JPS61291964A - スパツタ用樹脂タ−ゲツト - Google Patents

スパツタ用樹脂タ−ゲツト

Info

Publication number
JPS61291964A
JPS61291964A JP13152085A JP13152085A JPS61291964A JP S61291964 A JPS61291964 A JP S61291964A JP 13152085 A JP13152085 A JP 13152085A JP 13152085 A JP13152085 A JP 13152085A JP S61291964 A JPS61291964 A JP S61291964A
Authority
JP
Japan
Prior art keywords
target
resin
sputtering
grooves
sputtered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13152085A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0377273B2 (cs
Inventor
Akio Konishi
小西　暁夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corp filed Critical Anelva Corp
Priority to JP13152085A priority Critical patent/JPS61291964A/ja
Publication of JPS61291964A publication Critical patent/JPS61291964A/ja
Publication of JPH0377273B2 publication Critical patent/JPH0377273B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP13152085A 1985-06-17 1985-06-17 スパツタ用樹脂タ−ゲツト Granted JPS61291964A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13152085A JPS61291964A (ja) 1985-06-17 1985-06-17 スパツタ用樹脂タ−ゲツト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13152085A JPS61291964A (ja) 1985-06-17 1985-06-17 スパツタ用樹脂タ−ゲツト

Publications (2)

Publication Number Publication Date
JPS61291964A true JPS61291964A (ja) 1986-12-22
JPH0377273B2 JPH0377273B2 (cs) 1991-12-10

Family

ID=15059972

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13152085A Granted JPS61291964A (ja) 1985-06-17 1985-06-17 スパツタ用樹脂タ−ゲツト

Country Status (1)

Country Link
JP (1) JPS61291964A (cs)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1116800A4 (en) * 1999-07-15 2004-09-08 Nikko Materials Co Ltd sputtering Target
WO2005007924A1 (en) * 2003-07-07 2005-01-27 Honeywell International Inc. Sputtering target constructions
JP2008255479A (ja) * 2007-03-09 2008-10-23 Mitsubishi Materials Corp 蒸着材
US7850829B2 (en) 2005-01-12 2010-12-14 Tosoh Smd, Inc. Sputter targets with expansion grooves for reduced separation
WO2011132867A3 (ko) * 2010-04-21 2012-01-26 Park Young-Chun 단차구조를 포함하는 스퍼터 타켓 및 이를 이용하는 스퍼터링 장치
TWI711710B (zh) * 2015-12-18 2020-12-01 德商攀時組成物質有限公司 結構化披覆源

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1116800A4 (en) * 1999-07-15 2004-09-08 Nikko Materials Co Ltd sputtering Target
WO2005007924A1 (en) * 2003-07-07 2005-01-27 Honeywell International Inc. Sputtering target constructions
US7850829B2 (en) 2005-01-12 2010-12-14 Tosoh Smd, Inc. Sputter targets with expansion grooves for reduced separation
JP2008255479A (ja) * 2007-03-09 2008-10-23 Mitsubishi Materials Corp 蒸着材
WO2011132867A3 (ko) * 2010-04-21 2012-01-26 Park Young-Chun 단차구조를 포함하는 스퍼터 타켓 및 이를 이용하는 스퍼터링 장치
TWI711710B (zh) * 2015-12-18 2020-12-01 德商攀時組成物質有限公司 結構化披覆源

Also Published As

Publication number Publication date
JPH0377273B2 (cs) 1991-12-10

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