JPS61263117A - Mask plate for manufacturing semiconductor device - Google Patents

Abstract

PURPOSE:To obtain a mask plate which can describe a discrimination information on a wafer in the process of manufacturing the wafer by making each chip area of the semiconductor wafer with a pattern region for forming a required pattern, a mask region of a definite width and a transparent region formed to describe an information in the mask region. CONSTITUTION:A mask plate 10 is formed with a pattern mask region 13 where a pattern for forming an Al pattern in each chip area of a wafer 1 on a glass plate 11 is drawn and a transparent region 14 where characters to be made white color in the mask region 13 are provided. The wafer 1 is placed at the lower part of the mask plate 10 and after being positioned, the wafer 1 is processed by photo etching by irradiating light from the upper part of the mask plate 10 and a required Al pattern corresponding to the pattern is formed in each chip area 4 of the wafer 1. Simultaneously, a character pattern formed by the mask region 13 and the transparent region 14 of the mask plate 10 is formed as it is in the facet cut region 3 of the wafer 1. If the character pattern is used for discrimination data, the discrimination data can be described in the wafer 1 simultaneously with the formation of the pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a mask plate for manufacturing semiconductor devices, and particularly to a mask plate on which information such as characters can be attached to facet cut portions of a wafer.

(b) Conventional technology In general, semiconductor wafers are manufactured through the process of forming each layer and electrode.
Alternatively, during the transportation process, it may be pinched in the bin set due to handling. In this case, there is a risk of damaging the wafer surface if the parts are pinched too tightly. Therefore, as shown in FIG.
A facet cut portion (portion 3 excluding the chip area 4 for obtaining regular chips) is previously formed inside the wafer 1, and when handling the wafer 1, the facet cut portion 3 is pinched with tweezers.

On the other hand, when manufacturing wafers, there are cases where it is desired to add identification information such as a loft number and model number, but conventionally, this information has been written on the back side of the wafer or on the storage container, etc., as required.

(c) Problems to be Solved by the Invention The addition of identification information according to the above-mentioned conventional technology is time-consuming because it is entered separately from the manufacturing process such as wafer layer formation and electrode formation. Ta. Furthermore, when writing on a wafer, the scratches may cause the wafer to crack, and the writing may generate dust.

In view of the above, this invention provides that, without any special treatment,
It is an object of the present invention to provide a mask plate on which identification information can be added to a wafer during the wafer manufacturing process.

(d) Means and operation for solving the problems The mask plate of the present invention includes a pattern section for forming a desired pattern in each chip area of a semiconductor wafer, and a pattern section provided adjacent to the pattern section. It is composed of a mask portion having a predetermined width and a transparent portion formed within the mask portion in an information-expressing manner.

When forming a pattern on a semiconductor wafer using this mask plate, the original layers and electrodes are formed on each chip by the pattern of the pattern section by light projection from above the mask plate. Identification information expressed in the transparent part is simultaneously added and formed on the facet cut part of the wafer by the mask part and the transparent part in the information expression mode.

(E) Examples The present invention will be explained in more detail with reference to Examples below.

FIG. 1 is a plan view of a mask plate showing an embodiment of the present invention. This example mask plate has Atl (
Aluminum) is used when forming patterns.

In FIG. 1, the mask plate 10 includes a pattern mask (solid black) part 13 on which a pattern for forming an Al pattern in each chip area of the wafer 1 is drawn on a glass plate ll, and a pattern mask part 13 (solid black) on which a pattern for forming an Al pattern is drawn in each chip area of the wafer 1. A transparent portion 14 having white characters is formed on the transparent portion 14 .

To form an Af pattern on the wafer 1, the wafer 1 is placed below the mask plate 10, and the wafer 1 is moved and positioned at a predetermined position. Positioning is performed using a positioning chip that has already been formed in the first step.

After positioning, the wafer 1 is photoetched by irradiating light from above the mask plate 10, and a predetermined Al pattern corresponding to the pattern is formed in each chip area 4 of the wafer 1. At the same time, the mask portion 13 and transparent portion 14 of the mask plate 10 are attached to the facet cut portion 3 of the wafer 1.
The character pattern formed by is formed as is. If the character pattern of the transparent portion 14 is used as identification data, the identification data can be added to the wafer 1 at the same time as the Al pattern is formed on each chip area 4 as described above.

The facet cut portion 3 of the wafer 1 is formed by photoetching using a mask plate 20 shown in FIG. 2 in the first step.

This mask plate 20 includes, on a glass plate 21, a pattern section 22 for pattern formation of each chip area, a band-shaped transparent section 23 provided adjacent to this pattern section 22, and an outer side of this transparent section 23 ( (opposite side to pattern section 22)
A band-shaped mask (solid black) portion 24 provided adjacent to the mask portion 24 is formed respectively.

In the first step, the wafer 1 is moved below the mask plate 20 and visually inspected from above the transparent part 23.
Align the orientation flat 2 with the edge 24a of the mask portion 24. Then, light is irradiated from above the mask plate 20. As a result, the wafer 1 is canted from the orientation flat 2 by the width t of the transparent portion 230, and a facet cut portion 3 having a constant width is always obtained.

If the mask plate shown in FIG. 1 is used in the Al pattern forming process after the first process using this mask plate 20, the facet cut portion 3 will be formed with two layers, the first layer and the A2 pattern layer. The cut portion can be completely removed, and identification data such as the chip name can be added.

In the above embodiment, the mask plate used in the AN pattern forming process has been described, but if mask plates for other processes are configured in the same way, each process number can be added to the wafer.

(f) Effects of the Invention According to the present invention, information is displayed on the facet cut portions at the same time as the pattern is formed on each chip area of the wafer, so various identifications can be made without the need for any special processing. Information can be added.

Also, if this type of mask plate is used in two or more processes,
The faceted cut portion of the sea urchin can be cut out more reliably.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a mask plate showing an embodiment of the present invention, FIG. 2 is a plan view of a mask plate used in a first step before the mask plate of FIG. 1 is used, and FIG. FIG. 3 is a plan view of the wafer. 1: wafer, 3: facet cut section, 4: chip area, 10: mask plate, 11 glass plate, 12: pattern section, 13: mask section, 14: transparent section. Patent applicant ROHM Co., Ltd. agent
Patent Attorney Shigeru Nakamura Figure 1 Figure 2

Claims (1)

[Claims] (1) A pattern section for forming a required pattern in each chip area of a semiconductor wafer, a mask section with a required width provided adjacent to the pattern section, and information representation forms formed in the mask section. A mask plate for manufacturing semiconductor devices consisting of a transparent part and a transparent part.