JPS61258442A - Discrimination of defective assembly among ic's - Google Patents

Discrimination of defective assembly among ic's

Info

Publication number
JPS61258442A
JPS61258442A JP10081685A JP10081685A JPS61258442A JP S61258442 A JPS61258442 A JP S61258442A JP 10081685 A JP10081685 A JP 10081685A JP 10081685 A JP10081685 A JP 10081685A JP S61258442 A JPS61258442 A JP S61258442A
Authority
JP
Japan
Prior art keywords
resin
defective
foaming agent
sealing
assembles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10081685A
Other languages
Japanese (ja)
Inventor
Satoru Miyagawa
哲 宮川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP10081685A priority Critical patent/JPS61258442A/en
Publication of JPS61258442A publication Critical patent/JPS61258442A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To easily inspect whether or not IC's defective after a sealing is performed utilizing a non-destructive film thickness meter by a method wherein a defect due to a foam is made to generate in the respective sealing resin itself of some ICs to be decided as defective assembles among IC's. CONSTITUTION:A foaming agent 3 is adhered on a semiconductor chip 2 to be bonded on a lead frame 1. The foaming agent is one which is decomposed by heating like hydrogen carbonate, for example, and generates carbon acid gas. By heating the foaming agent at the time of resin sealing, a foam 5 is generated in a resin 4. If the foaming agent 3 is ready-adhered on some defective assembles only among IC's, a decrease in the thickness of the resin due to the foam 5 can be detected by a well-known non-destructive film thickness meter. As a result, the identification of whether or not the IC's are defective assembles can be easily detected after a sealing is performed.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は樹脂封止型ＩＣの製造にかかシ、特にリードフ
レーム上に混在する封止以前での組立良品と不良品を樹
脂封止後において識別分離する方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention is useful for manufacturing resin-sealed ICs, and in particular, resin-seals good and defective products that are mixed on a lead frame and assembled before sealing. The present invention relates to a method for later identification and separation.

〔従来の技術〕[Conventional technology]

従来、この種の樹脂封止型ＩＣ組立時の不良品の除去は
マウント後やボンディング後の外観検査の際、不良と判
定されたＩＣのチップ上にキズをつけたシ、あるいはポ
ンディングワイアーを切断し、封入後の電気選別の際に
除去するか、またはリードフレームに印をつけておき、
封入後リードフレームから各ＩＣを切断分離後、目視に
よって除去するのが一般的となっていた。Conventionally, when assembling this type of resin-sealed IC, defective products were removed by removing scratches or bonding wires on the chips of ICs determined to be defective during visual inspection after mounting or bonding. Either cut it and remove it during electrical screening after encapsulation, or mark it on the lead frame.
It has become common practice to cut and separate each IC from the lead frame after encapsulation, and then remove it visually.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来の組立不良品の除去方法は、電気選別の際
の自動検査機での編動作や、運搬、保管時の混入の為、
不良品除去の手段としては完全ではない。またリードフ
レームにつけられたキズなどの印により目視によって除
去する方法は、はりき〕と識別できるキズをつける際の
衝撃、振動によるボンデ、イングワイアーの断縁の問題
がある。The conventional method of removing defective assembly products described above is due to the knitting operation in the automatic inspection machine during electrical sorting, and the contamination during transportation and storage.
It is not a perfect means of eliminating defective products. Furthermore, the method of visually removing marks such as scratches made on the lead frame has the problem of disconnection of the bond and wire due to shock and vibration when making scratches that can be identified as adhesives.

またキズの大きさ深さが充分でないと後工程の目視検査
で見逃しや、検査時間の増加などの問題が生じる。また
色素によって印をつけた場合、樹脂封止時の熱による色
素の変色、切断、曲げの際の剥離などの問題がある。Furthermore, if the size and depth of the flaws are not sufficient, problems may occur such as oversight during visual inspection in the post-process and an increase in inspection time. In addition, when a mark is made with a dye, there are problems such as discoloration of the dye due to heat during resin sealing, peeling during cutting, and bending.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は組立時の不良品にのみ、樹脂封止時の加熱によ
り樹脂内部に気泡を発生させ、気泡の有無による樹脂厚
の違いを公知の非破壊式膜厚計により検出し、樹脂封止
後に不良品の識別除去を行うことを特徴とする。The present invention applies only to defective products during assembly, by generating air bubbles inside the resin by heating during resin sealing, and detecting the difference in resin thickness due to the presence or absence of air bubbles using a known non-destructive film thickness meter. The method is characterized in that defective products are subsequently identified and removed.

〔実施例〕〔Example〕

次に１本発明の一実施例を図面を参照して説明する。 Next, an embodiment of the present invention will be described with reference to the drawings.

第１図はワイアーボンディング後の外観検査において不
良と判定されたＩＣの断面図である。リードフレーム１
上に接着された半導体チップ２の上に発泡剤３を付着さ
せる。発泡剤としては、例えば炭酸水素塩のように加熱
により分解し炭酸ガスを生じさせるものである。FIG. 1 is a cross-sectional view of an IC that was determined to be defective in the visual inspection after wire bonding. Lead frame 1
A foaming agent 3 is attached onto the semiconductor chip 2 bonded thereon. Examples of the blowing agent include hydrogen carbonate, which decomposes when heated to produce carbon dioxide gas.

第２図は樹脂封入後の断面図である。樹脂封止時の加熱
により、樹脂４中に気泡５を生じさせる。FIG. 2 is a sectional view after resin encapsulation. Bubbles 5 are generated in the resin 4 by heating during resin sealing.

組立不良品にのみ発泡剤３を付着させておけば気泡５に
よる樹脂厚の減少を公知の非破壊式膜厚計により検出す
ることで容易に封止後に組立不良であるかどうかの識別
が可能となる。If the foaming agent 3 is applied only to defective products, it is possible to easily identify whether the product is defective after sealing by detecting the decrease in resin thickness due to air bubbles 5 using a known non-destructive film thickness meter. becomes.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は組立不良となつたＩＣの封
止樹脂自体に気泡による欠陥を生じさせる為、公知の非
破壊式膜厚計を利用することで封入後に容易に不良か否
かを検査できる。目視によらない為、見逃しなどの誤判
定の問題がなく、また検査自体の自動化も可能となる。As explained above, since the present invention causes defects due to air bubbles in the encapsulating resin itself of an IC that has been assembled defectively, it is possible to easily determine whether or not there is a defect after encapsulation by using a known non-destructive film thickness meter. Can be inspected. Since it does not rely on visual inspection, there is no problem of erroneous judgments such as oversights, and the inspection itself can be automated.

【図面の簡単な説明】[Brief explanation of drawings]

８１図は発泡剤を付着させた状態を示す断面図、第２図
は封入後の断面図である。 １・・・・・・リードフレーム、２・・・・・・半導体
チップ、３・・・・・・発泡剤、４・・・・・・樹脂、
５・・・・・・気泡、６・・・・・・ボンディングワイ
アー。FIG. 81 is a cross-sectional view showing a state in which a foaming agent is attached, and FIG. 2 is a cross-sectional view after being sealed. 1... Lead frame, 2... Semiconductor chip, 3... Foaming agent, 4... Resin,
5...Bubble, 6...Bonding wire.

Claims (1)

【特許請求の範囲】[Claims] 樹脂封止型ＩＣの組立不良品の識別において、樹脂封止
時の加熱により、不良品にのみ付着させた発泡剤により
樹脂内部に形成された気泡の有無を検出することを特徴
とするＩＣの組立不良品識別方法。In the identification of assembled defective products of resin-sealed ICs, the presence or absence of air bubbles formed inside the resin by a foaming agent attached only to defective products by heating during resin sealing is detected. How to identify defective assembly products.
JP10081685A 1985-05-13 1985-05-13 Discrimination of defective assembly among ic's Pending JPS61258442A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10081685A JPS61258442A (en) 1985-05-13 1985-05-13 Discrimination of defective assembly among ic's

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10081685A JPS61258442A (en) 1985-05-13 1985-05-13 Discrimination of defective assembly among ic's

Publications (1)

Publication Number Publication Date
JPS61258442A true JPS61258442A (en) 1986-11-15

Family

ID=14283869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10081685A Pending JPS61258442A (en) 1985-05-13 1985-05-13 Discrimination of defective assembly among ic's

Country Status (1)

Country Link
JP (1) JPS61258442A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000234993A (en) * 1999-02-16 2000-08-29 Mitsubishi Electric Corp Defect inspection method of power semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000234993A (en) * 1999-02-16 2000-08-29 Mitsubishi Electric Corp Defect inspection method of power semiconductor device

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