JPS61287951A - Phenolic resin composition - Google Patents

Abstract

PURPOSE:To improve mechanical strength (caulking strength) and plateability to thereby provide a good semiconductor water support ring, by blending a phenolic resin, a natural org. fiber and carbon in a specified ratio. CONSTITUTION:0.1-70wt% natural org. fiber and 0.1-70wt% carbon each based on the resin compsn. are blended with a phenolic resin. Examples of the phenolic resins are novolak and resol type phenolic resins and their mixtures. Examples of the natural org. fibers are woodmeal, cotton flock, alpha-cellulose, flax and cotton fabric. Carbon may be in any form of fiber and powder. Examples of the fibrous carbons are pitch carbon fibers such as carbonaceous carbon fiber and graphite carbon fiber; and PAN carbon fiber. Examples of the powdered carbons are graphite and carbon black.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention maintains the excellent properties of phenolic resins in general,
The present invention relates to a phenolic resin composition that can produce a molded product with good mechanical strength (crimping strength) and which can be plated, particularly a phenolic resin composition suitable for molding IC wafer support rings and the like.

[Technical background of the invention and its problems] Phenolic resins are used as fillers, plasticizers, colorants, mold release agents,
Mixed with other auxiliary materials and kneaded, it has been widely used as a phenolic resin molding material.

In recent years, phenolic resin has become popular due to its characteristics of good heat resistance, chemical resistance, and dimensional stability per cost.
It is being reviewed in various fields such as automobile parts and electrical/electronic parts. It is increasingly being used as a substitute for metals in automotive parts due to its low cost and low specific gravity.

On the other hand, they are increasingly being used in electronic parts and semiconductor-related parts to reduce costs. Especially recently, in the fields of electronic parts and semiconductor-related parts, the requirements for clean dust and fine chemicals have become extremely strict.

For example, IC wafer support rings are currently mainly made of aluminum, stainless steel, etc., but depending on the dicing process, higher heat resistance and chemical resistance are required, especially dimensional accuracy against warping and twisting, and crimping resistance to prevent cranking. Strength is required as an essential condition. Furthermore, from the viewpoint of clean dust, processability such as plating is strongly desired in order to prevent the surface of phenolic resin molded products from becoming contaminated.

However, although phenol resins have excellent chemical resistance, heat resistance, dimensional stability, etc., they have the disadvantage that their caulking strength under high loads, high impacts, etc. is inferior to thermoplastic resins and metals. Furthermore, it has poor electrical conductivity, making it difficult to work with plating.
It had the disadvantage that it required the use of a special plating method and was significantly inferior to metal.

[Objective of the Invention] The object of the present invention was to solve the above-mentioned drawbacks, and it was made to provide a material with excellent mechanical strength (crimping strength) and plating workability while retaining the excellent properties of phenolic resin in general. Another object of the present invention is to provide a phenolic resin composition suitable for IC wafer support rings and the like.

[Summary of the Invention] As a result of intensive studies to achieve the above object, the present inventors discovered that the phenolic resin composition described below can achieve the above object, and thus completed the present invention. . That is, the present invention provides phenolic resin, natural cloth i.
! 1-70% by weight of natural organic fibers and 0.1-7% carbon based on the resin composition.
This is a phenolic resin composition characterized in that it contains 0% by weight of each. This phenol resin composition has excellent caulking strength and plating workability, and is suitable for IC wafer support rings and the like.

The phenolic resin used in the present invention is composed of phenols such as phenol and cresol, or phenols modified with molasses, lignin, xylene, naphthalene, petroleum aromatic hydrocarbons, etc., and formalin or paraformaldehyde in an appropriate molar ratio. Examples include a novolac type phenol resin condensate, a resol type phenol resin condensate, or a mixture of a resol type phenol resin condensate and a novolac type phenol resin composite, which are blended and reacted under a catalyst, and these may be used alone or in combination. The above mixture is used.
The form of the phenol resin used may be powder, viscous, varnish, or solid, and is not particularly limited.

Examples of the natural organic fibers used in the present invention include wood flour, cotton flock, α-cellulose, flax, hemp, jute, cotton woven fabric, and fluff powder, which may be used alone or in combination of two or more. The blending ratio of natural organic fibers is preferably 0.1 to 70% by weight based on the resin composition. More preferably, it is 2 to 60% by weight. The blending ratio is 0,
If it is less than 1% by weight, the mechanical strength (caulking strength) is extremely inferior to that of thermoplastic resins, metals, etc., and is therefore undesirable.

Moreover, if it exceeds 70% by weight, heat resistance and chemical resistance will deteriorate, which is not preferable.

The carbon used in the present invention may be in the form of fibers, powder, etc., and is not particularly limited. IIN-like materials include pitch-based carbonaceous carbon fibers, pitch-based graphite carbon fibers, PAN-based carbon fibers, etc., and powdery materials include graphite, carbon black, and the like. These carbons may be used alone or in a mixture of two or more.

The blending ratio of carbon is preferably 0.1 to 70% by weight, more preferably 1 to 60% by weight. If the blending ratio is less than 0.1% by weight, electrical insulation resistance cannot be reduced, and plating workability is poor, which is not preferable. Moreover, if it exceeds 70% by weight, the strength will be extremely reduced if it is in powder form, and the moldability and workability will be poor if it is in fibrous form, which is not preferable.

In addition to the above-mentioned components, the phenolic resin composition of the present invention may optionally contain additives such as a curing agent, a coloring agent, a curing enhancer, a flame retardant, a mold release agent, a lubricant, a coupling agent, and a plasticizer. can be blended.

In order to use the phenolic resin composition of the present invention as a molding material,
Manufactured by conventional methods. a predetermined amount of phenolic resin,
Natural organic fibers, carbon, hardening agents and other additives are added and mixed as necessary, and the mixture is uniformly dispersed, heated and kneaded using a mixer, then cooled and solidified, and then ground into appropriate sizes using a pulverizer. and use it as a phenolic resin molding material. The phenolic resin molding material thus produced is suitable for electronic parts, semiconductor-related parts, and especially IC wafer support rings. It can also be widely used in other electrical parts, automobile parts, etc.

[Examples of the Invention] Next, the present invention will be specifically explained with reference to Examples, but the present invention is not limited to these Examples. Hereinafter, "%" means "heavy ω%".

Example 1 38% novolak type phenolic resin, 40% PAN carbon fiber, 6% cotton flock, 6% hexamine, and 10% other additives were mixed uniformly, and then heated to 80 to 120°C.
After cross-cooling the mixture, it was pulverized to obtain a molding material.

Example 2 50% resol type phenolic resin, 25% cotton woven fabric, 5% Ketin black, and 20% other additives were uniformly mixed, mixed in the same manner as in Example 1, and treated in the same manner as in Example 1. A molding material was obtained.

Comparative example 1 Novolak type phenolic resin 45%, glass fiber 30%
, 7% hexamine and 17% other additives were treated in the same manner as in Example 1 to obtain a molding material.

The molding materials obtained in Examples 1 and 2 and Comparative Example 1 were heated to 170° C. by compression molding, and cured in a mold to obtain molded articles. The obtained molded product was tested for mechanical strength (caulking strength), heat resistance, chemical resistance, plating workability, cost, and specific gravity. A molded product identical to this molded product was made by aluminum die casting and used as Comparative Example 2, and its properties were tested in the same manner as the molded product described above. The results are shown in Table 1.

◎: Excellent O: Good Δ: Slightly poor ×: Poor [Effects of the invention] As is clear from the above explanation and Table 1, the phenol resin composition of the present invention has excellent It has excellent mechanical strength (crimping strength) and plating workability while maintaining its properties, and has a low specific gravity, making it economically useful and suitable for IC wafer support rings.

Claims (1)

[Claims] 1. Contains a phenolic resin, natural organic fibers and carbon, and contains 0.1 to 70% by weight of natural organic fibers and 0.1 to 70% by weight of carbon, respectively, based on the resin composition. A phenolic resin composition characterized by: 2. The phenolic resin composition according to claim 1, which is a molding material for semiconductor wafer support rings. 3. The phenolic resin composition according to claim 1 or 2, which is a molding material for a molded article that can be plated.