JPH0377273B2 - - Google Patents
Info
- Publication number
- JPH0377273B2 JPH0377273B2 JP13152085A JP13152085A JPH0377273B2 JP H0377273 B2 JPH0377273 B2 JP H0377273B2 JP 13152085 A JP13152085 A JP 13152085A JP 13152085 A JP13152085 A JP 13152085A JP H0377273 B2 JPH0377273 B2 JP H0377273B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- target
- sputtering
- resin target
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13152085A JPS61291964A (ja) | 1985-06-17 | 1985-06-17 | スパツタ用樹脂タ−ゲツト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13152085A JPS61291964A (ja) | 1985-06-17 | 1985-06-17 | スパツタ用樹脂タ−ゲツト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61291964A JPS61291964A (ja) | 1986-12-22 |
| JPH0377273B2 true JPH0377273B2 (cs) | 1991-12-10 |
Family
ID=15059972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13152085A Granted JPS61291964A (ja) | 1985-06-17 | 1985-06-17 | スパツタ用樹脂タ−ゲツト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61291964A (cs) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3628554B2 (ja) * | 1999-07-15 | 2005-03-16 | 株式会社日鉱マテリアルズ | スパッタリングターゲット |
| WO2005007924A1 (en) * | 2003-07-07 | 2005-01-27 | Honeywell International Inc. | Sputtering target constructions |
| US7772543B2 (en) | 2005-01-12 | 2010-08-10 | New York University | System and method for processing nanowires with holographic optical tweezers |
| JP5029431B2 (ja) * | 2007-03-09 | 2012-09-19 | 三菱マテリアル株式会社 | 蒸着材及び該蒸着材を用いて蒸着膜を形成する方法 |
| KR20110117565A (ko) * | 2010-04-21 | 2011-10-27 | 박영춘 | 단차구조를 포함하는 스퍼터 타켓 및 이를 이용하는 스퍼터링 장치 |
| AT15050U1 (de) * | 2015-12-18 | 2016-11-15 | Plansee Composite Mat Gmbh | Beschichtungsquelle mit Strukturierung |
-
1985
- 1985-06-17 JP JP13152085A patent/JPS61291964A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61291964A (ja) | 1986-12-22 |
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