JPS61266541A - Copper alloy - Google Patents

Abstract

PURPOSE:To improve the strength and electric conductivity by an inexpensive composition by adding prescribed percentages of Ni, Al, P, Mg, Mn, Si, etc. CONSTITUTION:This Cu alloy consists of, by weight, 0.1-2% Ni, 0.1-3% Al, 0.01-0.15% P and the balance Cu or further contains 0.01-1.5% in total of one or more among 0.1-1% Mg, 0.01-0.6% Mn, 0.01-0.6% Si, 0.01-0.1% Zn, 0.01-0.1% B, 0.01-1% Cr and 0.01-0.3% Zr. The alloy is inexpensive, has superior strength and electric conductivity and is chiefly used as a material for a lead frame for a semiconductor.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention is for electronic equipment, mainly semiconductor IJ pS7.
This invention relates to a copper-based alloy used as a frame material.

(Prior art) Generally, Fe-
Although Ni-based 427α alloy has been used, copper-based alloys such as 195 alloy are becoming widely used as integrated circuits become more densely integrated.

(Problems to be Solved by the Invention) However, 42 alloy has the drawbacks of being expensive and inferior in heat dissipation properties required with recent high-density integration. - Even in copper-based alloys with excellent heat dissipation,
Cheap alloys such as 19470 lack mechanical strength, while 195 alloy, which has relatively high strength, has CO'f! f:
It has the disadvantage that it is expensive because it contains it.

(Means for Solving the Problems) The present invention has been made to improve the drawbacks of the 42% alloy and copper-based alloys, and uses inexpensive constituent elements.
The present invention provides a copper-based alloy that has heat dissipation properties equivalent to 70 I and high strength.

In general, in copper alloys, it is difficult to obtain contradictory properties such as high strength and high conductivity with alloys that are mainly solid solution hardened, such as 194 alloy, and in order to obtain these properties, age hardening and It is necessary to use methods such as making composite materials and dispersion strengthening using compounds. However, with the former method of age hardening and composite materials, it is difficult to achieve the goal of low cost.

That is, the present invention utilizes the latter compound dispersion strengthening, and the range of Ni and A4P in the components is set to the lower limit of the minimum amount necessary for the generation of intermetallic compounds, and the range of Ni and A4P is set to the lower limit of the minimum amount necessary for the generation of intermetallic compounds, so as to significantly impair conductivity. The upper limit was set as the amount without. Mg, M
n, Si has the effect of promoting the formation of intermetallic compounds and the effect of deoxidizing agent, and Zn has the effect of promoting the generation of intermetallic compounds and the effect of deoxidizing agent, and in addition to the effect of deoxidizing agent, Zn suppresses peeling due to the formation of a diffusion layer when solder plating is applied. It is intended for this purpose. Also B, C
r and Zr are intended to improve heat resistance and strength.

(Function) According to the present invention, the above-mentioned additive elements Ni, At, and P
) Ni-Ak*Ni-At, Ni-P, and other intermetallic compounds can be uniformly dispersed and generated in the structure, thereby making it possible to improve the strength of the alloy while suppressing a decrease in electrical conductivity.

(Example) The present invention will be specifically explained below with reference to Examples.

Examples 1-4. Comparative Examples 1 to 5 Each sample of the size shown in Table 1 was melted in a high-frequency furnace in the atmosphere, and the obtained ingot was hot rolled and then The sides were decorated. Next, cold rolling and annealing were repeated to obtain a rolled material having a final rolling ratio of 37 cm and a thickness of 0.25 cm.

The components of each of the obtained materials were analyzed and their properties were investigated, and the results are shown in Table 1.

According to the results in the table above, the alloy of the present invention has a conductivity of 33 to 41.
% lAC3 and hardness of 148 to 175', indicating that it has properties that can be used as a low-cost alternative to conventional alloys such as Thio 9 and Comparative Example 4.

In addition, although the main use of the present alloy is described as being for semiconductor glue-P frames, it has a strength equivalent to that of conventional phosphor bronze, several times the conductivity, and is inexpensive, so it can be used in electronic applications such as connectors. It is also extremely useful as a material for equipment.

(Effects of the Invention) As is clear from the above explanations and examples, according to the present invention, the strength equivalent to 19570 and 427
Semiconductor IJ has much better conductivity than 0
A material for -1';y frames is obtained, and its industrial use effect is extremely large.

Claims (2)

[Claims] (1) A copper-based alloy consisting of 0.1 to 2% Ni, 0.1 to 3% Al, 0.01 to 0.15% P, and the balance Cu and unavoidable impurities in weight percent. (2) 0.1-1% Mg in the above components, 0.01-0.
6% Mn, 0.01-0.6% Si, 0.01-0
．． 1% Zn, 0.01-0.1% B, 0.01-1
．． Contains one or more of 0% Cr and 0.01 to 0.3% Zr, and the total content is 0.01 to 1.5
% of the copper-based alloy according to claim (1).