JPH01124737A - Method for testing fluorinate valve - Google Patents
Method for testing fluorinate valveInfo
- Publication number
- JPH01124737A JPH01124737A JP62283404A JP28340487A JPH01124737A JP H01124737 A JPH01124737 A JP H01124737A JP 62283404 A JP62283404 A JP 62283404A JP 28340487 A JP28340487 A JP 28340487A JP H01124737 A JPH01124737 A JP H01124737A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- fluorinate
- lead
- gap
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 title description 3
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 238000005476 soldering Methods 0.000 claims abstract description 7
- 239000011347 resin Substances 0.000 claims abstract description 3
- 229920005989 resin Polymers 0.000 claims abstract description 3
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 claims description 8
- 238000010998 test method Methods 0.000 claims description 2
- 230000008646 thermal stress Effects 0.000 claims description 2
- 239000011521 glass Substances 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 abstract description 3
- 230000035945 sensitivity Effects 0.000 abstract description 2
- 230000008642 heat stress Effects 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Examining Or Testing Airtightness (AREA)
- Devices And Processes Conducted In The Presence Of Fluids And Solid Particles (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体ＩＣ製品等の電子部品の試験方法、特
にバブル試験に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for testing electronic components such as semiconductor IC products, and in particular to a bubble test.
従来この種の試験はフロリナート液の温度を４０〜５０
℃位で行うようになっていた。又、主としてカンケース
タイプ及びセラミックパッケージ製品の封止性のチエツ
ク（リーク検出用）として使用されていた。Conventionally, this type of test has been carried out at a temperature of 40 to 50°C.
It was supposed to be done at around ℃. Also, it was mainly used as a sealing check (for leak detection) of can case type and ceramic package products.
従来のバブル試験は主としてカンケース製品やセラミッ
クパッケージ製品の封止性チエツク（リークチエツク）
に適しており、フロリナート液の温度も４０〜５０℃と
低い為モールド製品の半田付は時に生ずるモールド樹脂
とリード間の隙間（空げき）の検出等には有効でなかっ
た。Conventional bubble tests are mainly used to check sealability (leak check) of can case products and ceramic package products.
Since the temperature of the Fluorinert liquid is as low as 40 to 50°C, it is not effective in detecting gaps (gaps) between the mold resin and the leads that sometimes occur when soldering molded products.
本発明のバルブ試験方法は、透明ガラス容器の中フロリ
ナート液を入れ加熱器により液温を２００〜２５０℃に
保っている。In the bulb test method of the present invention, Fluorinert liquid is placed in a transparent glass container and the temperature of the liquid is maintained at 200 to 250°C using a heater.
〔実施例１〕
次に、本発明の一実施例について第１図を参照して説明
する。[Example 1] Next, an example of the present invention will be described with reference to FIG.
透明ガラス容器１にフロリナート液２を入れヒータ３に
より２００〜２５０℃に加熱した後に試験を行うモール
ドＩＣ製品４をフロリナート液の中に入れ、モールドＩ
Ｃのリード付根部、又は製品本体部から気泡（バブル）
が発生していないかを確認する。Fluorinert liquid 2 is placed in a transparent glass container 1 and heated to 200 to 250°C by a heater 3, and then the molded IC product 4 to be tested is placed in the Fluorinert liquid.
Bubbles from the base of the lead C or the product body
Check to see if this has occurred.
〔実施例２〕 本発明能の実施例を第２図に示す。[Example 2] An embodiment of the present invention is shown in FIG.
この実施例では２００℃〜２５０℃に加熱したフロリナ
ート中のモールドＩＣにバイアスを加えることによりモ
ールドＩＣの内部で発熱させることにより実施例１より
更に、検出感度の向上を図っている。In this example, the detection sensitivity is further improved than in Example 1 by applying a bias to the molded IC in Fluorinert heated to 200° C. to 250° C. to generate heat inside the molded IC.
以上説明したように本発明の実施により、半導体ＩＣ製
品、特にモールド製品に関し、半田付けより発生したモ
ールド内部の空げきの存在、又はモールドとリード間の
隙間（空げき）の有無を、気泡発生の有無により、検出
することが可能であり、半田付は時の熱ストレスが半導
体ＩＣに与える影響を調査するなに有効である。又、本
試験は、破壊試験ではないことから製品のスクリーニン
グとしても有効である。As explained above, by implementing the present invention, regarding semiconductor IC products, particularly molded products, it is possible to detect the presence of voids inside the mold caused by soldering, or the presence or absence of gaps (gaps) between the mold and the leads. It can be detected by the presence or absence of soldering, and soldering is effective in investigating the effects of thermal stress on semiconductor ICs. Furthermore, since this test is not a destructive test, it is also effective as a product screening test.
【図面の簡単な説明】
第１図及び第２図は本発明の実施方法を示した図である
。
１・・・・・・透明ガラス容器、２・・・・・・フロリ
ナート液（２００〜２５０℃に加熱）、３・・・・・・
加熱用ヒータ、４・・・・・・モールドＩＣ本体部、５
・・・・・・モールドＩＣリード部、６・・・・・・モ
ールドＩＣから発生した気泡（バブル）、７・・・・・
・拡大鏡、８・・・・・・作業者の眼、９・・・・・・
試料台、１０・・・・・・バイアス印加装置。
代理人 弁理士 内 原 音BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 and 2 are diagrams showing a method of implementing the present invention. 1... Transparent glass container, 2... Fluorinert liquid (heated to 200-250°C), 3...
Heating heater, 4... Mold IC main body, 5
...Mold IC lead part, 6...Bubble generated from mold IC, 7...
・Magnifying glass, 8...Worker's eyes, 9...
Sample stage, 10...Bias application device. Agent Patent Attorney Oto Uchihara
Claims (1)
ト液の温度を２００〜２５０℃とすることによりモール
ドＩＣ製品の半田付け時の熱ストレスとその時に生ずる
モールド樹脂とリード間の隙間の発生とを同時に判定可
能とすることを特徴とする試験方法。In a bubble test using Fluorinert, by setting the temperature of Fluorinert liquid at 200 to 250°C, it is possible to simultaneously determine the thermal stress during soldering of molded IC products and the occurrence of gaps between the mold resin and the leads that occur at that time. A test method characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62283404A JPH01124737A (en) | 1987-11-09 | 1987-11-09 | Method for testing fluorinate valve |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62283404A JPH01124737A (en) | 1987-11-09 | 1987-11-09 | Method for testing fluorinate valve |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01124737A true JPH01124737A (en) | 1989-05-17 |
Family
ID=17665088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62283404A Pending JPH01124737A (en) | 1987-11-09 | 1987-11-09 | Method for testing fluorinate valve |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01124737A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000234993A (en) * | 1999-02-16 | 2000-08-29 | Mitsubishi Electric Corp | Defect inspection method of power semiconductor device |
| CN102818682A (en) * | 2012-08-16 | 2012-12-12 | 爱普科斯科技（无锡）有限公司 | Fluorocarbon oil gross leaking test matched device |
-
1987
- 1987-11-09 JP JP62283404A patent/JPH01124737A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000234993A (en) * | 1999-02-16 | 2000-08-29 | Mitsubishi Electric Corp | Defect inspection method of power semiconductor device |
| CN102818682A (en) * | 2012-08-16 | 2012-12-12 | 爱普科斯科技（无锡）有限公司 | Fluorocarbon oil gross leaking test matched device |
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