B2 JP55144923A JP14492380A JPS6130424B2 JP S6130424 B2 JPS6130424 B2 JP S6130424B2 JP 55144923 A JP55144923 A JP 55144923A JP 14492380 A JP14492380 A JP 14492380A JP S6130424 B2 JPS6130424 B2 JP S6130424B2
- Authority
- JP
- Japan
- Prior art keywords
- lid
- container
- substrate
- metal
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 238000009413 insulation Methods 0.000 description 6
- 239000012212 insulator Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55144923A JPS5769769A (en) | 1980-10-16 | 1980-10-16 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55144923A JPS5769769A (en) | 1980-10-16 | 1980-10-16 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5769769A JPS5769769A (en) | 1982-04-28 |
JPS6130424B2 true JPS6130424B2 (de) | 1986-07-14 |
Family
ID=15373358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55144923A Granted JPS5769769A (en) | 1980-10-16 | 1980-10-16 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5769769A (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03119331U (de) * | 1990-03-14 | 1991-12-09 | ||
JPH0574434U (ja) * | 1992-03-12 | 1993-10-12 | 旭化成工業株式会社 | 抽出フィルター |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6263459A (ja) * | 1985-09-13 | 1987-03-20 | Internatl Rectifier Corp Japan Ltd | 半導体素子用気密端子 |
US6037652A (en) * | 1997-05-29 | 2000-03-14 | Nec Corporation | Lead frame with each lead having a peel generation preventing means and a semiconductor device using same |
-
1980
- 1980-10-16 JP JP55144923A patent/JPS5769769A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03119331U (de) * | 1990-03-14 | 1991-12-09 | ||
JPH0574434U (ja) * | 1992-03-12 | 1993-10-12 | 旭化成工業株式会社 | 抽出フィルター |
Also Published As
Publication number | Publication date |
---|---|
JPS5769769A (en) | 1982-04-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3404319A (en) | Semiconductor device | |
US4107727A (en) | Resin sealed semiconductor device | |
JPH1082698A (ja) | 測定抵抗体を有する温度センサ | |
JP6806024B2 (ja) | 半導体装置 | |
EP0418891B1 (de) | Leistungshalbleiteranordnung mit Plastikumhüllung | |
US3992717A (en) | Housing for a compression bonded encapsulation of a semiconductor device | |
US2744218A (en) | Sealed rectifier unit and method of making the same | |
US3335336A (en) | Glass sealed ceramic housings for semiconductor devices | |
JPS62291052A (ja) | 気密封止形パッケージ | |
JP3797021B2 (ja) | 電力用半導体装置 | |
JPS6130424B2 (de) | ||
US2993153A (en) | Seal | |
CN218101229U (zh) | 一种半导体封装结构 | |
JPS6119106B2 (de) | ||
US3001110A (en) | Coaxial semiconductors | |
JP2621722B2 (ja) | 半導体装置 | |
JPS6020942Y2 (ja) | 半導体装置 | |
US3381184A (en) | Lead termination structure | |
US3409808A (en) | High voltage diode for low pressure applications | |
JPH0777242B2 (ja) | 半導体素子用容器 | |
JPS638138Y2 (de) | ||
JPH049715Y2 (de) | ||
JPS6011651Y2 (ja) | 半導体装置 | |
JPS6120780Y2 (de) | ||
JPH0357020Y2 (de) |