JPS61274348A - 光電変換装置用配線基板の製造方法 - Google Patents

光電変換装置用配線基板の製造方法

Info

Publication number
JPS61274348A
JPS61274348A JP8955685A JP8955685A JPS61274348A JP S61274348 A JPS61274348 A JP S61274348A JP 8955685 A JP8955685 A JP 8955685A JP 8955685 A JP8955685 A JP 8955685A JP S61274348 A JPS61274348 A JP S61274348A
Authority
JP
Japan
Prior art keywords
film
metal
layer
electrode
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8955685A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0431178B2 (enrdf_load_stackoverflow
Inventor
Senhiko Yamada
山田　千彦
Hitoshi Fujino
仁 藤野
Makoto Arisawa
誠 有沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP8955685A priority Critical patent/JPS61274348A/ja
Publication of JPS61274348A publication Critical patent/JPS61274348A/ja
Publication of JPH0431178B2 publication Critical patent/JPH0431178B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]

Landscapes

  • Wire Bonding (AREA)
JP8955685A 1985-04-25 1985-04-25 光電変換装置用配線基板の製造方法 Granted JPS61274348A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8955685A JPS61274348A (ja) 1985-04-25 1985-04-25 光電変換装置用配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8955685A JPS61274348A (ja) 1985-04-25 1985-04-25 光電変換装置用配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS61274348A true JPS61274348A (ja) 1986-12-04
JPH0431178B2 JPH0431178B2 (enrdf_load_stackoverflow) 1992-05-25

Family

ID=13974093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8955685A Granted JPS61274348A (ja) 1985-04-25 1985-04-25 光電変換装置用配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS61274348A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0431178B2 (enrdf_load_stackoverflow) 1992-05-25

Similar Documents

Publication Publication Date Title
US4640739A (en) Process of producing galvanic layers of solder of precise contour on inorganic substrates
US4964947A (en) Method of manufacturing double-sided wiring substrate
US4075416A (en) Electronic thin film circuit unit and method of making the same
KR100764386B1 (ko) 고온공정에 적합한 절연구조체 및 그 제조방법
JPS61274348A (ja) 光電変換装置用配線基板の製造方法
JPH0410235B2 (enrdf_load_stackoverflow)
JPH04144190A (ja) 配線基板およびその製造方法
JPS61255061A (ja) 光電変換装置用配線基板の製造方法
JPH0563340A (ja) 機能素子を有する配線板の製造法
JPH10270630A (ja) 半導体装置用基板及びその製造方法
US3554876A (en) Process for etching and electro plating a printed circuit
JPH10294548A (ja) プリント配線板の製造方法およびそれを用いたプリント配線板
JPS61102091A (ja) 配線基板の製造方法
JPH05347212A (ja) 薄膜電子部品及びその製造方法
JPH05283853A (ja) プリント回路基板
JP3140574B2 (ja) 電着基板および電着転写方法
JPS5811113B2 (ja) 電子回路装置
JPH03214601A (ja) 可変抵抗器
JPH0621651A (ja) 多層配線回路板及びその製造方法
JPH04102341A (ja) Ｔａｂテープの製造方法
JPS6270594A (ja) 選択メツキ法
JPS61182964A (ja) サ−マルヘツド
GB2065380A (en) Electronic thin-film circuit and method of its fabrication
JPS5938314B2 (ja) 厚膜ペ−ストのメツキ方法
JPH0787205B2 (ja) ２層ｔａｂの製造方法