JPS61271892A - Punching for printed wiring pattern - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for punching printed wiring patterns forming printed wiring boards used in electronic and electrical equipment.

Conventional technology Conventionally, the manufacturing method of printed wiring boards involves the sub-process of creating a wiring pattern on a copper-clad laminate using a screen printing method or a photoresist method, and then converting the wiring pattern to copper using etching and electroplating. Use the active method or bond the board and steel foil with uncured adhesive, punch out the copper foil into a wiring pattern using a die with a wiring pattern-shaped blade, and after curing the adhesive on the wiring pattern part, remove unnecessary parts. A t-weir die stamping method is commonly used.

Problems to be Solved by the Invention Although the above subtractive method is suitable for manufacturing printed wiring boards with precise wiring patterns, it is necessary to remove a large amount of wire f3 by etching and further perform electroplating.

Since these are so-called electrochemical treatment methods, there are problems in that pollution prevention such as treatment chemicals and waste water treatment must be taken care of, and expensive treatment equipment must be introduced.

Furthermore, since it is an electrochemical treatment method, it has the disadvantage that it takes a long time to manufacture.

Furthermore, with the subtractive method, it is difficult to increase the thickness of the wiring pattern, making it unsuitable for manufacturing printed wiring boards for circuits with large current capacity. This is the 9th reason that when the copper foil is made thicker, the efficiency of etching processing during manufacturing is significantly reduced. On the other hand, the Guistamp method is a dry method for manufacturing printed wiring boards, so there is no problem with pollution like the subtractive method, and the process is simple and suitable for mass production, but unless the blade shape is elaborate, copper foil cannot be used. It does not punch out cleanly, and processing takes a long time. In addition, it is difficult to carve a precise wiring pattern on the stamping die and it is difficult to remove unnecessary parts, so there is a problem that it is unsuitable for manufacturing printed wiring boards with precise wiring patterns.

Furthermore, although it can be used as a substrate material for resin laminates,
Hard substrates such as ceramic will damage the blade shape, so
In addition, in the case of a film-like substrate such as a flexible wiring board, there are various problems in that the substrate is also cut, making it unusable.

Means for Solving the Problems The present invention solves the above problems by using an electromagnetic forming method using an electromagnetic forming coil and die to form a conductive thin plate material for forming a printed wiring pattern. The objective is to punch out precise wiring patterns continuously and in large quantities in a short time, inexpensively, and without pollution.

Function: To form a printed wiring pattern, an electromagnetic forming machine uses a combination of an electromagnetic forming coil and a die to form a conductive thin plate material. By emitting , a current is induced in the conductive thin plate material to be processed, and a strong pulse-like electromagnetic force acts between the thin plate material and the coil.
By hitting a die that serves as a wiring pattern cutting die, the wiring pattern can be punched instantly at high speed. Therefore, it is possible to continuously manufacture precise wiring patterns in a short time, which is difficult to do with conventional press punching using a punch and die. In addition, an electromagnetic forming coil, a stick, a conductive thin plate material, and a substrate for a printed wiring board are respectively installed in a press machine 1c'.
l) Precise printed wiring boards can be obtained continuously by automating the attaching process.

An embodiment of the present invention will be described below with reference to the drawings.

Embodiment As shown in Fig. 1, it has a DC high voltage generator (1) on the upper part, and is connected to a capacitor (3) for storing the current generated by the charging station (z) and a discharge switch (4). A large current is instantaneously passed through the coil (6) to form a magnetic field around the coil, and the Coulomb force (electromagnetic force) generated by this magnetic field
At the bottom of the electromagnetic forming device using an electromagnetic forming device, the formed gou (8) is placed on the bottom of the plate, and the conductive thin plate material (1) is placed on the gou.
A large current is passed through the coil, and the electromagnetic force generated around the coil is used to punch out the conductive thin plate material into the shape of a slit (7) cut into a slit (8).

FIG. 2 shows the printed wiring pattern (lot t-printed wiring board substrate) thus punched out and the printed wiring board fixed to the rice field.

In addition, the electromagnetic forming coil (5
As shown in Fig. 8, a spirally wound coil (Ono) was used for the shape of No. 1, but it may also be a spiral-wound coil (1) as shown in Fig. 4. Also, a conductive thin plate material (9) has a thickness of 50
Although ILIn and ] 00Ps steel foil was used, any material other than steel foil can be punched as long as it is conductive and has a thickness of 5P scrap or a thin plate material.

The amount of energy of the electromagnetic force in the above electromagnetic forming is expressed by the following equation.

Quick* (3y, but] IC: energy amount (J), C: capacitor capacity (μF), V: charging voltage (KV).

For steel foil with plate thickness of 50p and m, O= ] 00/AF,
V-5KvK setting, energy 11250J, plate thickness 10
For the copper foil of 0 μm, punching was performed with settings of 0-1110 pF and V-'yKv, and energy t of 2450 J. Furthermore, various steel plates, ceramics, and tungsten carbide are used for the guide (8), and the slit (7) for forming the wiring pattern has a thickness o, which is formed by T-wire cut electric discharge machining method, laser processing method, or cutting process. A value in the range from s am to 101 may be used.

In addition, the punching process can be carried out even if the electromagnetic forming coil and the conductive thin plate material are in close contact with each other or with a certain distance between them. Furthermore, by attaching it to a Daicera T-press machine and continuously supplying the conductive thin plate material and the printed wiring pattern, it is possible to perform mass production by automatic punching.

Effects of the Invention As described above, according to the present invention, by using an electromagnetic forming coil and a die provided with a slit for the printed wiring pattern to form a printed wiring pattern, it is possible to remove a large amount of copper foil unlike the conventional subtractive method. There is no need to carry out electrocution or electric milling, and there is no need for treatment chemicals or wastewater treatment equipment, making it possible to manufacture the product in a short time and at low cost. Furthermore, unlike the Guistamp method, the invention is not limited by the type of printed wiring board, and has various effects such as making it possible to punch out precise wiring patterns and manufacturing highly accurate printed wiring boards.

[Brief explanation of drawings]

Fig. 1 is a schematic perspective view showing the electromagnetic forming method used in the present invention, Fig. 2 is a perspective view of the same printed wiring board, and Figs. 3 and 14 are perspective views of the electromagnetic forming coil used in the present invention, respectively. It is.

Claims (1)

[Claims] A conductive thin plate material is placed above a die with slits that form a wiring pattern, and an electromagnetic force is generated in an electromagnetic forming coil positioned above the conductive thin plate material. A printed wiring pattern punching method characterized by punching a conductive thin plate material into a wiring pattern shape.