JPH0528517B2 - - Google Patents
Info
- Publication number
- JPH0528517B2 JPH0528517B2 JP60138141A JP13814185A JPH0528517B2 JP H0528517 B2 JPH0528517 B2 JP H0528517B2 JP 60138141 A JP60138141 A JP 60138141A JP 13814185 A JP13814185 A JP 13814185A JP H0528517 B2 JPH0528517 B2 JP H0528517B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- metal
- insulating layer
- adhesive strength
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60138141A JPS61295692A (ja) | 1985-06-25 | 1985-06-25 | プリント回路用金属基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60138141A JPS61295692A (ja) | 1985-06-25 | 1985-06-25 | プリント回路用金属基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61295692A JPS61295692A (ja) | 1986-12-26 |
JPH0528517B2 true JPH0528517B2 (enrdf_load_stackoverflow) | 1993-04-26 |
Family
ID=15214961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60138141A Granted JPS61295692A (ja) | 1985-06-25 | 1985-06-25 | プリント回路用金属基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61295692A (enrdf_load_stackoverflow) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62149867U (enrdf_load_stackoverflow) * | 1986-03-14 | 1987-09-22 | ||
JPH0242467U (enrdf_load_stackoverflow) * | 1988-09-16 | 1990-03-23 | ||
US5073840A (en) * | 1988-10-06 | 1991-12-17 | Microlithics Corporation | Circuit board with coated metal support structure and method for making same |
JP5523299B2 (ja) | 2010-12-20 | 2014-06-18 | 株式会社日立製作所 | パワーモジュール |
-
1985
- 1985-06-25 JP JP60138141A patent/JPS61295692A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61295692A (ja) | 1986-12-26 |
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