JPS61295275A - 高熱伝導性窒化アルミニウム焼結体 - Google Patents
高熱伝導性窒化アルミニウム焼結体Info
- Publication number
- JPS61295275A JPS61295275A JP60137585A JP13758585A JPS61295275A JP S61295275 A JPS61295275 A JP S61295275A JP 60137585 A JP60137585 A JP 60137585A JP 13758585 A JP13758585 A JP 13758585A JP S61295275 A JPS61295275 A JP S61295275A
- Authority
- JP
- Japan
- Prior art keywords
- sintered body
- aluminum nitride
- thermal conductivity
- parts
- high heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 title claims description 12
- 229910052782 aluminium Inorganic materials 0.000 title description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 229910052735 hafnium Inorganic materials 0.000 claims description 6
- 229910052715 tantalum Inorganic materials 0.000 claims description 6
- 229910052720 vanadium Inorganic materials 0.000 claims description 6
- 229910052758 niobium Inorganic materials 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 description 20
- 239000002184 metal Substances 0.000 description 20
- 239000000758 substrate Substances 0.000 description 14
- 239000000843 powder Substances 0.000 description 9
- 235000013405 beer Nutrition 0.000 description 8
- 150000002739 metals Chemical class 0.000 description 8
- 239000002245 particle Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910018509 Al—N Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000001272 pressureless sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60137585A JPS61295275A (ja) | 1985-06-24 | 1985-06-24 | 高熱伝導性窒化アルミニウム焼結体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60137585A JPS61295275A (ja) | 1985-06-24 | 1985-06-24 | 高熱伝導性窒化アルミニウム焼結体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61295275A true JPS61295275A (ja) | 1986-12-26 |
| JPH04950B2 JPH04950B2 (enrdf_load_stackoverflow) | 1992-01-09 |
Family
ID=15202152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60137585A Granted JPS61295275A (ja) | 1985-06-24 | 1985-06-24 | 高熱伝導性窒化アルミニウム焼結体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61295275A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63190133A (ja) * | 1987-01-31 | 1988-08-05 | Ibiden Co Ltd | 窒化アルミニウム焼結体およびその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49126707A (enrdf_load_stackoverflow) * | 1973-04-05 | 1974-12-04 |
-
1985
- 1985-06-24 JP JP60137585A patent/JPS61295275A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49126707A (enrdf_load_stackoverflow) * | 1973-04-05 | 1974-12-04 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63190133A (ja) * | 1987-01-31 | 1988-08-05 | Ibiden Co Ltd | 窒化アルミニウム焼結体およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04950B2 (enrdf_load_stackoverflow) | 1992-01-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4877760A (en) | Aluminum nitride sintered body with high thermal conductivity and process for producing same | |
| US4571610A (en) | Semiconductor device having electrically insulating substrate of SiC | |
| Kuramoto et al. | Translucent A1N ceramic substrate | |
| JPH0569797B2 (enrdf_load_stackoverflow) | ||
| JP3575068B2 (ja) | 平滑なめっき層を有するセラミックスメタライズ基板およびその製造方法 | |
| JPS5899172A (ja) | 電気絶縁基板 | |
| KR20010079642A (ko) | 복합 재료 및 그를 이용한 반도체 장치 | |
| JPH0243700B2 (enrdf_load_stackoverflow) | ||
| JP3408298B2 (ja) | 高熱伝導性窒化けい素メタライズ基板，その製造方法および窒化けい素モジュール | |
| JPH022836B2 (enrdf_load_stackoverflow) | ||
| JPS61291480A (ja) | 窒化アルミニウム製基材の表面処理組成物 | |
| JPS61270263A (ja) | 高熱伝導性窒化アルミニウム焼結体の製造法 | |
| JPS61295275A (ja) | 高熱伝導性窒化アルミニウム焼結体 | |
| JPS61281074A (ja) | メタライズ用高熱伝導性窒化アルミニウム焼結体 | |
| JP2563809B2 (ja) | 半導体用窒化アルミニウム基板 | |
| JP2677748B2 (ja) | セラミックス銅回路基板 | |
| JPH07105464B2 (ja) | 半導体素子搭載用半導体装置 | |
| JPS6246512B2 (enrdf_load_stackoverflow) | ||
| JPH08731B2 (ja) | 高熱伝導性窒化アルミニウム焼結体 | |
| JPH0323511B2 (enrdf_load_stackoverflow) | ||
| JPH0684265B2 (ja) | 窒化アルミニウム焼結体 | |
| JP2001002474A (ja) | 窒化アルミニウム焼結体とその製造方法、及び用途 | |
| JP3230861B2 (ja) | 窒化けい素メタライズ基板 | |
| JP2867693B2 (ja) | 回路基板 | |
| JPS59136938A (ja) | 半導体基板材料 |