JPS6127190A - Laser working device - Google Patents

Abstract

PURPOSE:To convert laser light to a sharp beam conforming to working, and to execute exactly and precisely the working by controlling a turning angle around the center shaft of a shutter plate which can open and close a laser optical path, and moving it in the upper and the lower equal diameter directions. CONSTITUTION:When working is executed by a laser working device, a lifting motor 21 turns in accordance with a working shape, etc. and moves a shutter plate 18 upward and downward, a circular arc part of the rotary shutter 18 having an opening of an appropriate size is selected so as to coincide with a shape of a laser tube 1, and a bundle of laser light is adjusted to a desired size. Subsequently, a motor 19 is turned, and at the time of working, a rotational angle of the shutter plate 18 is controlled, and a laser beam is irradiated on a part required for working, by a necessary time.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a laser processing device.

[Conventional technology]

2. Description of the Related Art Laser processing apparatuses are known that focus laser light using a focusing lens and perform processing while irradiating a workpiece with the laser light.

A laser processing device changes the optical path of a laser beam emitted from a laser oscillator directly or by a reflecting mirror, and then
The laser beam is focused by a focusing lens and is irradiated onto the processing portion of the workpiece to perform processing.

Laser processing devices are now used in a wide range of fields because they can process even complex shapes in a short time.

However, when drilling holes in a thick workpiece,
There was a problem in that it was difficult to make accurate cylindrical holes. In other words, since the laser beam used in conventionally known devices has a blurred cross-sectional profile, the diameter of the hole on the beam entry side is machined to be large, resulting in a conical hole. It was empty.

In order to solve this problem, it is necessary to use a sharp laser beam that is suitable for the purpose of processing, or to perform processing while moving the distance from the workpiece according to the depth of the hole to be machined. However, conventionally known laser beams do not have an appropriate aperture mechanism, and it is difficult to adjust the distance between the workpiece and the processing feed because it requires high-speed control. It was bad.

[Problems to be solved by the present invention]

The present invention has been made based on the above-mentioned viewpoints, and its purpose is to use a laser beam that is suitable for processing and enables accurate and precise processing of a workpiece. The aim is to provide devices at low cost and in large quantities.

[Means for solving problems]

The above object is to provide a laser processing device that focuses laser light emitted from a laser oscillator using a focusing lens, and performs processing while irradiating the workpiece with the laser light. A shutter plate having a hole formed therein and capable of opening and closing a laser beam path of the laser oscillator, a motor for controlling a rotation angle of the shutter plate around a central axis, and a moving device for moving the shutter plate in vertical and equal radial directions. This is achieved by providing

The shutter plate has a large number of holes arranged in a uniform shape around its rotation center axis. These pore sizes may be the same or different. In a preferred embodiment, the holes are arranged in a radially uniform manner on concentric lines, with holes having the same diameter on one line. However, it goes without saying that only one hole may be provided on one arrangement line.

[For production]

As mentioned above, the laser processing device is provided with a shutter plate that has an opening suitable for the processing purpose and turns on and off the laser beam,
By appropriately turning on and off the laser beam during processing, a sharp light beam that matches the processing shape is irradiated, and the temperature of the processing part of the workpiece is prevented from rising abnormally. Even when drilling holes in a workpiece, accurate and precise cylindrical holes can be formed.

Hereinafter, the details of the present invention will be specifically explained with reference to the drawings.

FIG. 1 is an explanatory diagram showing an embodiment of a laser processing apparatus according to the present invention, and FIG. 2 is an explanatory diagram of a shack plate portion thereof.

In Figures 1 and 2, 1 is a laser tube consisting of a straight pipe 1a, a water jacket 1b, etc., 2 and 3 are ring-shaped cathodes and anodes, and 4 is the water jacket 1b.
5 is a drain port for the cooling water, 6 and 7 are reflecting mirrors, 6a is a hole formed in the center of the reflecting mirror 6, 8 is a gas discharge pipe, 9 and 10 is reflector 6
1] and 12 are adjustment plates, 13 and 14 are fixing plates for the reflecting mirror 7, 15 is an O ring, 16 is an output window made of KCL single crystal plate, and 17.17 are C02, N2, and He.
18 is a shutter plate whose side surface on the laser tube 1 side is constituted by a reflecting mirror, and 18a to 18G are two types of gases formed on the shutter plate 18. A plurality of holes of different sizes, 19 a motor for rotating the shutter plate 18, 20 a motor mounting base, 21 a motor mounting base 21 for raising and lowering the shutter plate 1;
8 is a lifting motor that moves the laser tube 1 in the radial direction with respect to the axis; 22 is a gear attached to the shaft of the lifting motor 21;
an antireflection plate that prevents the laser beam from irradiating parts other than the workpiece when it is blocked and reflected by the workpiece;
924 is a reflecting mirror for changing the optical path of the laser beam; 25 is a workpiece; 26 and 27 are cross slide tables for moving the workpiece 25 in the X-axis direction and the Y-axis direction; 28 is a workpiece 5 A turntable is provided on the cross slide table 26 to give rotation to the cross slide table 26, 29, 30 and 31 are motors that drive the cross slide table 26, 27 and the turn table 28, respectively, and 32 is a motor that drives the cross slide table 26, 27. The mounted base 33 is a focusing lens that focuses the laser beam.

The reflecting mirrors 6 and 7 are arranged at both ends of the straight pipe 1a, and the reflecting mirrors 6 and 7 are made of a dielectric loss M film.
Those coated with gold or the like are often used. Incidentally, of the two reflecting mirrors 6 and 7 attached to both ends of the straight pipe 1a, the reflecting mirror 6 is an internal mirror arranged so that it can be adjusted from the outside even in the operating state. be.

The plasma part of the straight pipe 1a has water for cooling.
It is covered with a jacket 1b, and cooling water is supplied to the water jacket 1b from a cooling water supply port 4 and discharged from a cooling water discharge port 5.

Further, a ring-shaped cathode 2 and an anode 3 necessary for generating effective plasma gas are arranged inside the straight pipe 1a,
Furthermore, an output extraction window 16 is provided on one side for transmitting the oscillated light.

Furthermore, the laser tube 1 is placed in the laser optical path of the laser tube 1.
A shutter plate 18 is provided opposite to the shutter plate 18, and the shutter plate 18 has a plurality of holes 18a of two different sizes,
18b and 18c are formed. The shutter plate 18 is rotated by a motor 19, and also by the action of an elevating motor 21 that raises and lowers the morph mount 20. The shutter plate 8 is radially relative to the axis of the laser tube 1, and in the case shown in the figure, vertically. It is configured so that it can be moved to

The laser beam oscillated from the laser tube 1 is turned on and off by the shutter plate 18, and when turned on, the laser beam passes through the holes 18a to 18C formed in the shutter plate 18, thereby changing the luminous flux. Since the light beam is narrowed down to a desired size, when this light beam is focused by the focusing lens 33, it becomes a sharp light beam.

Further, the tip of the straight pipe 1a is covered with an anti-reflection plate path to prevent the laser beam from irradiating parts other than the workpiece 25 when the laser beam is blocked by the shutter plate 18. To prevent.

The workpiece 25 is mounted on a turntable 28, and the turntable 28 gives it rotational motion, and the cross slide tables 26 and 27 give it movement in the X-axis and Y-axis directions.

When processing is performed by the laser processing apparatus according to the present invention, the lifting motor 2 is adjusted depending on the processing shape, etc.
1 rotates to move the shutter plate 18 up and down,
The circular arc portion of the rotary shutter 18 having an aperture of an appropriate size is selected so as to coincide with the axis of the laser tube 1, and the beam of laser light is adjusted to a desired size.

Next, by rotating the motor 19, the rotation angle of the shutter plate 8 is controlled during machining, and the laser beam is irradiated to the area required for machining for the required time.

The laser beam emitted from the laser tube 1 is turned on and off at appropriate intervals by the shutter plate 8, and when turned on, the beam of the laser beam is adjusted to the optimum size for processing. Since it is squeezed and supplied to a predetermined processing point for a desired time, the workpiece 25 is subjected to laser processing.

That is, the laser beam oscillated from the laser tube 1 passes through a selected one of the holes 18a to 18c formed in the shutter plate 18, for example, the hole 18a, and is focused on the focusing lens 33. Since the light beam is close to the optical axis and has a desired spread, an accurate and precise cylindrical hole can be formed in the workpiece 25.

Furthermore, when machining a plurality of holes in the workpiece 25, when one hole is formed in the workpiece 5, the shutter plate 18
turns to turn off the laser beam, and during this turning off, the turntable 28 and cross slide tables 26 and 27 move the workpiece 25 to a predetermined position according to a predetermined program, and at the end of the movement, the shutter is turned off. The laser beam is turned on by the plate 18 and hole processing is performed again.

In addition, depending on the size of the hole to be machined, etc., the lifting motor 21
The shutter plate 18 is rotated to raise and lower the shutter plate 18, and a hole diameter suitable for the shape to be processed is selected, so that processing is always performed using a sharp light beam suitable for the purpose of processing.

In addition, a motor 19 that provides a laser oscillation output, a motor 19 that provides rotational movement to the shutter plate 18, a lifting motor 21 that moves the shutter plate 18 up and down, and motors 29. 30, 31, etc. are configured to be collectively controlled by a control device (not shown) according to a predetermined program.

As mentioned above, since the laser beam is always used as a sharp light beam suitable for the processing, accurate processing can be carried out in a short time and efficiently, especially when drilling holes in thick workpieces. It becomes possible to form accurate and precise cylindrical holes even when forming holes.

〔Example〕

The luminous flux of a C02 laser with an oscillation diameter of approximately 24 inches is focused, and a thickness of 5
When 18-8 mm stainless steel was continuously irradiated with a laser beam and a hole was machined, the machined part of the stainless steel was heated to a very high temperature, and the machined hole was heated. The diameter of the hole on the opposite side was 4+nφ, and the diameter on the opposite side through which it was penetrated was 2 mm, making it impossible to form an accurate cylindrical hole.

On the other hand, the shutter plate 18 on the stainless steel was rotated to turn on and off the laser beam at 500 Hz, and at the same time, the beam of laser light with an oscillation diameter of about 24 mm was output as a strip on 22 frames, and was then focused and processed. When this process was carried out, it was possible to form a hole with a cylindrical diameter of about 1 crane.

Furthermore, when the beam of laser light was similarly stripped to 15 fins and outputted, and the same process was performed after focusing, the result was approximately 0.
A 2 m cylindrical hole was formed.

〔Effect of the invention〕

Since the present invention is configured as described above, when using the laser processing apparatus according to the present invention, the laser beam can be made into a sharp light beam that matches the processing shape, so that accurate and precise processing can be performed in a short time. It is possible to do so.

Note that the present invention is not limited to the embodiments described above. That is, for example, in this embodiment, the motor mount is moved up and down by the motor, but it may be configured to be moved up and down by hydraulic pressure or the like. In addition, the position of the focusing lens, the number of holes formed in the shutter plate and their arrangement, the mounting position of the shutter plate, the method of rotation and control thereof, etc. are free within the scope of the purpose of the present invention. The design can be changed, and the present invention encompasses all of them.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing an embodiment of a laser processing apparatus according to the present invention, and FIG. 2 is an explanatory diagram of a shutter plate portion thereof.

Claims (1)

[Claims] 1) A laser processing device that focuses laser light emitted from a laser oscillator using a focusing lens and processes a workpiece while irradiating the laser light onto the workpiece, which has a plurality of holes on its surface. A shutter plate is formed to open and close a laser beam path of the laser oscillator, a motor controls a rotation angle of the shutter plate about a central axis, and a moving device moves the shutter plate in a radial direction. The above laser processing device is characterized by the following. 2) The laser processing apparatus according to claim 1, wherein the side surface on the side of the laser oscillator that is shuttered is a reflecting mirror.