JPS58447U - Thick film hybrid integrated circuit - Google Patents

Thick film hybrid integrated circuit

Info

Publication number
JPS58447U
JPS58447U JP9220281U JP9220281U JPS58447U JP S58447 U JPS58447 U JP S58447U JP 9220281 U JP9220281 U JP 9220281U JP 9220281 U JP9220281 U JP 9220281U JP S58447 U JPS58447 U JP S58447U
Authority
JP
Japan
Prior art keywords
thick film
integrated circuit
hybrid integrated
film hybrid
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9220281U
Other languages
Japanese (ja)
Inventor
浩 大津
小林 喬雄
小野 公一
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP9220281U priority Critical patent/JPS58447U/en
Publication of JPS58447U publication Critical patent/JPS58447U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

! 第1図、第3図は従来技術による厚膜コンデンサを
示す平面図、第2図は第1図のA−A断面図、第4図は
本考案の一実施例を示す厚膜コンデンサの平面図、第5
図は本考案の厚膜コンデンサをサンプラスト法により調
整する調整方法を示す平面図、第6図は本考案の厚膜コ
ンデンサをレーザにより調整する調整方法を示す平面図
である。 1・・・セラミック基板、5・・・電極、6・・・抵抗
体。
! 1 and 3 are plan views showing thick film capacitors according to the prior art, FIG. 2 is a sectional view taken along line A-A in FIG. 1, and FIG. 4 is a plan view of a thick film capacitor showing an embodiment of the present invention. Figure, 5th
FIG. 6 is a plan view showing a method of adjusting the thick film capacitor of the present invention using the Sunplast method, and FIG. 6 is a plan view showing a method of adjusting the thick film capacitor of the present invention using a laser. 1... Ceramic substrate, 5... Electrode, 6... Resistor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板と、この基板上に設けられた対向せる一対の導体路
と、この導体路同志が接続されるように設けられた抵抗
体をレーザ切断して形成した対向せる一対の電極よりな
ることを特徴とする厚膜混成集積回路。
It is characterized by consisting of a substrate, a pair of opposing conductor paths provided on the substrate, and a pair of opposing electrodes formed by laser cutting a resistor provided so that the conductor paths are connected to each other. Thick film hybrid integrated circuit.
JP9220281U 1981-06-24 1981-06-24 Thick film hybrid integrated circuit Pending JPS58447U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9220281U JPS58447U (en) 1981-06-24 1981-06-24 Thick film hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9220281U JPS58447U (en) 1981-06-24 1981-06-24 Thick film hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS58447U true JPS58447U (en) 1983-01-05

Family

ID=29887243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9220281U Pending JPS58447U (en) 1981-06-24 1981-06-24 Thick film hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS58447U (en)

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