JP2003234303A - Heat treatment device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the uniformity of temperature in a heat treatment device for heating a substrate. <P>SOLUTION: This heat treatment device 1 is provided with an upper stage lamp group 41 turning toward a specified direction and a lower stage lamp group 42 vertically crossing with the upper stage lamp group 41, and a substrate 9 is arranged on an auxiliary ring 31. A lower reflector 122 is provided between the upper stage lamp group 41 and lower stage lamp group 42, and they are provided with recessed surfaces for converging onto the auxiliary ring 31 lights emitted from the lamps on both end sides in the arrangement direction of the lamp groups. Thus, reflected lights from the upper and lower lamp groups 41 and 42 can be efficiently given to the auxiliary ring 31, improving the uniformity of temperature when the substrate 9 is heated. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat treatment apparatus for performing a process involving heating a substrate.

[0002]

2. Description of the Related Art As the demand for fine processing of devices such as semiconductors increases, semiconductor substrates (hereinafter referred to as "substrates").
Rapid thermal process (Rapid Thermal
Process, hereinafter referred to as "RTP". ) Plays an important role. In RTP, an infrared lamp is mainly used as a heating source, and the substrate is kept at a predetermined temperature (for example, 1200 ° C.) on the order of seconds while maintaining a predetermined gas atmosphere in the processing chamber.
After being heated to, and maintained at that temperature for a certain time (for example, several tens of seconds), rapid cooling is performed by turning off the lamp.

The RTP prevents re-diffusion of impurities due to heat in the junction layer of the transistor built in the substrate,
A process such as thinning of an insulating film such as an oxide film, which is difficult to be realized by a conventional heat treatment for a long time in an electric furnace, is performed.

As a heat treatment apparatus for performing RTP, a type in which two rod-shaped lamps are arranged in parallel is conventionally known. 1 and 2 are vertical sectional views of a heat treatment apparatus 8 of this type. In the heat treatment device 8,
The rod-shaped upper lamp group 81 facing the X direction is arranged in the Y direction, and the rod-shaped lower lamp group 82 facing the Y direction is arranged in the X direction.

The substrate 9 is horizontally arranged so as to face both lamp groups 81 and 82, and is supported by an auxiliary ring 83 that covers the periphery of the substrate 9. A window member 84 for separating the internal space 80 is arranged between the lamp groups 81 and 82 and the substrate 9, and the upper surface of the upper lamp group 81 reflects light from the upper lamp group 81. And a reflector 80a for efficiently irradiating the substrate 9.

[0006]

The auxiliary ring 83 is provided so as to prevent the heat radiation from the end surface of the substrate 9 and maintain the temperature uniformity of the surface of the substrate 9 by being integrally heated with the substrate 9. . Here, when the heating of the auxiliary ring 83 is insufficient, the temperature of the peripheral portion of the substrate 9 also does not rise. Therefore, in order to realize the temperature uniformity of the substrate 9, the auxiliary ring 8
Sufficient heating of 3 is important.

By the way, in the heat treatment apparatus 8, as shown in FIG. 2, the plurality of concave surfaces uniformly formed on the reflector 80a guide the reflected light from the upper lamp group 81 on the substrate 9 and the auxiliary ring 83 substantially uniformly. . In the case of such a reflector, the temperature rise of the auxiliary ring 83 may not be sufficiently obtained.

Further, no consideration is given to the light emitted upward from the lower lamp group 82, and the contribution of the reflected light from the reflector 80a in heating the auxiliary ring 83 depends on the upper lamp group 81. It will be adjusted only by. As described above, it can be said that the structure of the heat treatment device 8 is not preferable for heating the auxiliary ring 83 sufficiently efficiently.

The present invention has been made in view of the above problems, and an object thereof is to improve the temperature uniformity of a substrate during heating by efficiently heating the auxiliary ring.

[0010]

According to a first aspect of the present invention, there is provided a heat treatment apparatus for irradiating a substrate with light to perform a treatment accompanied by heating, wherein a reflection surface facing a main surface of the substrate to be treated is provided. A lamp group arranged along the reflecting surface and an auxiliary ring extending outward from the outer circumference along the outer circumference of the substrate, the reflecting surface reflecting light from the lamps included in the lamp group. To substantially focus light on the auxiliary ring.

According to a second aspect of the present invention, in the heat treatment apparatus according to the first aspect, the reflecting surface reflects light from a plurality of lamps included in the lamp group on the auxiliary ring. Substantially collect light.

According to a third aspect of the present invention, in the heat treatment apparatus according to the first or second aspect, each lamp included in the lamp group is a rod-shaped lamp that faces a predetermined direction.

According to a fourth aspect of the present invention, in the heat treatment apparatus according to the third aspect, the reflecting surface focuses light from a plurality of lamps included in the lamp group in the same region.

A fifth aspect of the present invention is the heat treatment apparatus according to the third or fourth aspect, wherein the heat treatment apparatus is arranged so as to face a direction different from the predetermined direction between the lamp group and the main surface. The other rod-shaped lamp group, and between the lamp group and the other lamp group, reflects the light from the lamps present in the regions on both end sides in the arrangement direction of the other lamp group. A pair of reflecting surfaces are further provided, and the reflecting surfaces reflect light from lamps present in respective regions on both ends of the lamp group in the arrangement direction, and substantially condense the light on the auxiliary ring. Then, the pair of reflecting surfaces reflects light from the lamps present in the regions on both ends of the other lamp group with respect to the arrangement direction and substantially focuses the light on the auxiliary ring.

According to a sixth aspect of the present invention, there is provided a heat treatment apparatus which irradiates a substrate with light to perform a process involving heating, the reflecting face facing a main surface of the substrate to be treated, and the reflecting face. And a rod-shaped lamp group arranged so as to face each other in a predetermined direction, the reflecting surface is formed along a lamp included in the lamp group, and a symmetry plane is formed from a direction normal to the main surface. It has a concave concave surface.

According to a seventh aspect of the present invention, in the heat treatment apparatus according to the sixth aspect, the concave surface is formed for each of the lamps in the regions on both ends of the lamp group in the arrangement direction. It

The invention according to claim 8 is the heat treatment apparatus according to claim 7, wherein a plurality of lamps are present in each of the regions on both ends.

The invention according to claim 9 is the heat treatment apparatus according to any one of claims 6 to 8, further comprising an auxiliary ring extending from the outer periphery to the outer side along the outer periphery of the substrate.

A tenth aspect of the present invention is the heat treatment apparatus according to any one of the sixth to ninth aspects, wherein the heat treatment device faces a direction different from the predetermined direction between the lamp group and the main surface. Between the other rod-shaped lamp group arranged in a row, and the light from the lamps existing in the regions on both ends of the other lamp group in the arrangement direction between the lamp group and the other lamp group. And a pair of reflecting surfaces that reflect light from the pair of reflecting surfaces, the pair of reflecting surfaces having concave surfaces formed along each of the lamps present in regions on both ends of the other lamp group in the arrangement direction. The concave symmetrical surface is inclined toward the substrate.

The eleventh aspect of the present invention is the heat treatment apparatus according to any one of the first to tenth aspects, further comprising a rotating mechanism for rotating the substrate while facing the reflecting surface.

[0021]

3 and 4 are vertical cross-sectional views showing the structure of a heat treatment apparatus 1 according to an embodiment of the present invention. The cross section in FIG. 3 and the cross section in FIG. The heat treatment apparatus 1 intersects vertically with the central axis 1a facing the Z direction. In FIGS. 3 and 4, the illustration of parallel diagonal lines with respect to the detailed cross section is omitted.

The heat treatment apparatus 1 has a main body 1 which is the main body of the apparatus.
1, a lid portion 12 that covers the upper portion of the main body portion 11, and a reflection plate 13 that is disposed on the central bottom surface of the main body portion 11, and these forms an internal space. The inner space is vertically divided by a chamber window 21 made of quartz, and the substrate 9 is placed in the lower processing space 10. The chamber window 21 and the main body 11 are sealed by an O-ring (not shown). The inner surface of the main body 11 is a cylindrical surface.

The substrate 9 is processed in the processing space 1 by an external transfer mechanism.
It is transported to the inside of 0 and placed on the auxiliary ring 31. The auxiliary ring 31 has a ring shape extending from the outer periphery to the outer periphery along the outer periphery of the substrate 9 (a ring shape centering on the central axis 1a).
And is brought into contact with the peripheral portion of the lower surface of the substrate 9
Support. The auxiliary ring 31 is formed of, for example, silicon carbide (SiC), and the auxiliary ring 31 is heated integrally with the substrate 9. Thereby, heat radiation from the peripheral edge of the substrate 9 is suppressed as compared with the case where only the substrate 9 is heated,
The uniformity of the temperature of the substrate 9 is improved.

The auxiliary ring 31 is supported by a cylindrical support ring 32 centering on the central axis 1a, and a coupling member 331 is attached to the lower end of the support ring 32. A coupling member 332 facing the coupling member 331 is provided below the outside of the main body 11, and the coupling member 331 and the coupling member 332 constitute a magnetic coupling mechanism. Coupling member 3
The motor 32 is rotated about the central shaft 1a by the motor 333 shown in FIG. As a result, the coupling member 331 inside the main body 11 rotates by a magnetic action, and the substrate 9 and the auxiliary ring 31 rotate about the central axis 1a.

A plurality of gas inlets 1 are provided on the side wall of the main body 11.
11 and the exhaust port 112 are formed, the exhaust port 11
The gas in the processing space 10 is (forced) exhausted from 2,
The gas in the processing space 10 is replaced by introducing a gas (for example, nitrogen, oxygen) according to the type of processing performed on the substrate 9 through the gas introduction port 111. A quartz shower plate 22 having a large number of holes is provided between the substrate 9 and the auxiliary ring 31 and the chamber window 21, and the gas introduced from the gas inlet 111 is supplied to the substrate through the shower plate 22. 9 is uniformly applied to the upper surface of 9. The gas used for the treatment is guided from below the support ring 32 to the exhaust port 112.

The lower surface of the lid 12 is a reflecting surface (hereinafter referred to as "upper reflector") 121 facing the main surface (that is, the upper surface) of the substrate 9, and the upper reflector 1
A bar-shaped upper lamp group 41 is arranged along 21 so as to face the X direction in FIGS. 3 and 4, respectively. Of the light from the upper lamp group 41, the light emitted upward is reflected by the upper reflector 121 and is irradiated on the substrate 9.

The upper reflector 121 has a constant sectional shape perpendicular to the X direction (longitudinal direction of the lamp), and the sectional shape is a part of an ellipse where each lamp is located at the focal point. As a result, most of the reflected light from each lamp of the upper lamp group 41 is selectively applied to a specific area on the substrate 9 and the auxiliary ring 31.

Below the upper lamp group 41 (that is, between the upper lamp group 41 and the main surface of the substrate 9), rod-shaped lower lamp groups 42 are arranged so as to face the Y direction. That is, the upper lamp group 41 and the lower lamp group 42 are attached to the lid 12 so as to be orthogonal to each other.

Upper lamp group 41 and lower lamp group 42
Are divided into small groups according to the distance from the central axis 1a. In FIG. 4, the lamps of the upper lamp group 41 divided into groups are denoted by reference numeral 411 from the central axis 1a side.
412, 413, and 414 are attached, and in FIG. 3, the lamps of the lower lamp group 42 divided into groups are attached with reference numerals 421, 422, 423, and 424 from the central axis 1a side.

FIG. 5 is a block diagram showing a connection relationship between lamps divided into small groups and a lamp control section 6 for supplying electric power to the lamps (even a plurality of lamps are shown as one block. .). As shown in FIG. 5, each group is individually connected to the lamp control unit 6 and supplied with power independently of each other. As a result, the intensity distribution of the light with which the upper surface of the substrate 9 is irradiated is controlled.

On the other hand, in the heat treatment apparatus 1, as shown in FIG. 3, between the upper lamp group 41 and the lower lamp group 42, the lower lamp group 42 exists in both end regions in the arrangement direction (X direction). The lid 12 is provided with two lower reflectors 122 that reflect the light from the lamp 424. The lower reflector 122 has a constant cross-sectional shape perpendicular to the Y direction (longitudinal direction of the lamp), and the cross-sectional shape is part of an ellipse where each lamp is located at the focal point. As a result, most of the reflected light from each lamp on both ends in the arrangement direction of the lower lamp group 42 is selectively applied to a specific area on the auxiliary ring 31.

By providing the lower reflector 122, the heating efficiency of the auxiliary ring is improved as compared with the conventional heat treatment apparatus 8 illustrated in FIGS. 1 and 2. That is, in the conventional heat treatment apparatus 8, of the light from the lower lamp group 82, the upward light is scattered before reaching the reflector 80 a located above the upper lamp group 81, and further, the light of the lower lamp group 82. Since the longitudinal direction of the lamp is orthogonal to the extending direction of each concave surface (see FIG. 2) of the reflector 80a, the reflected light will be further scattered.

On the other hand, in the heat treatment apparatus 1, the light emitted upward from the lamp located below the lower reflector 122 is immediately reflected and contributes to the heating of the auxiliary ring 31 as described later.

As shown in FIG. 4, a plurality of radiation thermometers 5 are provided on the lower surface of the reflector plate 13 from the central axis 1a toward the outside.
1 to 54 are attached. The radiation thermometers 51 to 53 measure the temperature of the substrate 9 by receiving infrared light from the substrate 9 through the window member 50. The radiation thermometer 54 measures the temperature of the auxiliary ring 31 by receiving infrared light from the auxiliary ring 31 via the window member 50. Since the substrate 9 and the auxiliary ring 31 rotate, the substrate 9 and the auxiliary ring 31 are rotated by the plurality of radiation thermometers 51 to 54 according to the distance from the central axis 1a.
And the temperature of the auxiliary ring 31 is measured.

When the substrate 9 is heated, for example, the power supply to the lamps 411 and 421 is controlled according to the measurement result of the radiation thermometer 51. Similarly, the radiation thermometers 52 and 53 are controlled. , 41 according to the measurement results of
2,422, lamps 413,423, lamps 414,4
The power supply to 24 is controlled respectively. At this time, the substrate 9 and the auxiliary ring 31 rotate while facing the upper reflector 121 and the lower reflector 122 by the rotation mechanism configured by the motor 333 and the coupling mechanism. Thereby, the heating of the substrate 9 and the auxiliary ring 31 is controlled so that the temperature of the substrate 9 becomes as uniform as possible.

Next, the shapes of the upper reflector 121 and the lower reflector 122 will be described.

FIG. 6 is a diagram showing how the upper lamp group 41 irradiates the substrate 9 and the auxiliary ring 31 with light.
The cross-sectional shape of the upper reflector 121 taken along the YZ plane is such that a part of an ellipse having the center of the lamp and the irradiation position as a focal point is arranged. Therefore, the light from each lamp is linearly condensed on the substrate 9 and the auxiliary ring 31.

The reflected light from the lamps other than the lamps 414 existing in the regions on both ends in the arrangement direction of the upper lamp group 41 is guided almost directly below and is condensed on the substrate 9. On the other hand, the concave surface 1211 formed for each of the lamps 414 is formed along the lamp 414 in the X direction and has a symmetry plane (a plane including the elliptical symmetry axis 414 a and parallel to the X direction) of the substrate 9. It is inclined to the substrate 9 side from the normal direction (Z direction) of the surface. The axis of symmetry 414a is tilted so as to contact substantially the inner surface of the auxiliary ring 31 (the outer surface of the substrate 9), and the reflected light from the plurality of lamps 414 is condensed in the same region.

FIG. 7 shows the lamps 424 existing in the regions on both ends of the lower lamp group 42 in the arrangement direction.
It is a figure which shows a mode that the reflected light from is irradiated to the auxiliary ring 31. The pair of lower reflectors 122 also has a lamp 42.
A concave surface 1221 is formed along the lamp 414 so that the cross section is a part of an ellipse for each of the four, and the symmetry plane (the plane including the symmetry axis 424a of the ellipse and parallel to the Y direction) is the main surface of the substrate 9. Is inclined toward the substrate 9 side from the normal direction (Z direction). The axis of symmetry 424a is tilted so as to come into contact with substantially the inner surface of the auxiliary ring 31 (the outer surface of the substrate 9), and the reflected light from the plurality of lamps 424 is condensed in the same region.

The concave surfaces 1211 and 1221 do not need to intersect the symmetrical surface, and the depth of the concave surface can be suppressed by closely coupling the plural concave surfaces while using the concave surface that does not intersect the symmetrical surface. For example, instead of the three concave surfaces 1211, if light from one high-power lamp is to be condensed on the auxiliary ring 31 by one concave surface, it is necessary to form a large (deep) concave surface. The upper reflector 121 can be easily processed by collecting the light from the plurality of lamps by the plurality of shallow concave surfaces that are combined. The same applies to the lower reflector 122.

As described above, in the heat treatment apparatus 1, the reflected light from the upper reflector 121 and the lower reflector 122 is condensed on the auxiliary ring 31, so that the auxiliary ring 31 can be efficiently heated and the substrate 9 Temperature uniformity is improved. Further, since the reflected light from the plurality of lamps 414 and 424 is condensed on the auxiliary ring 31, (especially,
To rapidly heat the auxiliary ring 31 to a high temperature even when the power of one lamp is small (since the reflected light from a plurality of lamps is collected in one irradiation area on the auxiliary ring 31). You can

Next, the manner in which the auxiliary ring 31 is irradiated with the reflected light will be further described. As described above, in the heat treatment apparatus 1, the lamp is rod-shaped, one concave surface of the reflector is formed along the lamp, and the reflected light corresponding to one lamp is applied to the linear region. FIG. 8 shows a lamp 41
Lamp 42 corresponding to either 4 or lamp 424
Area 91 in which the reflected light from 0 is applied to the auxiliary ring 31
It is a figure which illustrates (illustrated with a thick line). As shown in FIG. 8, the light emitted from the end portion side of the lamp 420 and reflected is guided to the outside of the auxiliary ring 31. Then, since the substrate 9 and the auxiliary ring 31 rotate, the lamp 420
The reflected light from is emitted to any area of the auxiliary ring 31.

From the above, the distance from the central axis 1a and the average irradiation energy at this distance (ie,
Considering the relationship with the irradiation energy for a concentric area divided by the area), the average irradiation energy becomes maximum at a distance slightly longer than the distance 91L between the central axis 1a and the center of the area 91. Therefore, even if the inclination of the symmetrical surface of the concave surface is set so that the substrate 9 is slightly irradiated with the reflected light, the light from the reflector is substantially irradiated while being condensed on the auxiliary ring 31.

That is, the lamp 414 and the lamp 42
The concave surface corresponding to 4 is provided to irradiate the auxiliary ring 31 with the reflected light, but it does not need to be designed so that the substrate 9 is not completely irradiated with the reflected light.

In the heat treatment apparatus 1, since a plurality of lamps are present in each of the regions on both ends in the arrangement direction of the lamp group and the same region is irradiated, the reflected light from many lamps is assisted. The light can be focused on the ring 31, and the auxiliary ring 31 can be heated very efficiently.

In FIG. 9, the lower reflector 122 is not present,
Moreover, there is a heat treatment device (that is, a conventional heat treatment device) that does not collect the reflected light from the (upper) reflector on the auxiliary ring, and the lower reflector 122, and the reflected light from the upper reflector 121 is directed to the auxiliary ring 31. FIG. 6 is a diagram showing a relationship between a distance (radius) from the center of the substrate and relative illuminance on the substrate and the auxiliary ring at that distance in the heat treatment device 1 for converging light. FIG. 10 is a diagram showing the relationship between the distance from the center of the substrate and the illuminance on the substrate and the auxiliary ring at that distance in the conventional heat treatment apparatus and the heat treatment apparatus 1 shown in FIGS. 3 and 4.

A range 71 shown in FIGS. 9 and 10 is a range in which the substrate 9 is present, and a range 72 is a range in which the auxiliary ring 31 is present. The relative illuminance distribution is referred to as an index for realizing temperature uniformity of the substrate 9 and improving the yield of semiconductor chips, and the illuminance distribution is referred to as an index of the ability of the heat treatment apparatus to raise the temperature of the substrate 9. It

The graph curves shown in the respective figures are the results (ie, the average relative illuminance and the illuminance with respect to the distance from the center of the substrate) obtained by the simulation under the assumption that the substrate and the auxiliary ring are rotated, and are compared. The two heat treatment devices are the same except that the lower reflector 122 is not provided and the shape of the reflector is different. Hereinafter, even when referring to the conventional heat treatment apparatus, description will be given using the reference numerals given in FIGS. 3 and 4.

As specific conditions in the simulation, the diameter of the substrate 9 is 300 mm, the auxiliary ring 31 is doughnut-shaped and has a width of 20 mm, and the lamp interval in the upper lamp group 41 and the lower lamp group 42 is 20 mm.

Lamps 411 to 41 of the upper lamp group 41
3 and the lamps 421 to 423 of the lower lamp group 42
Has an output of 4000 W and an emission length of 320 mm. In the upper lamp group 41 and the lower lamp group 42, lamps 414 and 42 that mainly heat the auxiliary ring 31.
No. 4 has an output of 4200 W and an emission length of 200 mm. Since the outer lamps 414 and 424 have shorter emission lengths than the other lamps, even if the substrate 9 to be heated is circular, light is efficiently emitted from the lamp group arranged in a two-tiered grid pattern. .

9 and 10, reference numerals 711,
The solid curve indicated by 721 indicates the ideal relative illuminance distribution and illuminance distribution. Various irradiation conditions of light at which ideal heating can be performed have been previously obtained by an experiment, and the relative illuminance distribution and the illuminance distribution obtained at this time are obtained by illuminance simulation by the Monte Carlo method. Is.

The long broken curves indicated by reference numerals 712 and 722 represent the relative illuminance distribution and the illuminance distribution when all the lamps are rated on in the conventional heat treatment apparatus (hereinafter referred to as "condition 1"). The short dashed curves indicated by 713 and 723 are obtained when all the lamps are turned on in the heat treatment apparatus 1 according to the present embodiment (hereinafter, referred to as “condition 2”).
Say. ) Shows the relative illuminance distribution and the illuminance distribution.

Dotted lines indicated by reference numerals 714 and 724 indicate the relative illuminance distribution and the illuminance distribution when the lamp is turned on so as to approach the ideal relative illuminance distribution in the conventional heat treatment apparatus (hereinafter referred to as "condition 3"). Shows
The two-dot chain lines indicated by reference numerals 715 and 725 indicate the relative illuminance distribution when the lamp is turned on so as to approach the ideal relative illuminance distribution in the heat treatment apparatus 1 according to the present embodiment (hereinafter referred to as “condition 4”). And the illuminance distribution.
In addition, in the curves 714 and 724, the peak is the auxiliary ring 31.
Located outside.

Under the conditions 1 to 4, the lamps 411 to 411
Table 1 shows the ratio (rated ratio) of the power supplied to the lamps 414 and the lamps 421 to 424 to the rated power.

[0055]

[Table 1]

When the curve 712 (condition 1) and the curve 713 (condition 2) are compared in FIG. 9, the relative illuminance of the auxiliary ring 31 decreases outward in the curve 712, but the relative illuminance of the curve 713 decreases. It can be seen that it will rise above 31. That is, the lower reflector 122
Further, by providing the auxiliary ring 31 with substantially the reflected light from the plurality of lamps, the heating ability of the auxiliary ring 31 when all the lamps are turned on at the rated power is improved.

Further, according to Table 1, when the electric power is distributed to the small group of lamps so as to approach the ideal relative illuminance distribution, in the conventional heat treatment apparatus (condition 3), the lamps 411 to 413 facing the substrate 9 and Lamps 421-4
The rating ratio of No. 23 is 0 to 25%, but in the heat treatment apparatus 1 (condition 4) according to the present embodiment, the rating ratio of these lamps can be set to 50 to 100%. Under the conditions 3 and 4, the rated ratio of the lamps 414 and 424 facing the auxiliary ring 31 is set to 100%.

As shown by the curve 724 (condition 3) in FIG. 10, when the relative illuminance distribution is brought closer to an ideal state in the conventional heat treatment apparatus, the illuminance on the substrate 9 becomes equal to the ideal illuminance (curve 721). It will be reduced to about 40%. Therefore,
Such irradiation makes it impossible to properly heat the substrate 9. On the other hand, as shown by the curve 725 (condition 4), in the heat treatment apparatus 1 according to the present embodiment, the illuminance distribution on the substrate 9 substantially matches the ideal illuminance distribution. As a result, the RT for the substrate 9 can be achieved without reducing the yield.
P can be realized extremely ideally.

Further, Condition 3 in the conventional heat treatment apparatus
When the rated ratios of the electric powers given to the plurality of lamps are largely different from each other as described above, there arise problems that the response speed and the color temperature of the lamps are different, and the life of the lamp is different. Therefore, in the heat treatment apparatus 1 according to the present embodiment, it is possible to suppress the occurrence of these problems.

As described above, in the heat treatment apparatus 1, the auxiliary ring 31 can be efficiently heated by collecting the reflected light from the lamp on the auxiliary ring 31, and the temperature uniformity of the substrate 9 can be improved. it can. Further, by further providing the lower reflector 122, the relative illuminance distribution and the illuminance distribution on the substrate 9 can be made appropriate, and the difference in lighting state between the lamps can be suppressed.

Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment and various modifications can be made.

For example, the heat treatment apparatus 1 may be used for heating a material (glass substrate or the like) other than the semiconductor substrate.

The lamps of the upper lamp group 41 and the lower lamp group 42 may intersect at a predetermined angle instead of being orthogonal to each other. The auxiliary ring 31 may also be composed of a plurality of members as long as it surrounds the outer periphery of the substrate 9.

Although the heat treatment apparatus 1 having the auxiliary ring 31 has been described in the above embodiment, the heat treatment apparatus 1 not having the auxiliary ring 31 can also utilize the technique of condensing the reflected light. In this case, the reflected light is condensed on the outer peripheral portion of the substrate 9 to be efficiently heated, and the temperature uniformity of the substrate 9 can be improved.

Although the substrate 9 rotates in the heat treatment apparatus 1, the substrate 9 may be rotated only when necessary.

The cross-sectional shapes of the concave surfaces of the upper reflector 121 and the lower reflector 122 may be shapes other than ellipses (arcs) (for example, parabolas or arcs). By tilting the concave symmetry surface toward the substrate 9, the reflected light can be approximately focused on the auxiliary ring 31 and the outer edge of the substrate 9,
The temperature uniformity of the substrate 9 is improved. Furthermore, in order to collect light from a larger number of lamps, the symmetry plane of the concave surface corresponding to the lamps on the substrate 9 may be inclined outward.

Further, the lower reflector 122 is one surface having two reflection areas for reflecting light from both end areas of the lower lamp group 42 (for example, two reflectors connected at a position apart from the central axis 1a). May be provided as.

The substrate 9 does not have to be supported horizontally, and the entire heat treatment apparatus 1 may be tilted. The vertical relationship of the overall configuration is reversed so that both lamp groups 41, 42 are provided on the lower surface side of the substrate 9.
May be arranged. Further, a combination of the upper lamp group 41 and the upper reflector 121 may be provided vertically so as to face both the upper and lower main surfaces of the substrate 9.

Lighting control of the upper lamp group 41 and the lower lamp group 42 may be individually performed for each lamp. The lamp control unit 6 supplies the electric power supplied to the lamps (not all the lamps on both ends) existing in the regions on both ends in the arrangement direction of the lower lamp group 42 to the other regions. By controlling independently of the lamp, the auxiliary ring 31 can be efficiently heated, and the temperature uniformity of the substrate 9 can be improved.

The reflected light of the light other than the rod-shaped lamp (for example, a spherical lamp) may be positively focused on the auxiliary ring 31, and a plurality of non-reflected lights may be used to heat the auxiliary ring 31 more efficiently. Light from rod-shaped lamp is auxiliary ring 3
It may be condensed in the same area on 1.

[0071]

According to the present invention, the temperature uniformity of the substrate can be improved during heating.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of a conventional heat treatment apparatus.

FIG. 2 is a vertical sectional view of a conventional heat treatment apparatus.

FIG. 3 is a vertical sectional view of a heat treatment apparatus.

FIG. 4 is a vertical sectional view of a heat treatment apparatus.

FIG. 5 is a block diagram showing a lamp and a lamp control unit.

FIG. 6 is a vertical cross-sectional view showing how reflected light is condensed on an auxiliary ring.

FIG. 7 is a vertical cross-sectional view showing how reflected light is condensed on an auxiliary ring.

FIG. 8 is a diagram illustrating a region in which reflected light from one lamp is irradiated on a substrate and an auxiliary ring.

FIG. 9 is a diagram showing the relationship between the distance from the center of the substrate and the relative illuminance.

FIG. 10 is a diagram showing the relationship between the distance from the center of the substrate and the illuminance.

[Explanation of symbols]

1 Heat treatment equipment 9 substrates 31 Auxiliary ring 41 Upper lamp group 42 Lower lamp group 121 Upper reflector 122 Lower reflector 331,332 Coupling member 333 motor 414,424 lamps 1211, 1221 concave

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Toshiyuki Kobayashi             4 Horikawa-dori Teranouchi, Kamigyo-ku, Kyoto City, Kyoto Prefecture             No. 1 at Tenjin Kitamachi             Manufacturing Co., Ltd. (72) Inventor Toshimitsu Funayoshi             4 Horikawa-dori Teranouchi, Kamigyo-ku, Kyoto City, Kyoto Prefecture             No. 1 at Tenjin Kitamachi             Manufacturing Co., Ltd.

Claims (11)

[Claims] 1. A heat treatment apparatus for irradiating a substrate with light to perform a process involving heating, comprising: a reflective surface facing a main surface of the substrate to be processed; and a lamp group arranged along the reflective surface. An auxiliary ring extending outward from the outer circumference along the outer circumference of the substrate, wherein the reflecting surface reflects light from the lamps included in the lamp group and substantially focuses the light on the auxiliary ring. A heat treatment apparatus characterized by the above. 2. The heat treatment apparatus according to claim 1, wherein the reflecting surface reflects light from a plurality of lamps included in the lamp group and substantially focuses the light on the auxiliary ring. A heat treatment apparatus characterized by. 3. The heat treatment apparatus according to claim 1, wherein each of the lamps included in the lamp group is a rod-shaped lamp that faces a predetermined direction. 4. The heat treatment apparatus according to claim 3, wherein the reflection surface condenses light from a plurality of lamps included in the lamp group in the same region. 5. The heat treatment apparatus according to claim 3, wherein another lamp having a rod shape is arranged between the lamp group and the main surface so as to face in a direction different from the predetermined direction. A group, and a pair of reflecting surfaces for reflecting light from lamps existing in regions on both ends of the other lamp group in the arrangement direction between the lamp group and the other lamp group, Further comprising, wherein the reflecting surface reflects light from the lamps existing in respective regions on both ends of the lamp group in the arrangement direction and substantially condenses the light on the auxiliary ring, A heat treatment apparatus characterized in that the reflecting surface reflects light from the lamps present in respective regions of both ends of the other lamp group in the arrangement direction, and substantially focuses the light on the auxiliary ring. . 6. A heat treatment apparatus for irradiating a substrate with light to perform a process involving heating, the reflecting face facing a main surface of the substrate to be treated, and each of the reflecting faces facing a predetermined direction along the reflecting face. And a rod-shaped lamp group arranged in such a manner that the reflecting surface is formed along a lamp included in the lamp group and a symmetry plane is a concave surface inclined from a normal direction of the main surface. A heat treatment apparatus having. 7. The heat treatment apparatus according to claim 6, wherein the concave surface is formed for each of the lamps existing in regions on both end sides in the arrangement direction of the lamp group. apparatus. 8. The heat treatment apparatus according to claim 7, wherein a plurality of lamps are present in each of the regions on both end sides. 9. The heat treatment apparatus according to claim 6, further comprising an auxiliary ring extending outward from the outer circumference along the outer circumference of the substrate. 10. The heat treatment apparatus according to claim 6, further comprising a rod-shaped member arranged between the lamp group and the main surface so as to face a direction different from the predetermined direction. One lamp group, and a pair of reflections between the lamp group and the other lamp group, the pair of reflections reflecting light from the lamps existing in regions on both ends of the other lamp group in the arrangement direction. And a pair of reflecting surfaces, each of which has a concave surface formed along each of the lamps existing in regions on both end sides in the arrangement direction of the other lamp group, A heat treatment apparatus characterized in that the plane of symmetry is inclined toward the substrate. 11. The heat treatment apparatus according to claim 1, further comprising a rotation mechanism that rotates the substrate while facing the reflection surface.