JPS6126285A - Leadless part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component that is soldered to a conductive land of a printed wiring board in a face-to-face manner.

Conventional configurations and their problems In recent years, there has been a demand for electronic devices to be smaller and thinner, and with improvements in component mounting methods, electronic components are rapidly becoming smaller and thinner by becoming leadless. . Conventional methods for connecting leadless components used in small devices to printed wiring boards include soldering the terminals of leadless components to the printed wiring board using the dip method, and printing wiring using cream solder to solder the terminals of leadless components to the printed wiring board. A method of soldering to a board has been used.

Leadless components for this type of connection method include:
Capacitors and resistors as shown in Figure 1.

One in which electrode terminals 2 are provided at both ends of a chip component body 1 such as a coil, one in which terminals 6 are provided on the lower base of a component body 3 such as an electrolytic capacitor or variable coil as shown in FIG. As shown in FIG. 2, a variable capacitor main body 6 having a shaft 8 for varying the capacity is provided with terminals 7 on both sides thereof so as to be flush with the lower surface.

However, in such conventional leadless components, the terminals that are soldered to the conductor lands of the printed wiring board face-to-face are flat on the surface facing the conductor lands, making it difficult to maintain a high solder joint strength. It had drawbacks.

OBJECTS OF THE INVENTION An object of the present invention is to provide a leadless component that can improve the strength of solder joints with conductor lands of a printed wiring board.

'Structure of the Invention In the leadless component of the present invention, an open hole is formed in the terminal of the component body, which is soldered to the conductor land of the printed wiring board face-to-face, and that communicates from the lower surface of the terminal to the outside of the side surface. It is characterized by:

DESCRIPTION OF EMBODIMENTS FIGS. 4 and 6 show an embodiment of the present invention.
Reference numeral 9 denotes a variable capacitor body having a shaft 11 for varying the capacity, and terminals 10 are protruded from both sides of the variable capacitor body so as to be flush with the lower surface of the variable capacitor body 9. and,
A groove 10' is provided on the lower surface of this terminal 10. When this leadless component is mounted so that the terminal 10 faces the conductor land of the printed wiring board, a gap is partially formed between the conductor land and the groove 10', so that the solder does not fill this gap. The solder joint strength with the conductor land can be increased by penetrating the conductor land.

In the above embodiment, the terminals are provided protruding from both ends of the variable capacitor main body 9, but in addition to this, as shown in FIGS. 6 and 8, terminals 16. 19 may be provided, in which case the terminal 1e)
, 19 has a notch 16 as shown in FIGS. 7 and 8.
By providing a through hole 19' or a through hole 19', an open hole extending from the lower surface to the outer surface may be formed.

Effects of the Invention As is clear from the above description, according to the present invention, the terminal of the leadless component is provided with an open hole that communicates from the bottom surface to the outside, so that the terminal of the leadless component can be connected to the conductor land of the printed wiring board. When solder bonding is performed with the surfaces facing each other, the solder infiltrates into the open hole, thereby increasing the solder bonding surface, which has the advantage that the solder bonding strength can be improved.

[Brief explanation of drawings]

Figures 1 and 2 are perspective views of conventional leadless components;
3 is a side view of the same leadless component, FIG. 4 is a side view showing one embodiment of the leadless component of the present invention, FIG. 6 is an enlarged perspective view of the main part, and FIGS. 6 and 8 are A side view showing another embodiment, and FIGS. 7 and 9 are enlarged perspective views of the main parts thereof. 9...Varicon main body, 10, 16.1g...
...Terminal, 10'...Groove, 16'...
・Notch, 19'...Through hole. Name of agent: Patent attorney Toshio Nakao and one other WI
i1! ! ! ! ! ! Figure 2 Sorry ゛

Claims (1)

[Claims] A leadless component characterized in that a terminal of a component body that is soldered face-to-face to a conductor land of a printed wiring board is formed with an open hole that communicates from the bottom surface of the terminal to the outside of the side surface.