JPS61279682A - 基材を金属化する方法 - Google Patents

基材を金属化する方法

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Publication number
JPS61279682A
JPS61279682A JP61117669A JP11766986A JPS61279682A JP S61279682 A JPS61279682 A JP S61279682A JP 61117669 A JP61117669 A JP 61117669A JP 11766986 A JP11766986 A JP 11766986A JP S61279682 A JPS61279682 A JP S61279682A
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JP
Japan
Prior art keywords
metal layer
substrate
metal
holes
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61117669A
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English (en)
Other versions
JPH0248628B2 (ja
Inventor
ローベルト・オストヴアルト
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Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
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Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of JPS61279682A publication Critical patent/JPS61279682A/ja
Publication of JPH0248628B2 publication Critical patent/JPH0248628B2/ja
Granted legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/936—Chemical deposition, e.g. electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 青　　産業上の利用分野 本発明は、湿式化学によって金属層を析出する、　　る
ことによって基材を金属化する方法に関する。
ず　　従来の技術 金属性又は非金属性の基質材料は、種々の使用ケースに
対してその性質を改良するために金属層を設ける。特に
経済的な方法は、電鍍による金属析出である。これは、
一般に金属性基材に清浄工種後に直接に行ない、非金属
性一つまり電流を導かないか又は不十分に導（−表面に
対しては、多くは化学的金属析出に行なうことができる
。この電鍍によって設けた金属層は、更に加工する場合
又は実際に使用する場合には多くの種々の作用、例えば
熱負荷に耐えてその性質、例えば基材への付着強度を許
容できない様に変えてはならない。殊に層の付着は熱作
用の場合に屡々著しい負荷を蒙むる。この負荷は、金属
層と基材との異なる熱膨張係数に基づく機械的応力によ
り、並びに金属層と基材との化学的変化によって生じ得
る。電鍍による金属析出の場合には、成る程度大量の水
素並びに一般に種々の有機浴温加物が金属析出物で一緒
に蓄積し、殊に多孔性基材の場合には一緒に取込まれる
。か〜る金属層の熱処理に応じて、蓄積異物質は分離、
蒸発又は分解によって大きいガス圧を惹起し、このガス
圧は被膜を破がいしないで、例えば金属層に浸出して分
解するか、又は基材から金属層を成る程度大きい面で分
離する。一般にか〜る金属層は多数の気泡を示し、これ
は付着強度が減少するにつれて大きくかつ多くなる。
電鍍によって非金属性基材上に析出した金属層の付着強
度は、少くとも例えばはんだ付は工程による熱負荷の際
に気泡生成を避けるためには不十分である。それ故か〜
る必要な金属層は、その製造のためには、多くは装置が
必要がか入りかつわずかな経済的方法、例えば真空蒸着
法、陰極スパッタリング又はＣｖＤ−技術が該当するの
に過ぎない。
発明が解決しようとする問題点 それ故、本発明の目的はこの種の方法を殊に軟性−又は
硬性はんだ付は工程で生じる熱負荷の際に、析出金属層
のできるだけ大きい付着強度を得ることによって改良す
ることである。
問題点を解決するための手段 この目的は、特許請求の範囲の記載によって解決される
。
本発明は、コスト上好ましい方法で金属層を、次の熱処
理で妨害となる液体及び／又はガスの残渣を金属層と基
材との間の境界層から散乱させて設けることができる認
識に基づ（。続く熱負荷、例えば温度約２８０℃及び時
間約２０秒間での軟性はんだ付は工程又は温度約４００
’Ｃ及び時間約１０秒間での硬性はんだ付は工程の場合
に、金属層の妨害となる気泡の生成はもはや生じない。
実施例 例１ 大きさ５０．８Ｘ５０．８Ｘ０．６−の酸化アルミニウ
ムセラミック基材（Ｍ２ｏ３９９．５％）を、ＮａＯＨ
溶液中に公知方法で浸漬してガラス状”焼成皮膜〃を除
去し、超音波励起で脱塩水で慎重に洗浄する。続いて塩
化錫（ＩＩ）の塩酸溶液、水及び塩化・ぞラジウムの塩
酸溶液で処理し、最後に水で洗浄した後に、公知方法に
よって化学的金属析出のために接触作用性核層な、セラ
ミック表　　　　□面に設ける。この上に、市場で得ら
れる化学的　　　　”銅浴から厚さ約０．２μｍの銅基
質層を析出させ、続いてこれを市場で得られる硫酸銅浴
から厚さ　　　　：約１５μｍの光沢性銅層で補強する
。公知フォー　　　　□ト腐蝕法を用いて、銅層の長方
形の試験面２゜Ｘ３０−上に、間隔ＩＢを有する点網目
スクリ　　　　“−ンの直径５０μｍの孔ぐりをスプレ
ー腐蝕にょ　　　　ｉって設ける。例えば環状横断面を
有するこの孔　　　　“ぐりは、金属層に十分に貫通し
、基材によって　　　　□境をなす。フォートラッカ一
層を除去した後に、　　　　□セラミック試料を熱処理
して、温度４３０℃並びに窒素雰囲気で１ｏ分間施こす
。室温（２０’℃）に冷却後、銅層の試験で２０ｘ３０
−以外の　　　　闇大きいこの試験面は多くの大きい気
泡が一面に　　　　１おおわれていることが立証される
。フォート腐蝕法によって設けた巾１咽の銅ストライプ
にょ　　　　ｒ■験ヨ。孔ヶあけｆ、−Ｍイ域。。よ、
脱力。、１１定　　　　２よ、ヵきいア離ヵ約。、５Ｎ
ケオよ。カー。ワ、１、′ の孔をあけはかった帯域では、金属層の析出の　　　　
餐際に含まれた液体及び／又はガスの残渣の散乱は行わ
れないので、そこでは金属層の部分的はく離が生じる（
気泡生成）。
例２ 酸化アルミニウムセラミック基材を例１のようにして予
処理し、接触作用性核層な設ける。
この層上に市場で得られる化学的次亜燐酸ニッケル浴か
ら厚さ約０２１μｍのニッケル／燐酸層を析出させ、こ
れを慎重に洗浄し、乾燥する。フォートラッカー法によ
って、ニッケル／燐酸層で直径約１００μｍのフォート
ラッカ一点を、網目スクリーンの間隔２１１１１で試験
面２０Ｘ３０−上に設げる。続いて市場で得られる電鍍
硫酸銅浴中で厚さ約１０μｍの銅層で補強する。フォー
トラッカ一点を除去し、慎重に洗浄し、乾燥した後に、
この層に例１のようにして熱処理を４３０℃で施こす。
続く金属層の試験で、この層は一孔の網目スクリーンを
有する試験面の外で−多くの小さい気泡によって一面に
おおわれていることが立証される。フォート腐蝕法で設
けた層ストライプの孔をあけた層帯域のはく脱力の測定
は、極めて十分な付着強度約０．７　Ｎ／ｗを示す。
本発明は前記実施例に限定はされず、他に使用すること
ができる。例えば製造すべき金属構造物、例えば導電体
路が単Ｆｃ２　ｔｔｍよりも小さい巾を有する場合には
、前記の孔の網目スクリーンを放きすることができる。
か〜る金属構造物の製造は、例えばいわゆる付加法又は
半付加法で可能である。か〜る金属構造物の場合には、
前記熱処理で妨害となる液体及び／又はガスの残渣は層
を損なわないで漏出する。
更に、例えば前記金属構造物を物理的方法、　　　　□
例えばフライス盤処理及び／又はレーザ加工に　　　　
□よって製造することができる。
手続補正書（自発） 昭和６１年　６月２７日

Claims (1)

  1. 【特許請求の範囲】 １、湿式化学により金属層を析出することによつて基材
    を金属化する方法において、金属層を基材上に設け、得
    られた金属構造物は金属層の次の熱処理の間に、析出工
    程で金属層と基材との間に生じた液状並びにガス状の色
    含物の漏出を可能にする巾を有することを特徴とする、
    基材を金属化する方法。 ２、金属層に孔を設け、この孔は基材にまで達し、これ
    によつて金属構造物の巾及び／又は形を決める、特許請
    求の範囲第１項記載の方法。 ３、孔を網目スクリーンの形で設ける、特許請求の範囲
    第１項又は第２項記載の方法。 ４、巾が２ｍｍよりも小さい金属構造物を設ける、特許
    請求の範囲第１項から第３項までのいずれか１項記載の
    方法。 ５、孔を、直径が１ｍｍよりも小さい穿孔として形成す
    る、特許請求の範囲第１項から第４項までのいずれか１
    項記載の方法。 ６、孔を金属層の析出の間に形成し、付加法又は半付加
    法によつて設ける、特許請求の範囲第１項から第５項ま
    でのいずれか１項記載の方法。 ７、金属構造物及び／又は孔を、金属層の析出後にフオ
    ート腐蝕法及び／又は物理的方法によつて設ける、特許
    請求の範囲第１項から第６項までのいずれか１項記載の
    方法。 ８、基材として、セラミック材料又は珪酸塩材料を使用
    する、特許請求の範囲第１項から第７項までのいずれか
    １項記載の方法。
JP61117669A 1985-05-24 1986-05-23 基材を金属化する方法 Granted JPS61279682A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19853518766 DE3518766A1 (de) 1985-05-24 1985-05-24 Verfahren zur metallisierung eines substrates
DE3518766.2 1985-05-24

Publications (2)

Publication Number Publication Date
JPS61279682A true JPS61279682A (ja) 1986-12-10
JPH0248628B2 JPH0248628B2 (ja) 1990-10-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP61117669A Granted JPS61279682A (ja) 1985-05-24 1986-05-23 基材を金属化する方法

Country Status (5)

Country Link
US (1) US4849302A (ja)
EP (1) EP0202623B1 (ja)
JP (1) JPS61279682A (ja)
AT (1) ATE53866T1 (ja)
DE (2) DE3518766A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0382554A3 (en) * 1989-02-10 1992-09-30 Matsushita Electric Industrial Co., Ltd. Method of forming a metal-backed layer and a method of forming an anode
US4937930A (en) * 1989-10-05 1990-07-03 International Business Machines Corporation Method for forming a defect-free surface on a porous ceramic substrate
ES2162566B1 (es) * 1999-07-09 2003-12-16 E Instr Galvanotecnico S L Pro Procedimiento para metalizar productos ceramicos.
WO2003008938A2 (de) * 2001-07-16 2003-01-30 Siemens Aktiengesellschaft Verfahren zum bestimmen der haftfestigkeit einer beschichtung auf einem bauteil

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB233357A (en) * 1924-05-02 1926-04-29 Georg Walter Rasche Improvements in or relating to temperature indicating devices
FR631426A (fr) * 1927-03-07 1927-12-20 Procédé d'élimination de gaz et de purification de la surface de métaux à l'aide de courant électrique en chambre à vide
NL66417C (ja) * 1943-02-22
US2534911A (en) * 1948-04-03 1950-12-19 Houdaille Hershey Corp Process of removing hydrogen embrittlement of bright nickel electrodeposits
GB1107811A (en) * 1963-09-20 1968-03-27 Energy Conversion Ltd Improvements in and relating to structures incorporating thin metal membranes
DE2101049A1 (de) * 1971-01-11 1972-08-03 Siemens Ag Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall
US3728231A (en) * 1971-04-08 1973-04-17 Motorola Inc Method of forming an ultrafine aperture mask
DE2832408A1 (de) * 1978-07-24 1980-02-14 Siemens Ag Verfahren zur herstellung von praezisionsflachteilen, insbesondere mit mikrooeffnungen
JPS5760640A (en) * 1980-09-29 1982-04-12 Toyo Kohan Co Ltd Manufacture of compound shadow mask
JPS5896895A (ja) * 1981-12-07 1983-06-09 Kokoku Gomme Kogyo Kk 透明或いは半透明の部分を有するメツキ製品の製造方法
EP0120850B1 (en) * 1982-09-30 1988-09-07 The Boeing Company Method for determining structures exhibiting low hydrogen embrittlement
DE3326253A1 (de) * 1983-07-21 1985-01-31 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur metallisierung eines festen koerpers
US4575406A (en) * 1984-07-23 1986-03-11 Polaroid Corporation Microporous filter
US4647477A (en) * 1984-12-07 1987-03-03 Kollmorgen Technologies Corporation Surface preparation of ceramic substrates for metallization

Also Published As

Publication number Publication date
DE3518766A1 (de) 1986-11-27
US4849302A (en) 1989-07-18
DE3670863D1 (de) 1990-06-07
EP0202623A1 (de) 1986-11-26
JPH0248628B2 (ja) 1990-10-25
EP0202623B1 (de) 1990-05-02
ATE53866T1 (de) 1990-06-15

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