JPS61266582A - 錫又は錫合金の剥離液 - Google Patents

錫又は錫合金の剥離液

Info

Publication number
JPS61266582A
JPS61266582A JP11084485A JP11084485A JPS61266582A JP S61266582 A JPS61266582 A JP S61266582A JP 11084485 A JP11084485 A JP 11084485A JP 11084485 A JP11084485 A JP 11084485A JP S61266582 A JPS61266582 A JP S61266582A
Authority
JP
Japan
Prior art keywords
acid
tin
alloy
substrate
soln
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11084485A
Other languages
English (en)
Japanese (ja)
Other versions
JPS64469B2 (enrdf_load_stackoverflow
Inventor
Junichi Katayama
順一 片山
Yukio Nishihama
西浜 幸男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OKUNO SEIYAKU KOGYO KK
Okuno Chemical Industries Co Ltd
Original Assignee
OKUNO SEIYAKU KOGYO KK
Okuno Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OKUNO SEIYAKU KOGYO KK, Okuno Chemical Industries Co Ltd filed Critical OKUNO SEIYAKU KOGYO KK
Priority to JP11084485A priority Critical patent/JPS61266582A/ja
Publication of JPS61266582A publication Critical patent/JPS61266582A/ja
Publication of JPS64469B2 publication Critical patent/JPS64469B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/44Compositions for etching metallic material from a metallic material substrate of different composition
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/16Acidic compositions
    • C23F1/30Acidic compositions for etching other metallic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
JP11084485A 1985-05-22 1985-05-22 錫又は錫合金の剥離液 Granted JPS61266582A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11084485A JPS61266582A (ja) 1985-05-22 1985-05-22 錫又は錫合金の剥離液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11084485A JPS61266582A (ja) 1985-05-22 1985-05-22 錫又は錫合金の剥離液

Publications (2)

Publication Number Publication Date
JPS61266582A true JPS61266582A (ja) 1986-11-26
JPS64469B2 JPS64469B2 (enrdf_load_stackoverflow) 1989-01-06

Family

ID=14546093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11084485A Granted JPS61266582A (ja) 1985-05-22 1985-05-22 錫又は錫合金の剥離液

Country Status (1)

Country Link
JP (1) JPS61266582A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008106354A (ja) * 2006-09-25 2008-05-08 Mec Kk 金属除去液及びこれを用いた金属除去方法
JP2016148081A (ja) * 2015-02-12 2016-08-18 メック株式会社 エッチング液及びエッチング方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0353824A (ja) * 1989-07-21 1991-03-07 Toshiba Corp 養液制御装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5858280A (ja) * 1981-09-30 1983-04-06 Metsuku Kk 錫又は錫合金の剥離液

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5858280A (ja) * 1981-09-30 1983-04-06 Metsuku Kk 錫又は錫合金の剥離液

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008106354A (ja) * 2006-09-25 2008-05-08 Mec Kk 金属除去液及びこれを用いた金属除去方法
JP2016148081A (ja) * 2015-02-12 2016-08-18 メック株式会社 エッチング液及びエッチング方法

Also Published As

Publication number Publication date
JPS64469B2 (enrdf_load_stackoverflow) 1989-01-06

Similar Documents

Publication Publication Date Title
EP0438535B1 (en) Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces
US4004956A (en) Selectively stripping tin or tin-lead alloys from copper substrates
US4713144A (en) Composition and method for stripping films from printed circuit boards
US4410396A (en) Metal stripping composition and process
US3677949A (en) Selectively stripping tin and/or lead from copper substrates
JPH0151548B2 (enrdf_load_stackoverflow)
JPS59501751A (ja) 半田剥離用溶液
JP2571375B2 (ja) 水溶性レジストフイルム用剥離剤
JPH0375386A (ja) 錫又は錫‐鉛合金の剥離方法
JP4644365B2 (ja) 銅表面を前処理するための溶液及び方法
EP0418333B1 (en) Composition and method for stripping tin or tin-lead alloy from copper surfaces
US5017267A (en) Composition and method for stripping tin or tin-lead alloy from copper surfaces
JPS5877577A (ja) スプレ−操作により基体からスズ層もしくはスズ−鉛合金層のストリツピング用溶液
CN101713089A (zh) 金属表面处理水溶液和抑制金属表面晶须的方法
JP4143262B2 (ja) 銅表面の前処理のための方法
JPH02217431A (ja) 銅素地から錫、鉛、または錫・鉛合金析出物を剥離する方法と剥離用組成物
JPS61266582A (ja) 錫又は錫合金の剥離液
HK1010792B (en) Organic rust-proof treated copper foil
HK1010792A1 (en) Organic rust-proof treated copper foil
CA2090349C (en) Composition and method for stripping tin or tin-lead alloy from copper surfaces
JPH01129491A (ja) 錫または錫一鉛合金の剥離方法
GB2109820A (en) Metal stripping composition
JPS63161178A (ja) スズまたはスズ合金の剥離液
JPS6015707B2 (ja) 錫又は錫合金の剥離液
JPH1072682A (ja) 錫および錫合金の剥離液

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees