JPS60171281A - Glazed ceramic substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a glazed ceramic substrate that is applied to various circuit elements and the like.

゛ Generally, this type of glazed ceramic substrate has
As shown in FIG. 1, there is a ceramic substrate a in which a glaze Nb is laminated over the entire surface.

In this glazed ceramic substrate, the glaze Nb
If it is simply molded, the end portion will bulge due to surface tension, etc., and a thick portion C will be formed over the entire circumference. If this thick portion C remains, it will have an adverse effect on the pattern ellipse formed using photolithography technology in a subsequent process. Therefore, after forming the glaze layer, this thick inner portion C is cut out.

Therefore, as shown in FIG. 2, a V-shaped snap '/1IId has conventionally been formed on the back surface of the end portion of the ceramic substrate a over the entire circumference. This snap groove d is provided, for example, about 2 to 5 degrees inward from the end surface, and after forming the glaze layer, the edge of the ceramic substrate a and the glaze layer are formed along this snap groove d, as shown in FIG. The thick part C was removed.

However, in this glazed ceramic substrate, when the thick portion C is removed, the upper end corner e of the glaze layer remains as an acute angle. Then, during exposure in the photoregistration process, as shown in FIG.
If warpage or waviness occurs in the photomask f, the corner e may damage the photomask f, which is one of the causes of defects. In addition, there is a problem in that chipping and cracking are likely to occur if the corner e remains acute in subsequent various processing steps.

This invention has been made in view of the above, and is designed to prevent the photomask from being scratched and to prevent chipping and cracking by rounding the upper corner of the glaze layer after cutting. The object of the present invention is to provide a glazed ceramic substrate having a high temperature.

That is, in order to achieve the above-mentioned object, the present invention has a recess formed on the end surface of a ceramic substrate over the entire circumference, and a snap groove formed over the entire circumference on the back surface of the end. The glaze layer is formed at a position corresponding to the groove, the glaze layer is slightly recessed and laminated over the entire surface of the ceramic substrate, and the ends of the ceramic substrate and the glaze layer are cut along the snap groove. has been done.

Hereinafter, one embodiment of the present invention will be described in detail based on the drawings.

As shown in FIGS. 5 to 8, a glazed ceramic substrate 1 serves as a substrate for various circuit elements, and is composed of a ceramic substrate 2 and a glaze layer 3.

This ceramic substrate 2 is formed into a rectangular flat plate, for example, and has a recess 4 formed on its front surface (upper surface) and a snap groove 5 formed on its back surface (lower surface).

The recess 4 has a V-shaped cross section, is formed approximately 2 to 5+n inward from the end surface of the ceramic substrate 2, and is provided along the entire circumference of the end surface. Further, the upper end corner of the recess 4 is slightly rounded and recessed from the surface of the ceramic substrate 2 with a slightly rounded shape.

On the other hand, the snap groove 5 is also formed to have a V-shaped cross section, and is formed about 2 to 5 fins inward from the end surface of the ceramic substrate 2 at a position corresponding to the recess, and is provided along the entire circumference of the end surface. Therefore, a recess 4 and a snap groove 5 are separately provided in the ceramic substrate 2 so as to face each other from the front and back.

The glaze layer 3 is formed on the surface (upper surface) of the ceramic substrate 2.
The entire surface is laminated and molded. In the glaze N3, a depression 6 is formed at the depression 4 portion, and a thick portion 7 is formed at the end of the ceramic substrate 2 by swelling due to surface tension or the like.

The ends of the ceramic substrate 2 and the glaze layer 3 are cut along the snap m5.

Next, a method for producing the glazed ceramic base Fi1 will be described.

First, as shown in FIG. 5, before the ceramic substrate 2 is sintered and formed, protrusions are formed on a mold, and this mold is used to form the ceramic substrate 2 into a flat plate shape, and at the same time, the recesses 4 are formed at the edges. Molded on the entire circumference of the surface. Then, this ceramic substrate 2 is sintered.

Subsequently, as shown in FIG. 6, a glaze layer 3 is laminated on the surface of the ceramic substrate 2. When this glaze layer 3 is molded, it swells at the end of the ceramic substrate 2 due to surface tension or the like, resulting in a thick portion 7. Furthermore, a recess 6 is formed along with the recess 4, and this recess 6 is formed inside the thick portion 7 and is gently recessed from the surface.

Subsequently, as shown in FIG. 7, snap grooves 5 are formed on the back surface of the ceramic substrate 2 by laser processing. This snap groove 5 is formed at a position corresponding to the recess 4 over the entire circumference of the back surface of the end portion.

Finally, as shown in FIG. 8, snap the ends of the ceramic substrate 2 and glaze layer 3 together. Break along la 5. As a result, the thick part 7 of the glaze layer 3 is removed, and a flat glaze layer 3 is laminated onto the ceramic substrate 2. Furthermore, since the glaze layer 3 is broken at the recess 6, the upper corner corner R will be added to.

In this glazed ceramic substrate 1, the snap grooves 5 are provided separately because if only the recesses 4 were formed, the glaze layer 3 would be laminated on the recesses 4 as well and would not break.

In this example, the recesses 4 were formed in the mold before sintering, and the snap grooves 5 were formed separately in the ceramic substrate 2 after the glaze layer 3 was formed. This is because if the recess 4 and the snap groove 5 are simultaneously molded using the mold of the ceramic substrate 2 before sintering, the space between the recess 4 and the snap/145 will become thin, which will cause cracks during sintering. It is. However, if the ceramic substrate 2 is thick, the recesses 4 and the snap grooves 5 may be formed simultaneously using a mold before sintering.

Further, although the recess 4 in the embodiment has a V-shaped cross section, it may also have a U-shaped cross section, as long as the recess 6 in the glaze layer 3 is formed gently.

As described above, according to the glazed ceramic substrate of the present invention, recesses and snap grooves are formed on the front and back surfaces of the end portion of the ceramic substrate, recesses are formed in the glaze layer, and cutting is performed at the recessed portions. Since a radius is added to the corner of the end face of the glaze layer after cutting, it is possible to reliably prevent damage to the photomask during exposure in the photoresist process, thereby preventing the occurrence of defective products. can.

In addition, since the end face corners of the glaze layer are not acute angles as in the conventional case, chipping and cracking in subsequent processes can be reliably prevented.

[Brief explanation of the drawing]

1 to 4 show a conventional example, where FIG. 1 is a perspective view of a glazed ceramic substrate, FIG. 2 is a sectional view of the same, FIG. 3 is a sectional view of the same after cutting the end, and FIG. 5 to 8 show an embodiment of the present invention, and FIG. 5 is a sectional view of the ceramic substrate, and FIG. 6 is a sectional view of the glazed ceramic substrate after forming the glaze layer. A cross-sectional view of the ceramic board, FIG. 7 is a cross-sectional view of the same after forming the snap grooves,
FIG. 8 is a sectional view of the same after the end is cut. 1: Glazed ceramic substrate, 2: Ceramic substrate, 3: Glaze layer, 4: Recess, 5
Nisnap groove, 6: recess, 7: thick wall part. Figure 2 Figure 5 Figure 6 Figure 7

Claims (1)

[Claims] (1) In a glazed ceramic substrate in which a glaze layer is laminated over the entire surface of the ceramic substrate, a recess is formed around the entire circumference on the end surface of the ceramic substrate, while a recess is formed on the back surface of the end portion. Snap grooves are formed around the entire circumference at positions corresponding to the recesses, the glaze layer is slightly recessed in the recesses, and is laminated over the entire surface of the ceramic substrate, and the ceramic substrate and the glaze are formed along the snap grooves. A glazed ceramic substrate characterized in that the edges of the layers are cut.