JPS61284648A - Defect detecting method - Google Patents
Defect detecting methodInfo
- Publication number
- JPS61284648A JPS61284648A JP12730685A JP12730685A JPS61284648A JP S61284648 A JPS61284648 A JP S61284648A JP 12730685 A JP12730685 A JP 12730685A JP 12730685 A JP12730685 A JP 12730685A JP S61284648 A JPS61284648 A JP S61284648A
- Authority
- JP
- Japan
- Prior art keywords
- light
- sheet
- inspected
- angle
- scanner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、合成樹脂板等に含まれる欠陥、特に表面のキ
ズ、内部の泡、異物等の欠陥を検出する方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for detecting defects contained in synthetic resin plates and the like, particularly defects such as surface scratches, internal bubbles, and foreign objects.
本発明は、合成樹脂板等の被検査材の側面から照明し、
欠陥部により被検査材の外部へ透過した光をセンサで検
出することにより、被検査材の内部にある欠陥と表面に
付着した異物とが同程度の大きさであっても、その区別
を可能にしたものである。The present invention illuminates a material to be inspected such as a synthetic resin board from the side,
By using a sensor to detect the light transmitted to the outside of the inspected material by the defective part, it is possible to distinguish between defects inside the inspected material and foreign objects attached to the surface, even if they are of the same size. This is what I did.
金属、フィルムなど連続的に製造されるシート状物に含
まれるキズ、異物付着等の欠陥を検出する装置として、
例えば、次のものが発表されている。As a device that detects defects such as scratches and foreign matter adhesion in continuously manufactured sheet materials such as metals and films.
For example, the following have been announced:
(1)、特開昭58−10844Or塩化ビニール系樹
脂の品質検査法および装置」
被検査材をフィルム状に連続押出成型し、He −Ne
ガスレーザー光スキャンニング方式検出器で異物、フィ
ッシュアイを検出する。(1), JP-A-58-10844 Or, Quality Inspection Method and Apparatus for Vinyl Chloride Resin” The material to be inspected is continuously extruded into a film, and He-Ne
Foreign objects and fish eyes are detected using a gas laser optical scanning detector.
(2)、特開昭58−173456 r異物°自動検査
装置」
被検査材をシート状にし、このシートの透過光をイメー
ジセンサカメラで受光し、これを2値化画像として、異
物の粒径、面積、個数などを求める。(2), Japanese Unexamined Patent Publication No. 58-173456 ``Automatic Inspection Device for Foreign Matter'' The material to be inspected is formed into a sheet, the transmitted light of this sheet is received by an image sensor camera, and this is converted into a binary image to determine the particle size of the foreign object. Find the area, number, etc.
上述した従来の方法は、何れも透過光又は反射光で得ら
れたセンサの画像信号を2値化することにより、欠陥の
有無を検出するものである。従って微細な欠陥を検出し
ようとすると、表面に付着したホコリまでも欠陥として
検出してしまうという問題があった。In all of the conventional methods described above, the presence or absence of a defect is detected by binarizing the image signal of the sensor obtained by transmitted light or reflected light. Therefore, when attempting to detect minute defects, there is a problem in that even dust attached to the surface is detected as a defect.
本発明においては、被検査材に光を入射して、その内部
で全反射させるように成し、この際、欠陥によって全反
射されることなく外部に透過した光を検出するようにし
ている。In the present invention, light is incident on the material to be inspected and is totally reflected inside the material, and at this time, the light that is transmitted to the outside without being totally reflected due to a defect is detected.
被検査材の表面に付着した異物と、キズや内部の欠陥と
を明確に区別して検出を行うことができる。It is possible to clearly distinguish between foreign substances attached to the surface of the inspected material and scratches and internal defects.
第1図において、光学的歪を検査される合成樹脂シート
1は製造時に矢印a方向に移動している。In FIG. 1, a synthetic resin sheet 1 to be inspected for optical distortion is being moved in the direction of arrow a during manufacture.
このシート1の側方には照明装置2が設けられている。A lighting device 2 is provided on the side of the sheet 1.
シート1の上方には、例えば2048素子のCCDから
成るラインスキャナ3が、その走査方向すがa方向と直
交するようにして設けられている。Above the sheet 1, a line scanner 3 consisting of, for example, a 2048-element CCD is provided with its scanning direction perpendicular to the direction a.
上記照明装置2は、ケース4の中に設けられた光源4か
らの光が長さdを有するスリット5.6を通じてシート
lの側面に照射されるように構成されている。スリット
5.6間の長さlと上記dとは、θ” jan−’−の
関係に定められている。こによって、スリット6からの
光がシート1の側面に対してθの入射角を以って照射さ
れるように成されている。The illumination device 2 is configured such that light from a light source 4 provided in a case 4 is irradiated onto the side surface of the sheet l through a slit 5.6 having a length d. The length l between the slits 5 and 6 and the above-mentioned d are set in the relationship θ''jan-'-.Thereby, the light from the slit 6 has an incident angle of θ with respect to the side surface of the sheet 1. It is configured such that the light is irradiated in this manner.
第2垂直A、B、Cは本発明による欠陥検出方法の原理
を説明するための図である。Second vertical lines A, B, and C are diagrams for explaining the principle of the defect detection method according to the present invention.
同図Aはシート1にキズ、異物等が無い場合を示す。Figure A shows a case where the sheet 1 has no scratches, foreign matter, etc.
同図Aにおいて、シート1の側面1aから入射される光
り、は
e ≦5in−’(!コ)
但し、n、:シート1の屈折率
nb :シート1の外部の屈折率
で表わされる入射角θを以ってシート1内部に入射され
る。この内部を通過する光Lpはスネルの法則に従って
θ1で屈折され、次いでn、 sinθ雪=nbsi
n θ3 (θ3≧90°)の関係を以って、シート1
の外部に光が漏れることなく全反射を繰り返しながら進
む。そして最終的にシート1の反対側の側面1bから透
過光L0として出力される。In the same figure A, the light incident from the side surface 1a of the sheet 1 is e ≦5in-' (!ko), where n: the refractive index of the sheet 1 nb: the angle of incidence expressed by the refractive index of the outside of the sheet 1 The light is incident on the inside of the sheet 1 with an angle θ. The light Lp passing through this interior is refracted at θ1 according to Snell's law, and then n, sinθ snow=nbsi
With the relationship n θ3 (θ3≧90°), sheet 1
The light travels through repeated total reflection without leaking to the outside. The light is finally output from the opposite side surface 1b of the sheet 1 as transmitted light L0.
従って、シート1の上記側面1aと略垂直を成す側面1
cからは透過光L0は得られず、このときスキャナ3の
出力は略ゼロとなっている。Therefore, the side surface 1 that is substantially perpendicular to the side surface 1a of the sheet 1
The transmitted light L0 is not obtained from c, and the output of the scanner 3 is approximately zero at this time.
次に同図Bのように、上記側面1cにキズ7が存在する
場合は、光1.pはこのキズの面に対してθ4で入射さ
れ、θ、で透過するので、透過光L0がスキャナ3の何
れかの素子で検出される。Next, as shown in Figure B, if there is a scratch 7 on the side surface 1c, the light 1. Since light p is incident on this scratched surface at an angle of θ4 and is transmitted at an angle of θ, the transmitted light L0 is detected by any element of the scanner 3.
第1図において、スキャナ3から得られる映像信号は信
号処理回路8へ加えられ、この信号処理回路8では、上
記映像信号から欠陥の有無を検出し、欠陥があれば警報
器9へ出力する。同図Cはシート1の内部に泡10が存
在する場合を示す。In FIG. 1, a video signal obtained from a scanner 3 is applied to a signal processing circuit 8, which detects the presence or absence of a defect from the video signal and outputs it to an alarm 9 if a defect is found. FIG. 1C shows a case where bubbles 10 are present inside the sheet 1.
この場合は泡10の部分で全反射が行われないので、透
過光L0が側面1cから出力されてスキャナ3で検出さ
れる。尚、シート1の内部に異物が存在する場合も、こ
の異物により全反射が行われなくなるので、透過光L0
がスキャナ3により検出される。In this case, since total reflection does not occur at the bubble 10, the transmitted light L0 is output from the side surface 1c and detected by the scanner 3. Note that even if there is a foreign object inside the sheet 1, this foreign object prevents total reflection, so that the transmitted light L0
is detected by the scanner 3.
上述した方法によれば、シート1の表面にホコリ等の異
物が付着していても、これを誤って、キズや内部の異物
等として検出することがない。尚、スキャナ3をシート
1の下方にも配することにより、検出精度を良くするこ
とができる。According to the method described above, even if foreign matter such as dust adheres to the surface of the sheet 1, it will not be mistakenly detected as a scratch or an internal foreign matter. Incidentally, by disposing the scanner 3 also below the sheet 1, detection accuracy can be improved.
被検査材の表面のキズや内部の泡、異物等の欠陥を、こ
の被検査材の表面に付着したホコリ等の異物と明確に区
別して検出を行うことができる。Defects such as scratches on the surface of the inspected material, internal bubbles, foreign objects, etc. can be detected while clearly distinguishing them from foreign objects such as dust attached to the surface of the inspected material.
【図面の簡単な説明】
第1図は本発明の詳細な説明するための概略的な斜視図
及びブロック図、第2図は本発明の詳細な説明するため
の図である。
なお図面に用いた符号において、
1−−−−−−一・・・・−−−−−−・シート2−−
−−−・−・−・−−−−一−−照明装置3−−−−−
−−・−−−−−・・−・ラインスキャナである。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic perspective view and block diagram for explaining the present invention in detail, and FIG. 2 is a diagram for explaining the present invention in detail. In addition, in the symbols used in the drawings, 1--------1...-----Sheet 2--
−−−・−・−・−−−−1−−Lighting device 3−−−−−
−−・−−−−−・・−・It is a line scanner.
Claims (1)
この光が上記被検査材の内部で全反射されながら透過す
るように成し、この際、上記被検査材の表面の傷あるい
は内部の欠陥等によって、全反射されることなく外部に
出力された光を検出するようにした欠陥検出方法。Light is irradiated from the side of the material to be inspected at a predetermined angle of incidence,
This light is transmitted while being totally reflected inside the material to be inspected, and at this time, due to scratches on the surface of the material to be inspected or internal defects, etc., it is output to the outside without being totally reflected. A defect detection method that detects light.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12730685A JPS61284648A (en) | 1985-06-12 | 1985-06-12 | Defect detecting method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12730685A JPS61284648A (en) | 1985-06-12 | 1985-06-12 | Defect detecting method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61284648A true JPS61284648A (en) | 1986-12-15 |
Family
ID=14956684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12730685A Pending JPS61284648A (en) | 1985-06-12 | 1985-06-12 | Defect detecting method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61284648A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11337496A (en) * | 1998-03-24 | 1999-12-10 | Ngk Insulators Ltd | Detection of flaw of transparent object and production of transparent object |
JP2001201462A (en) * | 2000-01-20 | 2001-07-27 | Sumitomo Osaka Cement Co Ltd | Apparatus and method for inspection of transparent material or object wrapped with transparent material |
JP2004150971A (en) * | 2002-10-31 | 2004-05-27 | Nitto Denko Corp | Inspection method and inspection apparatus of film |
JP2009162782A (en) * | 2009-04-23 | 2009-07-23 | Central Glass Co Ltd | Defect detection method of transparent plate and its apparatus |
US7927440B2 (en) * | 2005-11-30 | 2011-04-19 | Seiko Instruments Inc. | Bonding method and method of manufacturing a display device |
JP2011117928A (en) * | 2009-12-04 | 2011-06-16 | Taida Electronic Ind Co Ltd | Apparatus and method for inspecting internal defect of substrate |
JP2015219176A (en) * | 2014-05-20 | 2015-12-07 | オリンパス株式会社 | Chip recovery device |
-
1985
- 1985-06-12 JP JP12730685A patent/JPS61284648A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11337496A (en) * | 1998-03-24 | 1999-12-10 | Ngk Insulators Ltd | Detection of flaw of transparent object and production of transparent object |
JP2001201462A (en) * | 2000-01-20 | 2001-07-27 | Sumitomo Osaka Cement Co Ltd | Apparatus and method for inspection of transparent material or object wrapped with transparent material |
JP2004150971A (en) * | 2002-10-31 | 2004-05-27 | Nitto Denko Corp | Inspection method and inspection apparatus of film |
US7927440B2 (en) * | 2005-11-30 | 2011-04-19 | Seiko Instruments Inc. | Bonding method and method of manufacturing a display device |
JP2009162782A (en) * | 2009-04-23 | 2009-07-23 | Central Glass Co Ltd | Defect detection method of transparent plate and its apparatus |
JP2011117928A (en) * | 2009-12-04 | 2011-06-16 | Taida Electronic Ind Co Ltd | Apparatus and method for inspecting internal defect of substrate |
JP2015219176A (en) * | 2014-05-20 | 2015-12-07 | オリンパス株式会社 | Chip recovery device |
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