GB883872A - Improvements in methods for producing electrically conductive circuit patterns - Google Patents

Improvements in methods for producing electrically conductive circuit patterns

Info

Publication number
GB883872A
GB883872A GB21304/59A GB2130459A GB883872A GB 883872 A GB883872 A GB 883872A GB 21304/59 A GB21304/59 A GB 21304/59A GB 2130459 A GB2130459 A GB 2130459A GB 883872 A GB883872 A GB 883872A
Authority
GB
United Kingdom
Prior art keywords
grid
punching
areas
lands
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB21304/59A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB883872A publication Critical patent/GB883872A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

883,872. Printed circuits. INTERNATIONAL BUSINESS MACHINES CORPORATION. June 22, 1959 [June 23, 1958], No. 21304/59. Class 37. [Also in Group XXII] A printed circuit pattern is produced by selectively punching a sheet of conductive material to form a grid leaving preselected areas unpunched, punching these areas to form lands connected to the grid strips, and subsequently removing selected portions of the grid. A copper foil 10 is coated on one side with a thermosetting adhesive, e.g. phenol-aldehyde urea-aldehyde, or melamine-aldehyde, and subjected to a first punching operation programmed to automatically remove selected rectangular areas to leave a grid pattern 14, and unpunched areas 12 (Fig. 1). The foil is then subjected to a second punching operation which removes portions of the areas 12 to leave lands 15 (Fig. 2), connected to the grid by bands 16, 18. A thermo-releasing adhesive, e.g. gum arabic gelatin or polyvinyl alcohol is next applied to the uncoated face of the lands, and a temporary support bonded to it. The grid is then subjected to a third punching process controlled by punched cards which severs the desired circuit (Fig. 4), the unwanted portions of which may then be removed to leave the required cut pattern (Fig. 5). The temporary support 19 is placed with the pattern in contact with an insulated panel in a heated press which bonds the circuit to the panel and releases it from the temporary support. Holes for mounting circuit components may then be punched through the lands. The sequence of the first two punching operations may be reversed, and the thermosetting adhesive applied at any stage in the operation. The automatic operations may all be controlled by punch cards and carried out by a single roving punch, or by rows of punches.
GB21304/59A 1958-06-23 1959-06-22 Improvements in methods for producing electrically conductive circuit patterns Expired GB883872A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US743682A US3059320A (en) 1958-06-23 1958-06-23 Method of making electrical circuit

Publications (1)

Publication Number Publication Date
GB883872A true GB883872A (en) 1961-12-06

Family

ID=24989747

Family Applications (1)

Application Number Title Priority Date Filing Date
GB21304/59A Expired GB883872A (en) 1958-06-23 1959-06-22 Improvements in methods for producing electrically conductive circuit patterns

Country Status (3)

Country Link
US (1) US3059320A (en)
FR (1) FR1235596A (en)
GB (1) GB883872A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4912288A (en) * 1985-09-04 1990-03-27 Allen-Bradley International Limited Moulded electric circuit package
US5220488A (en) * 1985-09-04 1993-06-15 Ufe Incorporated Injection molded printed circuits
DE10103193A1 (en) * 2001-01-24 2002-08-01 Heraeus Gmbh W C Process for the production of conductor track structures

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3158927A (en) * 1961-06-05 1964-12-01 Burroughs Corp Method of fabricating sub-miniature semiconductor matrix apparatus
US3256587A (en) * 1962-03-23 1966-06-21 Solid State Products Inc Method of making vertically and horizontally integrated microcircuitry
US3256465A (en) * 1962-06-08 1966-06-14 Signetics Corp Semiconductor device assembly with true metallurgical bonds
FR1344911A (en) * 1962-07-18 1963-12-06 Bull Sa Machines Improvements to modular blocks of electrical components
US4935090A (en) * 1981-09-03 1990-06-19 Gte Products Corporation Photoflash array quick-cure laminating process
US4452664A (en) * 1983-08-01 1984-06-05 General Electric Company Method for predetermining peel strength at copper/aluminum interface
US5049434A (en) * 1984-04-30 1991-09-17 National Starch And Chemical Investment Holding Corporation Pre-patterned device substrate device-attach adhesive transfer system
US4753694A (en) * 1986-05-02 1988-06-28 International Business Machines Corporation Process for forming multilayered ceramic substrate having solid metal conductors
FR2616995A1 (en) * 1987-06-22 1988-12-23 Ebauchesfabrik Eta Ag METHOD FOR MANUFACTURING ELECTRONIC MODULES
US5470644A (en) * 1994-04-21 1995-11-28 Durant; David Apparatus and method for fabrication of printed circuit boards
US5587890A (en) 1994-08-08 1996-12-24 Cooper Industries, Inc. Vehicle electric power distribution system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2623592A (en) * 1952-12-30 Card reproducing machine
US1794831A (en) * 1929-01-19 1931-03-03 Lionel Corp Multiple conductor strip and method of making the same
US2120461A (en) * 1938-02-28 1938-06-14 Copeman Lab Co Method of protecting and forming prefinished metal
US2613252A (en) * 1947-09-23 1952-10-07 Erie Resistor Corp Electric circuit and component
US2694249A (en) * 1948-04-16 1954-11-16 Kapp Robert Manufacturing method for complex electrical and wireless apparatus
US2724674A (en) * 1952-11-26 1955-11-22 Pritikin Nathan Printed circuit and method for producing the same
US2972003A (en) * 1956-02-21 1961-02-14 Rogers Corp Printed circuits and methods of making the same
US2929965A (en) * 1956-07-02 1960-03-22 Alonzo F Oden Mounting structures for electrical assemblies and methods of forming same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4912288A (en) * 1985-09-04 1990-03-27 Allen-Bradley International Limited Moulded electric circuit package
US5003693A (en) * 1985-09-04 1991-04-02 Allen-Bradley International Limited Manufacture of electrical circuits
US5220488A (en) * 1985-09-04 1993-06-15 Ufe Incorporated Injection molded printed circuits
DE10103193A1 (en) * 2001-01-24 2002-08-01 Heraeus Gmbh W C Process for the production of conductor track structures
DE10103193B4 (en) * 2001-01-24 2008-10-30 W.C. Heraeus Gmbh Method for producing printed conductor structures

Also Published As

Publication number Publication date
FR1235596A (en) 1960-07-08
US3059320A (en) 1962-10-23

Similar Documents

Publication Publication Date Title
GB883872A (en) Improvements in methods for producing electrically conductive circuit patterns
US2433384A (en) Method of manufacturing unitary multiple connections
US2955351A (en) Method of making a printed circuit
US4000558A (en) Process of fabricating wiring harness
GB1391038A (en) Photoetched inductor assembly and method of manufacturing same
GB866984A (en) Electrical wiring assembly
US2912746A (en) Method of making printed circuit panels
GB1316033A (en) Manufacture of printed circuits
US3916515A (en) Method of producing printed circuit board in multiple units
US3107414A (en) Method of forming circuit cards
US2971249A (en) Method for applying patterns to base material
GB1292466A (en) Method and apparatus for punching or embossing material
US3377698A (en) Method of making an electrical circuit
US3589224A (en) Die punching printed circuit
JPS6370489A (en) Method of working metal base printed wiring board
US2539874A (en) Card marker
JPS59215786A (en) Blank board for punching printed circuit board
GB775267A (en) Improvements in or relating to the production of tags or terminals on articles comprising an electrically conductive pattern on an insulating support
GB983846A (en) Improvements in printed circuit and method of making the same
GB989471A (en) A method of and means for making through connections in die-stamped circuit boards
JP3245231B2 (en) Manufacturing method of flat cable circuit
US3604110A (en) Method of making an electrical terminal board assembly
US4280977A (en) Method of working ceramic green sheet
DE1156131B (en) Method for producing an electrical conduction pattern
GB1166592A (en) Method and Apparatus for Forming Electric Motor Armatures