JPS61276321A - Semiconductor substrate developing device - Google Patents

Abstract

PURPOSE:To reduce the dropping amount of liquid and to eliminate the creepage to the back surface of a semiconductor substrate by disposing an opposing plate in parallel with the substrate through a space in a device for dropping developer on the substrate to develop in a steady state, and by stably holding the developer in the space. CONSTITUTION:A circular semiconductor substrate 2 is placed on a similarly circular semiconductor substrate holding base 1, coated with a developing cup 5, and an opposing disk 3 hung through a supporting rod 6 from the ceiling of the cup 5 is opposed to the substrate 2 through the prescribed space. At this time, the disk 3 uses a disk coated with hydrophilic substance on the surface, and the diameter is equal to or slightly smaller than that of the substrate 2. Thus, the developing device is composed to supply developer 7 through dropping nozzle 4 into the space between the substrate 2 and the disk 3 to retain the developer 7 in the space. Thus, the later washing and further the addition of surfactant can be eliminated to improve the spread of the liquid.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a developing device that drops a developing solution onto a semiconductor substrate and performs a developing process in a stationary state.

[Conventional technology]

Conventionally, this type of development processing apparatus, as shown in FIG. 3, drops a developer solution 7 onto the surface of a semiconductor substrate 2 on a holding table 1 until it is completely spread, and then uses only the surface tension of the solution to transfer the solution onto the semiconductor substrate. I used a method to hold it in place.

There are also examples in which a surfactant is added to the developer to improve the spread of the developer.

[Problem that the invention seeks to solve]

The conventional developing device described above uses a method in which the developing solution is dropped onto the semiconductor substrate and held only by the surface tension of the solution, resulting in the following drawbacks: (1) When the amount of dropping is small, As shown in FIG. 4, the developer 7 does not spread sufficiently, resulting in areas 10 that cannot be developed.

(2) In most cases, an excessive amount is dropped to cover the surface, so the developer 7 spills from the surface of the semiconductor substrate and spills onto the back surface of the substrate 2 and onto the semiconductor substrate holder 1. contaminated, and extra steps such as washing with water had to be added to remove it.

(3) Furthermore, in order to easily spread the developer solution 7 on the semiconductor substrate and eliminate the drawback mentioned in (1) above, there is a method of adding a surfactant to the developer solution, but in this case, it is necessary to add a surfactant to the surface. Since the wettability to the back surface is improved as well as the wettability to the back surface, it promotes contamination of the back surface of the substrate 2, so there is a problem in its use.

[°Means to solve problems]

The developing device of the present invention is characterized in that a parallel opposing flat plate is installed opposite the semiconductor substrate attracted to the holding table, and a developing solution holding space is formed in the gap between the opposing flat plate and the semiconductor substrate. It is something.

〔Example〕

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1(a) is a diagram showing an embodiment of the present invention.

In the figure, 1 is a semiconductor substrate holding stand, 2 is a semiconductor substrate, and 3 is a disk whose surface is made of a hydrophilic substance and whose size is the same as or slightly smaller than the semiconductor substrate. is suspended from the developing cup 5 by a support rod 6 in parallel to the substrate 2.

4 is a developer dripping nozzle.

In this embodiment, a developer 7 in an amount equal to the volume of the gap between the semiconductor substrate 2 and the disk 3 is poured into the gap from the developer dripping nozzle 4, and the developer 7 is applied to the semiconductor substrate as shown in FIG. 1(b). It diffuses uniformly between the substrate 2 and the disk 3 and holds it stably.

The structure of the upper opposing disc is as shown in Fig. 2 in addition to Fig. 1, in which an opening 8 for dripping the developer is provided in the center of the disc 3, and the developer is dripped from there. It's okay.

〔Effect of the invention〕

As explained above, in the present invention, since the developer is stably held between the semiconductor substrate and the disk whose surface is made of a hydrophilic substance, the amount of the developer dropped can be small and fixed. This can also be done by shortening the dripping time. Further, it is possible to eliminate the possibility of turning the back surface of the substrate, and to omit the subsequent water washing treatment and the like. Furthermore, there is no need to add a surfactant or the like to the developing solution, and the wettability of the back surface of the substrate is not promoted, which has the effect of preventing contamination of the back surface.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view of an embodiment of the present invention, in which FIG. 1(a) is before the developer is dropped, FIG. 1(b) is after the developer is dropped, and FIG. 2 is a view facing the semiconductor substrate. This shows another example of the disk, in which 2nd E (a) is a front view, (b) is the same plan view, and 3rd E is a front view.
The figure shows a developing process using a conventional developing device, and FIG. 4 shows an example of defects that occur in the conventional method. 1... Semiconductor substrate holding stand, 2... Semiconductor substrate, 3...
. . . Opposed disk, 4. Dripping nozzle, 5. Development processing cup, 6. Support rod, 7. Developing solution. Figure 1 Figure 2 Figure 4

Claims (1)

[Claims] (1) A semiconductor characterized in that a parallel opposing plate is installed facing the semiconductor substrate attracted to the semiconductor substrate holding part, and a developer holding space is formed in the gap between the semiconductor substrate and the opposing plate. Substrate development equipment.