JPS61260624A - Infrared ray lamp heat treatment device - Google Patents

Abstract

PURPOSE:To contrive to improve the uniformity of the surface temperatures of objects to be heated using the title device by a method wherein the device is provided with heat-resistant thin plates, which are set up in the heat-resistant container in such a way as to surround the periphery of the supporting stand, whereon the objects to be heated are disposed, and are turned into the secondary heat sources without allowing light to transmit. CONSTITUTION:This infrared ray lamp heat treatment device is provided with heat-resistant thin plates 11, which are set up in a heat-resistant container 3 in such a way as to surround the periphery of a supporting stand 4, whereon objects to be heated are disposed, and are turned into the secondary heat sources without allowing light to transmit. By this constitution, the thin plates 11 to be irradiated with the rays of light of infrared ray lamps 6 are turned into the secondary heat sources and the objects to be heated are uniformly heated. Accordingly, the uniformity of the surface temperatures of the objects to be heated is improved and even when the objects to be heated are held vertically or slantingly, the uniformity of the surface tempertures is not deteriorated.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an infrared lamp heat treatment apparatus in an N2 or H2 gas atmosphere, and in particular to a heat treatment apparatus for silicon wafers used in the semiconductor industry.

Conventional technology originally employed a method of heating in an electric furnace for heat treatment equipment. However, when performing heating and cooling in a gas atmosphere, an electric furnace cannot perform rapid heating and cooling due to its large heat capacity. Therefore, in recent years, infrared lamp heat treatment equipment that is capable of rapid heating and rapid cooling has attracted attention because the heat capacity of the equipment itself is small.

As shown in FIG. 3, a conventional infrared lamp heat treatment apparatus has a structure in which a support plate 34 with a semiconductor wafer 35 placed horizontally is inserted into a quartz container 33 having a gas supply port 31 and a gas exhaust port 32. Then, the quartz container 33 is heated with an infrared lamp 36 while flowing N2 gas from the gas supply port 31. The quartz container 33 is air-cooled from its surroundings so that it does not get heated during heating.

Further, 37 is an anti-tA! which collects the light beam of the infrared lamp 36 inside the quartz container 33 in order to utilize the light beam of the infrared lamp 36 effectively. It is 1. Reference numeral 38 denotes a supply pipe made of quartz glass and having porous holes for supplying gas in a distributed manner. 39
is an O-ring, and 40 is a lid.

Problems to be Solved by the Invention However, in the above configuration, the infrared lamp 36
Since the light beam is directly irradiated onto the surface of the semiconductor wafer 5, the amount of light on the surface becomes uneven, and the semiconductor wafer 3
5 had a problem in that the temperature on the surface became non-uniform. Furthermore, since the semiconductor wafer 5 is supported horizontally, the number of semiconductor wafers 35 that can be processed at one time is extremely small.

The present invention solves the above-mentioned problems, and provides an infrared lamp heat treatment apparatus capable of rapid heating and rapid cooling, which has excellent temperature uniformity on the surface of semiconductor wafers, and can process a large number of semiconductor wafers at once. It is.

Means for Solving and Overcoming the Problems In order to solve the above-mentioned problems, the present invention provides a heat-resistant container that has a gas supply port and a gas exhaust port and that transmits light, and a heat-resistant container that is disposed outside the heat-resistant container. an infrared lamp for irradiating the inside of the heat-resistant container with heating light; ff1l[E
The heat-resistant thin plate is installed in the heat-resistant container so as to surround the heat-resistant container, and serves as a secondary heat source without transmitting light.

It is clear that with this configuration, the number of objects to be heated can be held perpendicular or at an angle, making it possible to process large quantities. However, in a conventional device, if the device is held vertically or inclined, the amount of light applied to the surface of the object to be heated becomes even more uneven, leading to deterioration of thermal uniformity. Therefore, if a heat-resistant thin plate is installed inside the container so as to surround the support base on which the heated object is placed, the heat-resistant thin plate that is irradiated with the infrared lamp's light becomes a secondary light source, which causes the heated object to be heated. is heated. At this time, the radiation from the heat-resistant thin plate onto the object to be heated becomes extremely uniform compared to the case where the infrared lamp's light beam is directly irradiated without installing the heat-resistant thin plate.

Therefore, the uniformity of the surface temperature of the object to be heated is improved, and even if the object to be heated is held vertically or inclined, the uniformity of temperature will not deteriorate. Further, during heating, the heat-resistant container is air-cooled from its surroundings, but since the heat-resistant thin plate is installed inside the heat-resistant container, the cooling characteristics of the heat-resistant container itself are not impaired. Furthermore, since the heat-resistant thin plate has an extremely small heat capacity, it does not affect the properties of rapid heating and cooling.

EXAMPLE An example of the present invention will be described below with reference to the drawings.

FIG. 1 shows an infrared lamp heat treatment apparatus in one embodiment of the present invention. In FIG. 1, 1 is a gas supply ['', 2 is a gas v1 vent, 3 is a quartz container, 4 is a support made of quartz glass on which a large number of semiconductor wafers 5 can be vertically arranged, and 6 is an infrared lamp. , 7 is a reflecting mirror that collects the light beam of the infrared lamp 6 inside the quartz container 3; 8 is a gas supply pipe made of quartz glass having multiple holes for dispersing and supplying gas; 9 is an O-ring; Reference numeral 10 denotes a heat-resistant thin plate, and 11 is a cylindrical heat-resistant thin plate formed of a thin stainless steel plate (thickness 0.1 #lIl+) inside the quartz container. FIG. 2 is a sectional view along line A in FIG. 1.

FIG. 4 shows the temperature distribution on the semiconductor wafer 5 placed near the center of the quartz container 3 when heated while supplying N2 gas at 10 Q/min in such an apparatus. As shown in FIG. 4, nine measurement points were selected along the vertical and horizontal center lines, and the thermocouples were fixed on the semiconductor wafer 5 for measurement. In the figure, the solid line is the result in this example. The broken line is the result obtained by the apparatus in which the cylindrical heat-resistant thin plate 11 was removed from the present example, and the apparatus according to the conventional example shown in FIG. 3 had almost the same variation in temperature distribution.

As is clear from FIG. 4J, by installing the cylindrical heat-resistant thin plate 11, the temperature uniformity of the semiconductor wafers 5 and L is improved.

Although stainless steel is used as the cylindrical heat-resistant thin plate 11 in this embodiment, materials containing molybdenum, titanium, platinum, etc. may also be used.

Furthermore, although the 6-English container 3 was used in this embodiment, any light-transmissive, heat-resistant container may be used. Further, in this embodiment, the semiconductor tube 71c5 is arranged vertically, but it may be arranged at an inclined angle.

Effects of the Invention As described above, the present invention provides a support base on which a plurality of thin plate-shaped objects to be heated can be arranged vertically or obliquely, and a heat-resistant structure for arranging the objects to be heated and surrounding the support stand. By installing a heat-resistant thin plate that is installed inside the heating container and acts as a secondary heat source without transmitting light, the object to be heated can be treated in large quantities at one time, improving the uniformity of the surface temperature of the object to be heated. and enables rapid heating and cooling.

[Brief explanation of the drawing]

Fig. 1 is a sectional view of the infrared lamp heat treatment apparatus in this embodiment, Fig. 2 is a sectional view taken along the line △-A in Fig. 1, Fig. 3 is a sectional view of the conventional infrared lamp heat treatment apparatus, and Fig. 4 is the invention. FIG. 3 is a diagram showing the temperature distribution of the semiconductor tube heated by the apparatus in which the cylindrical heat-resistant thin plate is removed from the present invention. 3... Heat-resistant container, 4... Support stand, 5... Semiconductor tube, 6... Infrared lamp, 7... Reflector, 11
...Heat-resistant thin plate agent Yoshihiro Morimoto") I
/)Nt% Temperature (1C)

Claims (1)

[Claims] 1. A heat-resistant container that has a gas supply port and a gas exhaust port and that transmits light; an infrared lamp that is placed outside the heat-resistant container and irradiates the inside of the heat-resistant container with heating light; A reflecting mirror having a reflective surface for concentrating light beams emitted from the infrared lamp onto the heat-resistant container, and a plurality of thin plate-shaped objects to be heated inside the heat-resistant container are arranged vertically or at an angle. An infrared lamp heat treatment device comprising: a support base; and a heat-resistant thin plate that is installed in the heat-resistant container so as to surround the support base on which an object to be heated is disposed, and serves as a secondary heat source without transmitting light.