JPS61258716A - 射出成形における電子部品の金型装着方法およびその金型 - Google Patents

射出成形における電子部品の金型装着方法およびその金型

Info

Publication number
JPS61258716A
JPS61258716A JP10106285A JP10106285A JPS61258716A JP S61258716 A JPS61258716 A JP S61258716A JP 10106285 A JP10106285 A JP 10106285A JP 10106285 A JP10106285 A JP 10106285A JP S61258716 A JPS61258716 A JP S61258716A
Authority
JP
Japan
Prior art keywords
mold
pin
terminal
resin
pinlike
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10106285A
Other languages
English (en)
Japanese (ja)
Other versions
JPH038930B2 (enrdf_load_stackoverflow
Inventor
Shinji Yamamoto
伸治 山本
Tadaki Sakai
忠基 酒井
Tsukasa Shiroganeya
司 白銀屋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Steel Works Ltd
Original Assignee
Japan Steel Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Steel Works Ltd filed Critical Japan Steel Works Ltd
Priority to JP10106285A priority Critical patent/JPS61258716A/ja
Publication of JPS61258716A publication Critical patent/JPS61258716A/ja
Publication of JPH038930B2 publication Critical patent/JPH038930B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP10106285A 1985-05-13 1985-05-13 射出成形における電子部品の金型装着方法およびその金型 Granted JPS61258716A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10106285A JPS61258716A (ja) 1985-05-13 1985-05-13 射出成形における電子部品の金型装着方法およびその金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10106285A JPS61258716A (ja) 1985-05-13 1985-05-13 射出成形における電子部品の金型装着方法およびその金型

Publications (2)

Publication Number Publication Date
JPS61258716A true JPS61258716A (ja) 1986-11-17
JPH038930B2 JPH038930B2 (enrdf_load_stackoverflow) 1991-02-07

Family

ID=14290623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10106285A Granted JPS61258716A (ja) 1985-05-13 1985-05-13 射出成形における電子部品の金型装着方法およびその金型

Country Status (1)

Country Link
JP (1) JPS61258716A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105269759A (zh) * 2014-07-14 2016-01-27 宰煐斯路泰科株式会社 用于内盖部件的注射模具及利用其形成内盖部件的方法
JP2020191372A (ja) * 2019-05-21 2020-11-26 日本発條株式会社 樹脂モールド回路体、金型、製造方法、及び回路基板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4941955A (enrdf_load_stackoverflow) * 1972-08-17 1974-04-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4941955A (enrdf_load_stackoverflow) * 1972-08-17 1974-04-19

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105269759A (zh) * 2014-07-14 2016-01-27 宰煐斯路泰科株式会社 用于内盖部件的注射模具及利用其形成内盖部件的方法
JP2020191372A (ja) * 2019-05-21 2020-11-26 日本発條株式会社 樹脂モールド回路体、金型、製造方法、及び回路基板

Also Published As

Publication number Publication date
JPH038930B2 (enrdf_load_stackoverflow) 1991-02-07

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