JPS61292944A - 集積回路パツケ−ジの液体冷却構造 - Google Patents

集積回路パツケ−ジの液体冷却構造

Info

Publication number
JPS61292944A
JPS61292944A JP60134842A JP13484285A JPS61292944A JP S61292944 A JPS61292944 A JP S61292944A JP 60134842 A JP60134842 A JP 60134842A JP 13484285 A JP13484285 A JP 13484285A JP S61292944 A JPS61292944 A JP S61292944A
Authority
JP
Japan
Prior art keywords
plate
thermal conductive
cooling
heat conduction
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60134842A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0426549B2 (ref
Inventor
Yoshikatsu Okada
芳克 岡田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60134842A priority Critical patent/JPS61292944A/ja
Priority to US06/876,381 priority patent/US4693303A/en
Priority to FR868608866A priority patent/FR2583921B1/fr
Publication of JPS61292944A publication Critical patent/JPS61292944A/ja
Publication of JPH0426549B2 publication Critical patent/JPH0426549B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60134842A 1985-06-20 1985-06-20 集積回路パツケ−ジの液体冷却構造 Granted JPS61292944A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP60134842A JPS61292944A (ja) 1985-06-20 1985-06-20 集積回路パツケ−ジの液体冷却構造
US06/876,381 US4693303A (en) 1985-06-20 1986-06-19 Liquid cooling module with springy contact elements and an aperture plate slidable thereover
FR868608866A FR2583921B1 (fr) 1985-06-20 1986-06-19 Module de refroidissement par liquide de composants electroniques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60134842A JPS61292944A (ja) 1985-06-20 1985-06-20 集積回路パツケ−ジの液体冷却構造

Publications (2)

Publication Number Publication Date
JPS61292944A true JPS61292944A (ja) 1986-12-23
JPH0426549B2 JPH0426549B2 (ref) 1992-05-07

Family

ID=15137738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60134842A Granted JPS61292944A (ja) 1985-06-20 1985-06-20 集積回路パツケ−ジの液体冷却構造

Country Status (3)

Country Link
US (1) US4693303A (ref)
JP (1) JPS61292944A (ref)
FR (1) FR2583921B1 (ref)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020155521A (ja) * 2019-03-19 2020-09-24 日本電気株式会社 放熱構造及び電子部品

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68918156T2 (de) * 1988-05-09 1995-01-12 Nippon Electric Co Flache Kühlungsstruktur für integrierte Schaltung.
US4882654A (en) * 1988-12-22 1989-11-21 Microelectronics And Computer Technology Corporation Method and apparatus for adjustably mounting a heat exchanger for an electronic component
US6665184B2 (en) 2001-07-13 2003-12-16 Lytron, Inc. Tapered cold plate
US7849914B2 (en) * 2006-05-02 2010-12-14 Clockspeed, Inc. Cooling apparatus for microelectronic devices
SG181180A1 (en) * 2010-11-12 2012-06-28 Semicaps Pte Ltd Apparatus and method for cooling a semiconductor device
WO2012131519A1 (en) 2011-03-25 2012-10-04 Koninklijke Philips Electronics N.V. Thermal interface pad material with perforated liner
US9917034B2 (en) 2014-09-26 2018-03-13 Semicaps Pte Ltd Method and apparatus for cooling a semiconductor device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4093971A (en) * 1976-12-10 1978-06-06 Burroughs Corporation D-I-P On island
US4226281A (en) * 1979-06-11 1980-10-07 International Business Machines Corporation Thermal conduction module
US4341432A (en) * 1979-08-06 1982-07-27 Cutchaw John M Liquid cooled connector for integrated circuit packages
US4381032A (en) * 1981-04-23 1983-04-26 Cutchaw John M Apparatus for cooling high-density integrated circuit packages

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020155521A (ja) * 2019-03-19 2020-09-24 日本電気株式会社 放熱構造及び電子部品

Also Published As

Publication number Publication date
US4693303A (en) 1987-09-15
FR2583921B1 (fr) 1989-04-07
JPH0426549B2 (ref) 1992-05-07
FR2583921A1 (fr) 1986-12-26

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