JPS61283146A - 半導体集積回路装置及びその製造方法 - Google Patents

半導体集積回路装置及びその製造方法

Info

Publication number
JPS61283146A
JPS61283146A JP60125418A JP12541885A JPS61283146A JP S61283146 A JPS61283146 A JP S61283146A JP 60125418 A JP60125418 A JP 60125418A JP 12541885 A JP12541885 A JP 12541885A JP S61283146 A JPS61283146 A JP S61283146A
Authority
JP
Japan
Prior art keywords
metal
polycrystalline silicon
forming
integrated circuit
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60125418A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0584671B2 (enExample
Inventor
Hiroshi Furuta
博伺 古田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60125418A priority Critical patent/JPS61283146A/ja
Publication of JPS61283146A publication Critical patent/JPS61283146A/ja
Publication of JPH0584671B2 publication Critical patent/JPH0584671B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP60125418A 1985-06-10 1985-06-10 半導体集積回路装置及びその製造方法 Granted JPS61283146A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60125418A JPS61283146A (ja) 1985-06-10 1985-06-10 半導体集積回路装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60125418A JPS61283146A (ja) 1985-06-10 1985-06-10 半導体集積回路装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPS61283146A true JPS61283146A (ja) 1986-12-13
JPH0584671B2 JPH0584671B2 (enExample) 1993-12-02

Family

ID=14909610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60125418A Granted JPS61283146A (ja) 1985-06-10 1985-06-10 半導体集積回路装置及びその製造方法

Country Status (1)

Country Link
JP (1) JPS61283146A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5661081A (en) * 1994-09-30 1997-08-26 United Microelectronics Corporation Method of bonding an aluminum wire to an intergrated circuit bond pad

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5745967A (en) * 1980-09-04 1982-03-16 Toshiba Corp Semiconductor device
JPS57166048A (en) * 1981-04-06 1982-10-13 Nippon Telegr & Teleph Corp <Ntt> Semiconductor integrated circuit
JPS5828856A (ja) * 1981-08-13 1983-02-19 Nec Corp 半導体装置の製造方法
JPS5873135A (ja) * 1981-10-28 1983-05-02 Nec Corp 半導体装置とその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5745967A (en) * 1980-09-04 1982-03-16 Toshiba Corp Semiconductor device
JPS57166048A (en) * 1981-04-06 1982-10-13 Nippon Telegr & Teleph Corp <Ntt> Semiconductor integrated circuit
JPS5828856A (ja) * 1981-08-13 1983-02-19 Nec Corp 半導体装置の製造方法
JPS5873135A (ja) * 1981-10-28 1983-05-02 Nec Corp 半導体装置とその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5661081A (en) * 1994-09-30 1997-08-26 United Microelectronics Corporation Method of bonding an aluminum wire to an intergrated circuit bond pad
US5734200A (en) * 1994-09-30 1998-03-31 United Microelectronics Corporation Polycide bonding pad structure

Also Published As

Publication number Publication date
JPH0584671B2 (enExample) 1993-12-02

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