JPS6125254Y2 - - Google Patents
Info
- Publication number
- JPS6125254Y2 JPS6125254Y2 JP1981003709U JP370981U JPS6125254Y2 JP S6125254 Y2 JPS6125254 Y2 JP S6125254Y2 JP 1981003709 U JP1981003709 U JP 1981003709U JP 370981 U JP370981 U JP 370981U JP S6125254 Y2 JPS6125254 Y2 JP S6125254Y2
- Authority
- JP
- Japan
- Prior art keywords
- groove
- heat sink
- support device
- support
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 230000002265 prevention Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 21
- 238000009434 installation Methods 0.000 description 4
- 239000010445 mica Substances 0.000 description 4
- 229910052618 mica group Inorganic materials 0.000 description 4
- 230000006378 damage Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981003709U JPS6125254Y2 (US20090192370A1-20090730-C00001.png) | 1981-01-14 | 1981-01-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981003709U JPS6125254Y2 (US20090192370A1-20090730-C00001.png) | 1981-01-14 | 1981-01-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57117652U JPS57117652U (US20090192370A1-20090730-C00001.png) | 1982-07-21 |
| JPS6125254Y2 true JPS6125254Y2 (US20090192370A1-20090730-C00001.png) | 1986-07-29 |
Family
ID=29802148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981003709U Expired JPS6125254Y2 (US20090192370A1-20090730-C00001.png) | 1981-01-14 | 1981-01-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6125254Y2 (US20090192370A1-20090730-C00001.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0510395Y2 (US20090192370A1-20090730-C00001.png) * | 1986-09-09 | 1993-03-15 | ||
| JP5349387B2 (ja) * | 2010-03-29 | 2013-11-20 | 三菱電機株式会社 | 誘導加熱調理器 |
| JP5766850B2 (ja) * | 2014-06-04 | 2015-08-19 | 三菱電機株式会社 | 誘導加熱調理器 |
-
1981
- 1981-01-14 JP JP1981003709U patent/JPS6125254Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57117652U (US20090192370A1-20090730-C00001.png) | 1982-07-21 |
