JPS6126285A - Leadless part - Google Patents
Leadless partInfo
- Publication number
- JPS6126285A JPS6126285A JP14643784A JP14643784A JPS6126285A JP S6126285 A JPS6126285 A JP S6126285A JP 14643784 A JP14643784 A JP 14643784A JP 14643784 A JP14643784 A JP 14643784A JP S6126285 A JPS6126285 A JP S6126285A
- Authority
- JP
- Japan
- Prior art keywords
- leadless
- terminal
- component
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、印刷配線基板の導体ランドに面対向で半田接
合される電子部品に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component that is soldered to a conductive land of a printed wiring board in a face-to-face manner.
従来例の構成とその問題点
近年、電子機器においては小型薄型化が要望され、部品
取付手法の改善に伴なって電子部品はリードレス化によ
シ小型薄型化が急速に実現されてきている。従来から小
型機器に使用するリードレス部品の印刷配線基板への接
続方法としては、印刷配線基板にリードレス部品の端子
をディップ法により半田付けする方法、リードレス部品
の端子をクリーム半田によって印刷配線基板に半田付け
する方法とが用いられてきている。Conventional configurations and their problems In recent years, there has been a demand for electronic devices to be smaller and thinner, and with improvements in component mounting methods, electronic components are rapidly becoming smaller and thinner by becoming leadless. . Conventional methods for connecting leadless components used in small devices to printed wiring boards include soldering the terminals of leadless components to the printed wiring board using the dip method, and printing wiring using cream solder to solder the terminals of leadless components to the printed wiring board. A method of soldering to a board has been used.
このような接続方法に供するリードレス部品としては、
第1図に示すようにコンデンサ、抵抗。Leadless components for this type of connection method include:
Capacitors and resistors as shown in Figure 1.
コイル等のチップ部品本体1の両端に電極端子2を設け
たもの、第2図に示すように電解コンデンサ、可変コイ
ル等の部品本体3の下面基台に端子6を設けたもの、第
3図に示すように容量を可変するだめのシャフト8を有
するバリコン本体6の両側に下面と同一平面となるよう
に端子7を設けたもの等が知られている。One in which electrode terminals 2 are provided at both ends of a chip component body 1 such as a coil, one in which terminals 6 are provided on the lower base of a component body 3 such as an electrolytic capacitor or variable coil as shown in FIG. As shown in FIG. 2, a variable capacitor main body 6 having a shaft 8 for varying the capacity is provided with terminals 7 on both sides thereof so as to be flush with the lower surface.
しかしながら、このような従来のリードレス部品は印刷
配線基板の導体ランドに面対向で半田接合される端子が
導体ランドとの対向面で平面的なものであるため、半田
接合強度を大きく取りにくいという欠点を有していた。However, in such conventional leadless components, the terminals that are soldered to the conductor lands of the printed wiring board face-to-face are flat on the surface facing the conductor lands, making it difficult to maintain a high solder joint strength. It had drawbacks.
発明の目的
本発明の目的は、印刷配線基板の導体ランドとの半田接
合強度を向上させることができるリードレス部品を提供
することにある。OBJECTS OF THE INVENTION An object of the present invention is to provide a leadless component that can improve the strength of solder joints with conductor lands of a printed wiring board.
′発明の構成
本発明のリードレス部品は、印刷配線基板の導6体ラン
ドに面対向で半田接合される部品本体の端子に、この端
子の下面より側面外方に通じる開放孔を形成したことを
特長とするものである。'Structure of the Invention In the leadless component of the present invention, an open hole is formed in the terminal of the component body, which is soldered to the conductor land of the printed wiring board face-to-face, and that communicates from the lower surface of the terminal to the outside of the side surface. It is characterized by:
実施例の説明
第4図および第6図は本発明の一実施例を示すとおシ、
9は容量を可変するためのシャフト11を有するバリコ
ン本体であり、その両側にバリコン本体9の下面と同一
平面とがるように端子10が突設されている。そして、
この端子10の下面には溝10’が設けである。このリ
ードレス部品は印刷配線基板の導体ランドに端子10が
面対向するように装着したとき、部分的に上記導体ラン
ドとの間に溝10’による隙間が構成されるため、この
隙間に半田が浸入して導体ランドとの半田接合強度を大
きくすることができる。DESCRIPTION OF EMBODIMENTS FIGS. 4 and 6 show an embodiment of the present invention.
Reference numeral 9 denotes a variable capacitor body having a shaft 11 for varying the capacity, and terminals 10 are protruded from both sides of the variable capacitor body so as to be flush with the lower surface of the variable capacitor body 9. and,
A groove 10' is provided on the lower surface of this terminal 10. When this leadless component is mounted so that the terminal 10 faces the conductor land of the printed wiring board, a gap is partially formed between the conductor land and the groove 10', so that the solder does not fill this gap. The solder joint strength with the conductor land can be increased by penetrating the conductor land.
“なお、上記の実施例ではバリコン本体9の両側端より
端子を突設するものについて説明したが、これ以外にも
第6図および第8図に示すようにバリコン本体9の下面
に端子16.19を設けてもよく、この場合端子1e)
、19には第7図および第8図に示すように切欠き16
′や貫通孔19′を設けることによシ、下面から外側面
に至る開放孔としてもよい。In the above embodiment, the terminals are provided protruding from both ends of the variable capacitor main body 9, but in addition to this, as shown in FIGS. 6 and 8, terminals 16. 19 may be provided, in which case the terminal 1e)
, 19 has a notch 16 as shown in FIGS. 7 and 8.
By providing a through hole 19' or a through hole 19', an open hole extending from the lower surface to the outer surface may be formed.
発明の効果
以上の説明から明らかなように本発明によれば、リード
レス部品の端子に、下面から外側に通じる開放孔を設け
たので、上記リードレス部品の端子を印刷配線基板の導
体ランドに面対向で半田接合したとき上記開放孔内に半
田が浸入することによシ半田接合面が増大し、半田接合
強度を向上させることができる利点を有する。Effects of the Invention As is clear from the above description, according to the present invention, the terminal of the leadless component is provided with an open hole that communicates from the bottom surface to the outside, so that the terminal of the leadless component can be connected to the conductor land of the printed wiring board. When solder bonding is performed with the surfaces facing each other, the solder infiltrates into the open hole, thereby increasing the solder bonding surface, which has the advantage that the solder bonding strength can be improved.
第1図および第2図は従来のリードレス部品の斜視図、
第3図は同じくリードレス部品の側面図、第4図は本発
明のリードレス部品の一実施例を示す側面図、第6図は
その要部拡大斜視図、第6図および第8図は他の実施例
を示す側面図、第7図および第9図はその要部拡大斜視
図である。
9・・・・・・バリコン本体、10,16.1g・・・
・・・端子、10’・・・・・・溝、16′・・・・・
・切欠き、19′・・・・・・貫通孔。
代理人の氏名 弁理士 中 尾 敏 男 ほか1名WI
i1!!!!!
!
第2図
憾 憾 ゛Figures 1 and 2 are perspective views of conventional leadless components;
3 is a side view of the same leadless component, FIG. 4 is a side view showing one embodiment of the leadless component of the present invention, FIG. 6 is an enlarged perspective view of the main part, and FIGS. 6 and 8 are A side view showing another embodiment, and FIGS. 7 and 9 are enlarged perspective views of the main parts thereof. 9...Varicon main body, 10, 16.1g...
...Terminal, 10'...Groove, 16'...
・Notch, 19'...Through hole. Name of agent: Patent attorney Toshio Nakao and one other WI
i1! ! ! ! ! ! Figure 2 Sorry ゛
Claims (1)
品本体の端子に、この端子の下面より側面外方に通じる
開放孔を形成してなることを特徴とするリードレス部品
。A leadless component characterized in that a terminal of a component body that is soldered face-to-face to a conductor land of a printed wiring board is formed with an open hole that communicates from the bottom surface of the terminal to the outside of the side surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14643784A JPS6126285A (en) | 1984-07-13 | 1984-07-13 | Leadless part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14643784A JPS6126285A (en) | 1984-07-13 | 1984-07-13 | Leadless part |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6126285A true JPS6126285A (en) | 1986-02-05 |
Family
ID=15407641
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14643784A Pending JPS6126285A (en) | 1984-07-13 | 1984-07-13 | Leadless part |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6126285A (en) |
-
1984
- 1984-07-13 JP JP14643784A patent/JPS6126285A/en active Pending
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