KR101838848B1 - Epoxy Resin Compositions for Bulk Mold Compound Dispersed Carbon Nano Tube - Google Patents

Abstract

The present invention relates to an epoxy resin composition for a bulk mold compound by dispersing a carbon nano tube in an epoxy resin and a hardening agent. The epoxy resin composition for a bulk mold compound in which a carbon nano tube is dispersed is used in a construction panel, an electrical and electronic component, an electronic product, a construction interior material, a reinforcing material and the like in a sheet type which enhances sticky features to be easily used at room temperature.

Description

TECHNICAL FIELD [0001] The present invention relates to an epoxy resin composition for a bulk mold compound in which carbon nanotubes are dispersed,

The present invention relates to an epoxy resin composition for a bulk mold compound in which carbon nanotubes are dispersed. More particularly, the present invention relates to a structural panel for dispersing carbon nanotubes in an epoxy resin and a curing agent to form an epoxy resin composition for a bulk mold compound, Is an epoxy resin composition for a bulk mold compound in which carbon nanotubes used as members in products, building interior materials, and stiffeners are dispersed.

The Bulk Mold Compound is a generally thickened form of unsaturated polyester resin and has a high viscosity of the compound. The bulk mold compound is aged in a predetermined bulk form, inserted into a mold, And is applied to production of small-sized products such as household electric parts, toys, electronic products and automobile articles by press molding by applying pressure.

     Bulk mold compounds based on unsaturated polyester resins are manufactured in bulk form, including inorganic fillers, glass fibers, curing agents, thickeners, and other additives, and can be molded into a thin plate with excellent moldability and a relatively low thickness , And it has been widely used in building materials such as ceiling materials, flooring materials, wall finishing materials, electric parts, and small parts of automobile interior and exterior materials because of its excellent workability.

     The mechanical and physical properties of such a bulk mold compound composition can be variously adjusted depending on the ratio of the base resin, additive, filler, glass fiber, and the like. Unsaturated polyester resins are used in the manufacture of composites because of their low viscosity, low bulk viscosity due to thickener at room temperature, film releasability, and handleability at room temperature. As a related art related to this, general matters concerning a bulk mold compound and a similar sheet mold compound using an unsaturated polyester resin are disclosed in Korean Registration No. 20-00426189 (flame retardant building interior material) and 10-20697868 (Bulk Mold Compound Composition), 10-0908074 (Unsaturated Polyester Bulk Molding Compound Containing New Ultraviolet Protection Agent), No. 10-2012-0121003 (Acrylic Artificial Marble BMC Top Recycled Bronze Dust , 10-1090084 (thermosetting multifunctional composite composition and its production method), and U.S. Patent Nos. 5,356,953 and 5,281,633.

     Bulk mold compound of unsaturated polyester resin which is most used in bulk mold compound is cheap and easy to manufacture, but it has a high content of filler because of its high content of filler, it is mixed through mixing process at room temperature, The dispersion time is long, the uniformity of the surface is relatively inadequate, the weight of the product is heavy due to the use of many fillers, and there are many limitations such as glossiness of the product surface and appearance of the final product.

     Particularly, the bulk mold compound using carbon fiber has problems of compatibility between the unsaturated polyester resin and the epoxy resin due to fiber interface and compatibility with the epoxy resin, which is mainly used as a surface sizing agent for carbon fibers, The carbon fiber bulk mold compound using the carbon fiber composite compound has not yet been manufactured.

In epoxy resin, which is widely used in carbon fiber composites, it is mainly used in prepreg and infusion molding methods, which are widely used as an intermediate material of carbon fiber composites. Bulk mold compounds using carbon fiber 로 are used for liquid viscosity and viscosity , It is not easy to work with bulk molding compounds at room temperature in a solid state. Furthermore, epoxy resin can not be structurally thickened, so it is difficult to select epoxy resin curing agent for compound. Unlike unsaturated polyester resin, it is difficult to increase the viscosity of resin by liquid thickening agent. Therefore, An epoxy resin composition suitable for the physical properties and molding conditions of the epoxy resin composition has not been developed and epoxy resin has not yet been put to practical use as a bulk mold compound.

Domestic Utility Model Registration 20-0426189 (September 04, 2006) Domestic patent registration 10-0697868 (March 14, 2007) Domestic patent registration 10-0908074 (2009. 7. 09.) Korean Published Patent Application No. 10-2012-0121003 (Nov. 05, 2012) Domestic patent registration 10-1090084 (November 30, 2011) U.S. Patent No. 5,356,953 (Oct. 18, 1994) U.S. Patent No. 5,281,633 (issued Jan. 25, 1994)

Disclosure of Invention Technical Problem [8] Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide a sheet form in which carbon nanotubes are dispersed in an epoxy resin to improve the tackiness of the epoxy resin at room temperature, It is an object of the present invention to provide an epoxy resin composition for a bulk mold compound in which carbon nanotubes are dispersed to form a member used as an accessory, an electronic product, a building interior material, and a reinforcing material.

(B) 65 to 110 parts by weight of a phenol novolak type epoxy resin having an epoxy equivalent weight of 170 to 190, (c) an epoxy equivalent weight of 400 to 400 parts by weight, D) 100 to 240 parts by weight of a solid bisphenol A epoxy resin having an epoxy equivalent of 900 to 1000, e) 100 to 240 parts by weight of a solid bisphenol A epoxy resin having an epoxy equivalent of 1750 to 2100, A) 200 to 220 parts by weight of a liquid bisphenol A epoxy resin having an epoxy equivalent of 184 to 190, b) 50 to 100 parts by weight of a carbon-based epoxy resin, 300 to 400 parts by weight of a nanotube-dispersed epoxy resin, c) 220 to 230 parts by weight of a liquid bisphenol F type epoxy resin having an epoxy equivalent of 160 to 180, d) 180 to 190 parts by weight of dicyandiamide, e) 3 to 8 parts by weight, f) 70 to 85 parts by weight of a curing accelerator, g) 15 to 40 parts by weight of a liquid release agent, : 25 to 35% by weight based on the total weight of the carbon nanotubes.

Means for solving the other specific problems according to the present invention are described in the detailed description of the invention.

The epoxy resin composition for a bulk mold compound in which carbon nanotubes are dispersed according to the present invention improves the viscosity, surface tacky, film releasability and glass transition temperature, thereby improving the interior and exterior materials for architectural interior and exterior materials, electric parts for household use, Is excellent in moldability due to the high-temperature press.

In addition, since it is possible to form thin plate with relatively thin thickness and easily disperse frictional heat generated during drilling, trimming, etc., it has excellent workability. Therefore, light weight and tensile strength of bulk mold compound sheet are improved, Can be used.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a photograph of a carbon nanotube dispersion image of a epoxy resin composition for a bulk mold compound in which carbon nanotubes are dispersed according to the present invention, and FIG.
2 is a photograph of a bulk molding compound sheet made of an epoxy resin composition for a bulk mold compound in which carbon nanotubes are dispersed according to the present invention.
FIG. 3 is a photograph of a surface resistivity of a bulk molding compound sheet made of an epoxy resin composition for a bulk mold compound in which carbon nanotubes are dispersed according to the present invention, which is a) a comparative example of Example 1 and b) .

The epoxy resin composition for a bulk mold compound in which carbon nanotubes are dispersed according to the present invention is characterized by comprising a main component and a curing agent.

     (B) 65 to 110 parts by weight of a phenol novolak epoxy resin having an epoxy equivalent weight of 170 to 190, (c) an epoxy equivalent of 400 to 500 parts by weight, D) 100-240 parts by weight of a solid bisphenol A type epoxy resin having an epoxy equivalent of 900-1000; e) 100-240 parts by weight of a solid bisphenol A epoxy resin having an epoxy equivalent of 1750 to 2100; 130 to 500 parts by weight of a resin, f) 50 to 75 parts by weight of a release agent,

     2) 200 to 220 parts by weight of a liquid bisphenol A epoxy resin having an epoxy equivalent of 184 to 190, b) 300 to 400 parts by weight of a carbon nanotube-dispersed epoxy resin 250 to 300, c) an epoxy equivalent of 160 D) from 180 to 190 parts by weight of dicyandiamide, e) from 3 to 8 parts by weight of 2-imidazole, f) from 70 to 85 parts by weight of a curing accelerator, g) And 15 to 40 parts by weight of a liquid release agent, wherein the subject and the curing agent are contained in an amount of 65 to 75% by weight: 25 to 35% by weight.

     Hereinafter, the subject and the curing agent will be described in detail.

 (1) Subject

  1) Carbon nanotube dispersion epoxy resin

     In order to improve the resin stability, thermal conductivity and electrical properties of the subject, epoxy resin with carbon nanotubes dispersed therein is used. YH-300 (epoxy equivalents 135 to 150, available from Kukdo Chemical Co., Ltd.), a trifunctional epoxy resin having a low viscosity, (Bundle length: 10 to 50 mu m, bundle length: 10 to 15 nm, diameter: 10 to 15 nm) as a multi-walled carbon nanotube (MCNT) at 98 wt% After dispersing, it was used by processing twice with a triple mill, which is a milling machine. If the amount of the carbon nanotubes is less than 250 parts by weight, the amount of the carbon nanotubes to be dispersed is decreased, and the thermal conductivity and electrical characteristics are lowered, and the viscosity of the epoxy resin in which the carbon nanotubes are dispersed becomes too high. And the hardening agent must be mixed at a high temperature, so that there is a high risk of hardening during mixing. When the amount exceeds 370 parts by weight, the thermal conductivity and electric characteristics are good, but the viscosity of the epoxy resin in which the carbon nanotubes are dispersed becomes too low, and the stickiness of the bulk mold compound becomes worse at room temperature after mixing the curing agent and the base.

  2) Phenol novolak type epoxy resin

    In order to improve the mechanical properties and heat resistance of the subject, a semi-hard phenolic novolak type epoxy resin having a low mechanical strength and a low melting point is used, and YDPN 638 (epoxy equivalents 170-190) of Kukdo Chemical Co., It is preferable to use it. If the amount is more than 110 parts by weight, the strength of the composite material may be improved but the elongation of the composite material may be low and the impact strength may be easily broken. When the amount is less than 65 parts by weight, the mechanical strength of the composite material tends to be weakened.

  3) Solid bisphenol A type epoxy resin

    As a bisphenol A type epoxy resin which is solid at room temperature, the epoxy equivalent is high and the melting temperature is different. The melting temperature is lower than 120 ° C according to the epoxy equivalence and the melting temperature. Examples thereof include YD-011 (epoxy equivalent YD-014 (epoxy equivalent: 900-1000), YD-017 (epoxy equivalent: 1750-2100). When the epoxy equivalent is 400-500, it is preferably 65-110 parts by weight, the epoxy equivalent of 900-1000 is 100-240 parts by weight, and the epoxy equivalent of 1750-2100 is 130-500 parts by weight.

  4) Releasing agent

     In the case of hot press molding, the releasing agent is mixed with the inside of the resin so as to prevent the mold from adhering to the mold due to the adhesive force of the epoxy resin and easily demold. Zinc stearate and calcium stearate, which are inorganic substances, can be exemplified. Among them, zinc stearate is preferably used. The amount of the zinc stearate used is 50 to 75 parts by weight, and the temperature of the epoxy resin is 80 Lt; 0 > C. If the amount is less than 50 parts by weight, the effect of sticking to the mold is small, and if the amount is more than 75 parts by weight, the mechanical properties of the composite material due to the release agent are weakened.

(2) Hardener

  1) Carbon nanotube dispersion epoxy resin

     Is the same as the carbon nanotube-dispersed epoxy resin used in the subject, and the amount thereof is preferably 300 to 400 parts by weight. If the amount is less than 300 parts by weight, the mixing ratio with the latent curing agent in the solid phase becomes small, and the mixing of the curing agent by stirring becomes difficult due to the high viscosity. In the case of the triple milling, it takes a long time to mill the curing agent, And the concentration of epoxy resin in which carbon nanotubes are dispersed is lowered, thereby lowering the thermal conductivity and electrical characteristics of the carbon nanotubes. On the other hand, if it exceeds 400 parts by weight, heat conduction and electric characteristics become good, and mixing dispersion and milling of the curing agent is good. However, when the curing agent is mixed with a subject due to too low viscosity, the stickiness at room temperature increases, It becomes difficult to use at room temperature.

  2) liquid bisphenol type epoxy resin

     Since dicyandiamide, which is a latent curing agent used as a curing agent for an epoxy resin for a bulk mold compound which is press-molded at a high temperature, is a white crystal, it is preferable to use it by dissolving or dispersing it. Bisphenol A type epoxy resin and bisphenol F type epoxy resin which are excellent in mechanical properties and are liquid at room temperature.

     Examples thereof include YD-128 (epoxy equivalent 184 to 190), bisphenol A type, and YDF-170 (epoxy equivalent 160 to 180), bisphenol F type. When the amount of the epoxy equivalent is 184-190, it is preferably 200-220 parts by weight and the epoxy equivalent of 160-180 is preferably 220-230 parts by weight.

  3) Dicyandiamide

     As the hardener, dicyandiamide may be Dyhard 100S, trade name of microcrystallized product of Alz chem. As a latent curing agent, dicyandiamide is dissolved in a bisphenol A type epoxy resin to be cured, and it is prepared as a liquid curing agent so that a bulk mold compound epoxy resin composition can be used as a bulk mold compound.

     Dicyandiamide may be used in a solid phase at room temperature at a particle size of 1 to 20 mu m and may be dissolved in dimethylformamide (DMF) as a solvent. However, since a solvent can not be used in the production of a bulk mold compound, dicyandiamide is dissolved in liquid phase Bisphenol A type epoxy resin (National Chemical Industries YD-128, epoxy equivalent 184 to 194) and bisphenol F type epoxy resin (KODO CHEMICAL YDF-170 epoxy equivalent 160 to 180) were mixed and dispersed and processed twice with a triple mill as a milling machine Respectively.

     The amount of dicyandiamide is from 180 to 190 parts by weight. If the amount is less than 180 parts by weight, the curing reaction is not completed, and the glass transition temperature of the epoxy resin composition is lowered, resulting in a delay in curing and deterioration of the physical properties of the composite material. When the amount exceeds 190 parts by weight, The reaction dicyandiamide may remain to deteriorate the mechanical properties of the epoxy resin composition.

  4) Dichlorophenyldimethylurea (DCMU)

    3- (3,4-dichlorophenyl) -1,1-dimethylurea (DCMU) is used as a curing accelerator, specifically UR-200 (CAS NO 330-54-1) by Dyhard Urones of Alz chem. If the amount is less than 70 parts by weight, the curing accelerating effect of the latent curing agent is lowered and the curing time is prolonged. If the amount is more than 85 parts by weight, the curing time of the curing agent is accelerated. However, The stability is lowered, and the risk of gelation increases during long-term storage.

  5) Imidazole

     Dichlorophenyldimethylurea (DCMU) promoter is excellent in accelerating the high temperature, but it takes a long time to disperse as a solid phase. In the case of using imidazole in combination with liquid imidazole as an auxiliary promoter, the curing time of the resin is shortened, In order to accelerate the curing of the composite material, the liquid imidazole may be additionally used because the promoting effect is excellent.

    If the amount is less than 3 parts by weight, the promoting effect is not significantly different from the use of only dichlorophenyldimethylurea (DCMU). If the amount is more than 8 parts by weight, the accelerating effect becomes too fast, When stored at room temperature, the stability of the accelerator is lowered, which increases the risk of resin gelation.

  6) The liquid phase brothers

    Liquid phase This brothers selected G-172, a product of German Technical Advanced Group, which is capable of post-processing such as epoxy molding and painting without post-treatment. If the amount is less than 15 parts by weight, the mold release is difficult due to insufficient high temperature demolding. If the amount is more than 40 parts by weight, physical properties of the composite material due to excessive release agent may be weakened.

≪ Preparation Example 1 > Preparation of a base and a curing agent

Manufacture of 1-1 subject

    First, the cleanliness of the reactor, the state of the valve, the cooling water of the condenser and the nitrogen in the reactor four-necked flask were checked. 94.6 g of a phenol novolac epoxy resin (epoxy resin YDPN-638) having an epoxy equivalent of 170-190 was added to 350.2 g of a carbon nanotube-dispersed epoxy resin while nitrogen was added to the reactor, and the epoxy equivalent was 470 151.4 g of a solid bisphenol A type epoxy resin (KODO CHEMICAL YD-011) and 236.6 g of a solid bisphenol A type epoxy resin having an epoxy equivalent of 950 (KODO CHEMICAL YD-014). After confirming the molten state of these epoxy resins, 132.5 g of a solid bisphenol A type epoxy resin (epoxy resin YD-017) having an epoxy equivalent of 1925 and 65.5 g of zinc stearate (Zn-St) .

1-2 Preparation of Curing Agent

    In a stirrer capable of mixing resin, 216.67 g of liquid bisphenol A epoxy resin (KODO CHEMICAL YD-128) having an epoxy equivalent of 187 and 216.67 g of a bisphenol F epoxy epoxy resin having an epoxy equivalent of 170 were added to 300.88 g of a carbon nanotube- 222.39 g of Resin (National Chemical Industries YDF-170), 189.69 g of dicyandiamide, 81.29 g of DCMU, 3.33 g of 2-imidazole and 16.67 g of liquid phase broth were mixed and put into a three- Followed by dispersion twice to prepare a curing agent

     An epoxy resin composition for a bulk mold compound in which carbon nanotubes are dispersed can be prepared using the above-mentioned subject matter and a curing agent. The proportion of the epoxy resin composition is preferably 68 to 75% by weight: 25 to 35% by weight .

[Example 1] Preparation of epoxy resin composition for bulk mold compound in which carbon nanotubes were dispersed

   709 g of the subject prepared in Preparation Example 1-1 was heated to 80 ° C and 321 g of the curing agent prepared in Preparation Example 1-2 was mixed in a stirrer with care that the temperature did not exceed 80 ° C and stirred for 10 minutes The epoxy resin composition was prepared by dispersing carbon nanotubes for bulk mold compound.

[Examples 2 to 5]

   As compared with Example 1, an epoxy resin composition was prepared in which carbon nanotubes for bulk mold compound were dispersed in the same manner as in [Table 1], except that the amounts of the base, the curing agent and the raw materials were slightly different.

[Comparative Example]

     Compared with Example 1, the epoxy resin composition for a bulk mold compound was prepared in the same manner as in [Table 1] except that the amount of the raw material of the base and the curing agent was slightly changed without using the carbon nanotube-dispersed epoxy resin. .

[Manufacturing Example 2] Bulk mold compound, sheet manufacture

     27.5% by weight of an epoxy resin in which carbon nanotubes were dispersed, 12.5% by weight of a resin curing agent in which carbon nanotubes were dispersed, 40% by weight of an epoxy resin mixed with a curing agent and a filler 10 And stirring the mixture at 80 占 폚 for 30 minutes; mixing the carbon fiber 촙 with 50 wt% of the carbon fiber 촙 and stirring the mixture for 20 minutes while maintaining the temperature at 80 占 폚 to prepare a carbon fiber epoxy resin bulk mold compound having carbon nanotubes dispersed therein .

     The prepared bulk mold compound was put into a double compression roller having a temperature of 80 ° C in order to make the sheet condition easy to use, and repeatedly compressed to a constant thickness to produce a uniform thickness sheet. The bulk mold compound sheet had a room temperature stability and an epoxy resin And stored at -5 ° C or below in a refrigerator for curing stability.

     Bulk mold compound sheets were pressed in a press of 500 ton or more and pressed at a vacuum pressure of 760 mmHg and a temperature of 135 to 145 ° C for 15 to 20 minutes. Mechanical strength and electrical properties were measured. The results are shown in Table 1.

<Test Method>

   The epoxy resin compositions for the bulk mold compound obtained in Examples 1 to 5 and Comparative Examples and the bulk mold compound sheet prepared therefrom were subjected to various tests as follows, Respectively.

1) Viscosity

   The viscosity of the epoxy resin composition for a bulk mold compound in which carbon nanotubes were dispersed at 80 캜 was measured using a block field viscometer (LVF type # 4, 60 RPM for low viscosity). At this time, when the viscosity exceeds 100Poise, the mixing time for impregnating the fiber during the manufacture of the bulk mold compound becomes longer, and the fiber is likely to gel during impregnation.

2) Surface Tacky

   3: Normal, 1: Bad, 0: Good, 3: Normal, 1: Bad, and 0: - indicates no Tacky.

3) Film Release

   The epoxy resin composition for a bulk mold compound in which carbon nanotubes were dispersed in a 200 탆 thick release paper was coated and then a releasing film for a bulk molding compound was adhered to measure the degree of desorption. The results were 5: good, 3: : Bad, 0: No Tacky.

4) Glass transition temperature

   The glass transition temperature of the epoxy resin composition for a bulk mold compound in which carbon nanotubes are dispersed was measured by differential scanning calorimetry.

5) Tensile strength

   Specimens were prepared from bulk mold compound sheets and cured in an oven capable of temperature control and vacuum in accordance with ASTM D3039-95 at a molding temperature of 80 ° C for 30 minutes and at 135 ° C for 90 minutes.

6) Surface resistance

  After preparing specimens with a bulk mold compound sheet, surface resistance was measured with a 4-point probe surface resistance meter (low resistivity meter, Mitsubishi Chemical Corporation).

The composition of various kinds of thematic and hardening agents and their experimental results Product Name equivalent weight Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example week
My YDPN638 180 94.6 95.0 69.6 108.9 109.1 167.4 YD-011 470 151.4 148.9 50.5 157.5 158.2 655.5 YD-014 950 236.6 209.0 102.1 186.8 294.2 139.5 YD-CNT248 248 350.2 363.6 258.5 364.3 249.0 - YD-017 1925 132.5 141.1 491.0 137.8 150.5 - Zn-St 65.5 73.3 59.1 75.6 70.0 68.5 sub Total 1,030.9 1,030.9 1,030.9 1,030.9 1,030.9 1,030.9 circa
anger
My YD-128 187 216.7 216.7 216.7 107.1 221.0 485.5 YDF-170 170 222.4 222.4 222.4 216.3 219.1 327.5 YD-CNT248 248 300.9 300.9 300.9 394.4 350.0 - DICY 21 189.7 189.7 189.7 188.4 191.5 197.4 DCMU 233 81.3 81.3 81.3 67.5 65.0 7.8 2-IM 3.3 3.3 3.3 9.5 3.5 12.7 Liquid is brother 16.7 16.7 16.7 47.7 19.2 - sub Total 1,030.9 1,030.9 1,030.9 1,030.9 1,030.9 1,030.9 For compound
Epoxy resin subject 709 703 959 681 851 714 Hardener 321 321 321 324 280 342 Viscosity (80 ℃, poise) 80 90 88 95 101 75 Surface Tacky 5 5 5 4 4 3 Film release 5 5 5 5 4 4 DSC Tg (占 폚) 130 125 132 130 131 120 Tensile Strength (Mpa) 220 225 215 213 209 200 Surface resistance (Ω / ㎠) 9.23 ×
10e ^-2 3.67 x
10e ^-2 2.52 x
10e ^-2 1.34 x
10e ^-1 1.48 x
10e ^-1 5.60 x
10e ⁵

 * YD-CNT248: Carbon nanotube dispersion epoxy resin

(Analysis of Test Results)

     The epoxy resin composition of the comparative example had a too low viscosity of 75 Poise at 80 DEG C, so that a high temperature was required at the time of bulk molding compound fiber impregnation, so that the risk of curing by high temperature was high. However, the bulk mold compound epoxy resin compositions of Examples 1 to 3, which are suitable numerical limit ranges according to the present invention, have a resin viscosity of 80-88 Poise at 80 DEG C, which is higher than that of Examples 4, 5 and Comparative Examples. Because the risk of hardening was low during the pounding, the viscosity was maintained at a suitable level for compounding, and the surface tacky, film releasability and glass transition temperature were all excellent. Also, the bulk molded compound sheet produced therefrom exhibited excellent mechanical properties such as tensile strength, electrical properties, and low electrical resistance and electrical conductivity.

     Therefore, the bulk mold compound epoxy resin composition according to the present invention can impregnate the impregnation method, which was possible only in a liquid state at room temperature, even at a high temperature and can improve the solid state at room temperature, which is a problem of conventional bulk mold compound manufacturing, there was.

It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are not to be construed as limiting of the invention, It is obvious that all of the examples are included in the technical idea of the present invention.

Claims (6)

(B) 65 to 110 parts by weight of a phenol novolak type epoxy resin having an epoxy equivalent weight of 170 to 190, (c) 50 to 110 parts by weight of an epoxy equivalent weight of 400 to 500, D) from 100 to 240 parts by weight of a solid bisphenol A type epoxy resin having an epoxy equivalent of 900 to 1000, e) a solid bisphenol A type epoxy resin having an epoxy equivalent of 1750 to 2100, 130 to 500 parts by weight, f) 50 to 75 parts by weight of a release agent,
2) 200 to 220 parts by weight of a liquid bisphenol A type epoxy resin having an epoxy equivalent of 184 to 190, b) 300 to 400 parts by weight of a carbon nanotube-dispersed epoxy resin, c) an epoxy equivalent of 160 to 180 D) from 180 to 190 parts by weight of dicyandiamide, e) from 3 to 8 parts by weight of 2-imidazole, f) 70 to 85 parts by weight of a curing accelerator, g) 15 to 40 parts by weight,
The epoxy resin composition for a bulk mold compound having carbon nanotubes dispersed therein, wherein the subject and the curing agent are contained in an amount of 65 to 75 wt%: 25 to 35 wt%.
The method according to claim 1,
The carbon nanotube-dispersed epoxy resin as a component of the above-mentioned subject matter and the curing agent is characterized in that 2 wt% of multi-walled carbon nanotubes is dispersed in 98 wt% of a trifunctional epoxy resin, and the epoxy for a bulk mold compound Resin composition.
3. The method of claim 2,
Wherein the trifunctional epoxy resin has an epoxy equivalent of 135 to 150 and a viscosity of 100 to 300 cps. The epoxy resin composition for a bulk mold compound in which carbon nanotubes are dispersed.
3. The method of claim 2,
Wherein the multi-walled carbon nanotubes have a bundle diameter of 3 to 15 mu m, a bundle length of 10 to 50 mu m, and a diameter of 10 to 15 nm.
The method according to claim 3 or 4,
Wherein the release agent is zinc stearate. The epoxy resin composition for a bulk mold compound in which carbon nanotubes are dispersed is characterized in that the release agent is zinc stearate.
The method according to claim 3 or 4,
Wherein the curing accelerator is 3- (3,4-dichlorophenyl) -1,1-dimethylurea (DCMU). The epoxy resin composition for a bulk mold compound in which carbon nanotubes are dispersed.

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