JPS61285701A - Formation of thick film resistor - Google Patents
Formation of thick film resistorInfo
- Publication number
- JPS61285701A JPS61285701A JP60129050A JP12905085A JPS61285701A JP S61285701 A JPS61285701 A JP S61285701A JP 60129050 A JP60129050 A JP 60129050A JP 12905085 A JP12905085 A JP 12905085A JP S61285701 A JPS61285701 A JP S61285701A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- film resistor
- electrodes
- forming
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概要〕
印刷配線基板上に形成した電極間に厚膜抵抗体を形成す
る方法であって、電極と印刷配線基板との段差をなくし
て、再現性の高い抵抗体を形成するために、電極間に絶
縁層を形成したものである。[Detailed Description of the Invention] [Summary] A method for forming a thick film resistor between electrodes formed on a printed wiring board, which eliminates the level difference between the electrode and the printed wiring board, and provides a resistor with high reproducibility. An insulating layer is formed between the electrodes to form an electrode.
本発明は、印刷配線基板上に形成した電極間に厚膜抵抗
体を形成する方法に係り、とくに電極間に印刷する抵抗
体ペーストを容易かつ安定に印刷が行なえるようにした
厚膜抵抗体の形成方法に関する。The present invention relates to a method for forming a thick film resistor between electrodes formed on a printed wiring board, and in particular, a thick film resistor that allows easy and stable printing of a resistor paste to be printed between electrodes. The present invention relates to a method of forming.
近年、電子機器はユニット化され実装される電子部品た
とえば抵抗、コンデンサ、インダクタンス等は印刷配線
基板に形成された電極間に印刷形成されることが多い。In recent years, electronic devices are often unitized and mounted electronic components such as resistors, capacitors, inductances, etc. are printed between electrodes formed on printed wiring boards.
ところが電極間にたとえば抵抗等を形成する場合、電極
間に抵抗体ペーストを印刷により形成するのであるが、
電極の端部と印刷配線基板とに段差があるので、印刷す
る抵抗体ペーストの量が少ない場合は段差部において欠
は部ができ、抵抗体ペーストの量が多い併設差部におい
てはみ出し、安定した抵抗値が得られないので、印刷が
容易で安定した抵抗値の得られる厚膜抵抗体の形成方法
の開発が強く要望されている。However, when forming, for example, a resistor between electrodes, a resistor paste is formed between the electrodes by printing.
Since there is a step between the end of the electrode and the printed wiring board, if the amount of resistor paste to be printed is small, a chipping will occur at the step, and if there is a large amount of resistor paste, it will protrude, resulting in a stable Since resistance values cannot be obtained, there is a strong demand for the development of a method for forming thick film resistors that is easy to print and provides stable resistance values.
第２図は、従来の厚膜抵抗体の形成方法を説明する図で
、同図（ａｌは抵抗体ペーストの少ない場合の平面図、
（ｂ）は抵抗体ペーストの多い場合の平面図、（Ｃ）は
側断面図である。FIG. 2 is a diagram explaining the conventional method of forming a thick film resistor.
(b) is a plan view when there is a large amount of resistor paste, and (C) is a side sectional view.
図において、印刷配線基板１上に形成された導体からな
る電極２間に厚膜抵抗体３を形成するときに、抵抗体ペ
ースト（たとえば酸化ルテニウム等）を印刷するのであ
るが、ペーストの量が少ないと、第２図（ａ）に示す如
く対となる電極２の端部に欠は部３１ができ、反対に抵
抗体ペーストの量が多いと第２図山）の如く、電極２の
端部においてはみ出し部３２ができる。In the figure, when forming a thick film resistor 3 between electrodes 2 made of conductors formed on a printed wiring board 1, a resistor paste (for example, ruthenium oxide, etc.) is printed, but the amount of paste is If the amount of resistor paste is too small, a notch 31 will be formed at the end of the pair of electrodes 2 as shown in FIG. A protruding portion 32 is formed at the portion.
上記従来の厚膜抵抗体の形成方法は、印刷配線基板上に
電極パターンを印刷等により浮き出して形成する関係上
、電極と印刷配線基板とに段差のできることは避けられ
ない。そしてこの段差のある状態で抵抗体ペーストを印
刷すると、電極の端部すなわち段差部において、印刷す
る抵抗体ペーストの量の多少により、欠は部、みはだし
部ができ、安定した抵抗値が得られず作業も困難である
という問題点があった。In the conventional method for forming a thick film resistor described above, since the electrode pattern is formed on the printed wiring board by printing or the like in an embossed manner, it is inevitable that there will be a step between the electrode and the printed wiring board. If you print resistor paste with this level difference, depending on the amount of resistor paste printed at the end of the electrode, that is, the level difference, there will be gaps or protrusions, resulting in a stable resistance value. There were problems in that it was difficult to obtain and work was difficult.
本発明は、上記の問題点を解決して作業が容易で安定し
た抵抗値が得られる厚膜抵抗体の形成方法を提供するも
のである。The present invention solves the above-mentioned problems and provides a method for forming a thick film resistor that is easy to work with and provides a stable resistance value.
すなわち、印刷配線基板１上に形成した電極２間に厚膜
抵抗体３を形成する方法を、この電極２間にこの電極２
とほぼ同じ厚さの絶縁層４を形成したるのち、この絶縁
層４を形成した電極２間に厚膜抵抗体３を印刷するよう
にしたことによって解決される。That is, the method of forming the thick film resistor 3 between the electrodes 2 formed on the printed wiring board 1 is performed by
This problem can be solved by forming an insulating layer 4 of approximately the same thickness as , and then printing a thick film resistor 3 between the electrodes 2 on which this insulating layer 4 is formed.
上記厚膜抵抗体の形成方法は、対となる電極２間にほぼ
同じ厚さの絶縁層４を形成して、電極２と印刷配線基板
１との段差を無くしたものであるから、抵抗体ペースト
の印刷が容易で、しかも安定な抵抗値が得られる。The method for forming the thick film resistor described above is to form an insulating layer 4 of approximately the same thickness between the pair of electrodes 2 to eliminate the level difference between the electrode 2 and the printed wiring board 1. The paste can be easily printed and a stable resistance value can be obtained.
第１図は、本発明の一実施例を説明する図で、同図（ａ
）は平面図、（ｂ）は側断面図で、第２図と同等の部分
については同一符合を付している。FIG. 1 is a diagram illustrating an embodiment of the present invention.
) is a plan view, and (b) is a side sectional view, in which parts equivalent to those in FIG. 2 are given the same reference numerals.
図において、印刷配線基板１上に形成された導体からな
る電極２間と、その周辺にガラス等からなる絶縁層４を
電極２とほぼ同じ厚さに形成した状態で、対となる電極
２間に抵抗体ペースト（たとえば酸化ルテニウム等）を
印刷して厚膜抵抗体３を形成する。すなわち絶縁層４を
形成する電極間に段差が殆どないので作業が容易な構造
である。In the figure, between electrodes 2 made of a conductor formed on a printed wiring board 1, and with an insulating layer 4 made of glass or the like formed around the electrodes 2 to have almost the same thickness as the electrodes 2, and between the pair of electrodes 2. The thick film resistor 3 is formed by printing a resistor paste (for example, ruthenium oxide, etc.) on the substrate. In other words, since there are almost no steps between the electrodes forming the insulating layer 4, the structure is easy to work with.
なお、本実施例では厚膜抵抗体３について説明したが、
厚膜抵抗体に限らずコンデンサ、インダクタンスその他
にも適用が可能である。In addition, although the thick film resistor 3 was explained in this embodiment,
It can be applied not only to thick film resistors but also to capacitors, inductances, and others.
以上の説明から明らかなように、本発明によれば抵抗体
ペーストの印刷が容易に行なえ、安定した抵抗値の厚膜
抵抗体が形成でき、信頼性の向上に極めて有効である。As is clear from the above description, according to the present invention, a resistor paste can be easily printed, a thick film resistor with a stable resistance value can be formed, and it is extremely effective in improving reliability.
第１図は、本発明の一実施例を説明する図で、同図（ａ
）は平面図、（ｂ）は側断面図、第２図は、従来の厚膜
抵抗体の形成方法を説明する図で、同図（ａ）は抵抗体
ペーストの少ない場合の平面図、（ｂ）は抵抗体ペース
トの多い場合の平面図、（Ｃ）は側断面図である。
図において、１は印刷配線基板、２は電極、３は厚膜抵
抗体、４は絶縁層、３１は欠は部、３２ははみ出し部、
をそれぞれ示す。
平面図
（Ｑ）
イｑゴ２力２朗εｚ■
（ｂ）
序亮明め厚績瓢α鐸１隅才及
第 １ 図
ｊｅｔＬｎ へ°−２１−７／ｌ・−ｊ＃ｆ！１（Ｑ）
爪工た不Ｆ＜−ストのつ・・平ａｍ
（ｂ＋
剣畔り図
（Ｃ）
化粕寥質尼誂坪４がＵ罎
＠２ＲFIG. 1 is a diagram illustrating an embodiment of the present invention.
) is a plan view, (b) is a side sectional view, FIG. (b) is a plan view when there is a large amount of resistor paste, and (C) is a side sectional view. In the figure, 1 is a printed wiring board, 2 is an electrode, 3 is a thick film resistor, 4 is an insulating layer, 31 is a cutout, 32 is a protrusion,
are shown respectively. Plan view (Q) Iqgo2power2roεz■ (b) Preparation and lightening of the atmosphere. 1 (Q) Nail work F<-St.. flat am (b+ Sword ridge map (C) Convertible porridge 4 is U conversion @ 2R
Claims (1)
抵抗体（３）を形成する方法であって、 前記電極（２）間に該電極（２）と同厚の絶縁層（４）
を形成したるのち、 該絶縁層（４）を形成した電極（２）間に厚膜抵抗体（
３）を印刷するようにしたことを特徴とする厚膜抵抗体
の形成方法。[Claims] A method for forming a thick film resistor (3) between electrodes (2) formed on a printed wiring board (1), comprising: forming a thick film resistor (3) between the electrodes (2); Insulating layer of the same thickness (4)
After forming the insulating layer (4), a thick film resistor (
3) A method for forming a thick film resistor, characterized by printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60129050A JPS61285701A (en) | 1985-06-12 | 1985-06-12 | Formation of thick film resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60129050A JPS61285701A (en) | 1985-06-12 | 1985-06-12 | Formation of thick film resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61285701A true JPS61285701A (en) | 1986-12-16 |
Family
ID=14999844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60129050A Pending JPS61285701A (en) | 1985-06-12 | 1985-06-12 | Formation of thick film resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61285701A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006108163A (en) * | 2004-09-30 | 2006-04-20 | Toppan Printing Co Ltd | Printed wiring board |
-
1985
- 1985-06-12 JP JP60129050A patent/JPS61285701A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006108163A (en) * | 2004-09-30 | 2006-04-20 | Toppan Printing Co Ltd | Printed wiring board |
| JP4639733B2 (en) * | 2004-09-30 | 2011-02-23 | 凸版印刷株式会社 | Method for manufacturing printed wiring board |
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