JPS6130290Y2 - - Google Patents
Info
- Publication number
- JPS6130290Y2 JPS6130290Y2 JP1980075963U JP7596380U JPS6130290Y2 JP S6130290 Y2 JPS6130290 Y2 JP S6130290Y2 JP 1980075963 U JP1980075963 U JP 1980075963U JP 7596380 U JP7596380 U JP 7596380U JP S6130290 Y2 JPS6130290 Y2 JP S6130290Y2
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- mounting
- heat sink
- transistors
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 6
- 230000001154 acute effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980075963U JPS6130290Y2 (h) | 1980-05-30 | 1980-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980075963U JPS6130290Y2 (h) | 1980-05-30 | 1980-05-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57950U JPS57950U (h) | 1982-01-06 |
| JPS6130290Y2 true JPS6130290Y2 (h) | 1986-09-05 |
Family
ID=29438623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980075963U Expired JPS6130290Y2 (h) | 1980-05-30 | 1980-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6130290Y2 (h) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0638429Y2 (ja) * | 1988-11-18 | 1994-10-05 | 富士通電装株式会社 | 半導体素子取付け構造 |
| JP5170677B2 (ja) * | 2008-08-08 | 2013-03-27 | 日立工機株式会社 | 電動工具 |
| JP6541954B2 (ja) * | 2014-10-03 | 2019-07-10 | 三菱重工サーマルシステムズ株式会社 | パワートランジスタの設置構造、インバータ並びにインバータ一体型電動圧縮機 |
-
1980
- 1980-05-30 JP JP1980075963U patent/JPS6130290Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57950U (h) | 1982-01-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4481525A (en) | Heat dissipator for integrated circuit chips | |
| US6229703B1 (en) | Cooler device | |
| US4890196A (en) | Solderable heat sink fastener | |
| JPS6130290Y2 (h) | ||
| US6164981A (en) | Package socket system | |
| US6323437B1 (en) | Spring clamp adapted for coupling with a circuit board | |
| JPH0356078Y2 (h) | ||
| JPS6322683Y2 (h) | ||
| JPH05315484A (ja) | 半導体用放熱装置 | |
| JPH0126541B2 (h) | ||
| JPH0559894U (ja) | 発熱電子部品の放熱構造 | |
| JP2004119706A (ja) | ヒートシンク | |
| JPH0316314Y2 (h) | ||
| JPS626695Y2 (h) | ||
| JPS6228767Y2 (h) | ||
| JPH039335Y2 (h) | ||
| JPH0617310Y2 (ja) | 放熱板の固定構造 | |
| JP3577338B2 (ja) | 電子機器の放熱板 | |
| JPH0334914Y2 (h) | ||
| JP2940528B2 (ja) | トランジスタ組立取付用放熱板 | |
| JPH0217486Y2 (h) | ||
| JPH064635Y2 (ja) | 放熱器の取付け構造 | |
| JPH0644110Y2 (ja) | 半導体装置 | |
| JPS629737Y2 (h) | ||
| JPH0346505Y2 (h) |