JPS61295692A - プリント回路用金属基板 - Google Patents
プリント回路用金属基板Info
- Publication number
- JPS61295692A JPS61295692A JP60138141A JP13814185A JPS61295692A JP S61295692 A JPS61295692 A JP S61295692A JP 60138141 A JP60138141 A JP 60138141A JP 13814185 A JP13814185 A JP 13814185A JP S61295692 A JPS61295692 A JP S61295692A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- metal
- insulating layer
- adhesive strength
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 42
- 239000002184 metal Substances 0.000 title claims description 42
- 239000000758 substrate Substances 0.000 title claims description 26
- 229910001374 Invar Inorganic materials 0.000 claims description 29
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 20
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052742 iron Inorganic materials 0.000 claims description 10
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 239000011701 zinc Substances 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 40
- 229910052802 copper Inorganic materials 0.000 description 27
- 239000010949 copper Substances 0.000 description 27
- 239000000853 adhesive Substances 0.000 description 20
- 230000001070 adhesive effect Effects 0.000 description 20
- 239000011889 copper foil Substances 0.000 description 13
- 238000009863 impact test Methods 0.000 description 9
- 239000004744 fabric Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 229910000975 Carbon steel Inorganic materials 0.000 description 4
- 239000010962 carbon steel Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 238000007751 thermal spraying Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 210000003746 feather Anatomy 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60138141A JPS61295692A (ja) | 1985-06-25 | 1985-06-25 | プリント回路用金属基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60138141A JPS61295692A (ja) | 1985-06-25 | 1985-06-25 | プリント回路用金属基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61295692A true JPS61295692A (ja) | 1986-12-26 |
| JPH0528517B2 JPH0528517B2 (enrdf_load_stackoverflow) | 1993-04-26 |
Family
ID=15214961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60138141A Granted JPS61295692A (ja) | 1985-06-25 | 1985-06-25 | プリント回路用金属基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61295692A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62149867U (enrdf_load_stackoverflow) * | 1986-03-14 | 1987-09-22 | ||
| JPH0242467U (enrdf_load_stackoverflow) * | 1988-09-16 | 1990-03-23 | ||
| US5073840A (en) * | 1988-10-06 | 1991-12-17 | Microlithics Corporation | Circuit board with coated metal support structure and method for making same |
| US9076780B2 (en) | 2010-12-20 | 2015-07-07 | Hitachi, Ltd. | Power module and lead frame for power module |
-
1985
- 1985-06-25 JP JP60138141A patent/JPS61295692A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62149867U (enrdf_load_stackoverflow) * | 1986-03-14 | 1987-09-22 | ||
| JPH0242467U (enrdf_load_stackoverflow) * | 1988-09-16 | 1990-03-23 | ||
| US5073840A (en) * | 1988-10-06 | 1991-12-17 | Microlithics Corporation | Circuit board with coated metal support structure and method for making same |
| US9076780B2 (en) | 2010-12-20 | 2015-07-07 | Hitachi, Ltd. | Power module and lead frame for power module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0528517B2 (enrdf_load_stackoverflow) | 1993-04-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0247575B1 (en) | Multilayer printed wiring board and method for producing the same | |
| US5917157A (en) | Multilayer wiring board laminate with enhanced thermal dissipation to dielectric substrate laminate | |
| KR960001356B1 (ko) | 리지드형 다층 프린트 배선판의 제조방법 | |
| JPS59198790A (ja) | プリント配線基板 | |
| JPS61295692A (ja) | プリント回路用金属基板 | |
| JP5069485B2 (ja) | 金属ベース回路基板 | |
| JPS61295693A (ja) | プリント回路用の金属基板 | |
| CN100521878C (zh) | 多层印刷电路配线板的制造方法 | |
| JPH04144190A (ja) | 配線基板およびその製造方法 | |
| JPH09331123A (ja) | 金属ベース多層配線基板 | |
| JPH0316799B2 (enrdf_load_stackoverflow) | ||
| JPH07106770A (ja) | 多層プリント配線板 | |
| JP3257953B2 (ja) | 混成集積回路用基板の製造方法 | |
| GB2164294A (en) | Electrical distribution boards | |
| EP0366338A2 (en) | A substrate for an electrical circuit system and a circuit system using that substrate | |
| JPH05235519A (ja) | 配線板の製造法 | |
| JP3167360B2 (ja) | 混成集積回路用基板の製造方法 | |
| JPS622591A (ja) | 金属ベ−ス混成集積回路基板の製法 | |
| JP2922589B2 (ja) | 多層回路基板の製造方法 | |
| JPH02111095A (ja) | 表面実装用基板 | |
| JPS62128596A (ja) | リジッド型多層プリント回路基板の製造方法 | |
| JPH05315740A (ja) | 印刷回路用銅張フイルムおよびその製法 | |
| JPS5874092A (ja) | 電子回路の基板 | |
| JPH05191045A (ja) | 多層プリント配線板の製造方法 | |
| JPH0455558B2 (enrdf_load_stackoverflow) |