JPS61252060A - Polishing method - Google Patents

Abstract

PURPOSE:To obtain a good polished surface with less polishing scratches by providing a large and deep groove and a small and shallow groove on a polishing surface and carrying out a polishing operation using a polishing liquid in which abrasive grains are mixed and also a polishing liquid in which abrasive grains are not mixed. CONSTITUTION:A workpiece 8 mounted on a holder 7 is placed on a polishing surface table 1 on the polishing surface of which a large and deep groove 5 and small and shallow grooves 6 are provided, and a polishing liquid in which abrasive grains 11 are mixed is fed while rotating the workpiece 8, to carry out a polishing operation. After that, when a polishing liquid in which the abrasive grains are not mixed, is fed continuously, the polishing liquid containing the abrasive grains 11 is discharged out form the grooves 6 to the groove 5 due to the centrifugal force caused by the rotation of the polishing surface table, and the action of the workpiece 8 which is rotated while being in contact with the polishing surface. Thus, the abrasive grains are prevented from being caught in on the polishing surface and, as the polishing liquid without abrasive grains is continuously fed, abrasive grains 12 which have been kept laid in due to polishing pressure, enable the polishing liquid to serve as a lubricating agent on carrying out polishing operation. Thereby, a good polished surface with less polishing scratches can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a polishing method devised for obtaining a polished surface with fewer polishing scratches during polishing performed by attaching a polishing surface plate to a polishing machine.

In the conventional polishing process using a polishing surface plate, as shown in FIG.
It is embedded in the polishing surface plate whose hardness is lower than that of the workpiece 2, and countless cutting edges are formed on the polishing surface of the polishing surface plate 1. As a result, polishing is performed using the abrasive grains that have become cutting edges.

Furthermore, it is said that embedded abrasive grains repeatedly fall off and form. The above is an overview of the polishing process using a polishing machine.

Problems to be Solved by the Invention In order to improve the quality of the polished surface during polishing performed by attaching a polishing surface plate to a polishing machine, it is necessary to use dropped abrasive grains or extra abrasive grains that are not directly related to the machining process. The challenge is to eliminate the abrasive scratches that occur.

FIG. 6 shows how the fallen abrasive grains 4 damage the workpiece 2. In addition, it is thought that polishing scratches caused by extra abrasive grains that are not directly related to processing are also caught between the workpiece and the polishing surface plate, causing polishing scratches, as shown in Figure 6, in the same way as the fallen abrasive grains. .

Means for Solving the Problems In order to further reduce the abrasive scratches caused by the above-mentioned causes, the present invention provides a holder on the polishing surface plate, which has large, deep grooves and small, shallow grooves on the polishing surface of the polishing surface plate. Place the workpiece attached to the workpiece, and while rotating the polishing surface plate, supply a polishing liquid mixed with abrasive grains, polish the workpiece, and then apply a polishing liquid without abrasive grains. By supplying the polishing liquid mixed with the abrasive grains to the polishing surface plate by the centrifugal force caused by the rotation of the polishing surface plate and the action of the workpiece rotating in contact with the polishing surface of the polishing surface plate, By discharging from a small, shallow groove to a large, deep groove, it is possible to prevent abrasive grains from being caught between the workpiece and the polishing surface plate, and to continuously supply a polishing liquid that is not mixed with the abrasive grains. When processing is continued with a polishing liquid mixed with the abrasive grains, the abrasive grains embedded in the polishing surface plate and held by the polishing pressure lubricate the polishing liquid without the abrasive grains mixed in. As a polishing agent, further polishing is performed to reduce polishing scratches.

After polishing with a polishing liquid mixed with working abrasive grains, the polishing liquid mixed with the abrasive grains is discharged by subsequently supplying a polishing liquid without mixed with abrasive grains, and the polishing liquid mixed with the abrasive grains is discharged. A polished surface with fewer polishing scratches can be obtained by further performing polishing using the abrasive grains that are embedded in the polishing surface plate under the lubricating action of the polishing liquid while preventing the abrasive grains from being entangled in the polishing liquid.

Example Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a polishing surface plate 13 having large and deep grooves 6 on its polishing surface, and small and shallow grooves 6 as shown in FIG. 2 (enlarged view). As shown in FIG. 3, the workpiece 8 attached to the holder 7 is placed on the polishing surface plate 13 explained in FIGS. 1 and 2, and the polishing surface plate 13 is rotated around the rotation axis C. After polishing the workpiece 8 by supplying the polishing liquid 9 mixed with abrasive grains, the supply of the polishing liquid mixed with the abrasive grains is stopped, and then the polishing liquid 9 containing no abrasive grains is supplied. By continuously supplying the holder 7, the holder 7 is rotated about the rotation axis d of the holder 7 due to the centrifugal force of the rotation of the polishing surface plate 13 and contact with the polishing surface of the polishing surface plate 13. The workpiece 8 attached to the holder 7 discharges the polishing liquid 9 mixed with the abrasive grains from the small shallow groove shown in FIGS. 1 and 2 into the large deep groove. In addition to preventing the abrasive grains from being caught between the polishing surface plate 13 and the polishing surface plate 13, the polishing fluid 10 containing no abrasive grains is continuously supplied, and when processing is performed with the polishing fluid containing the abrasive grains. , the abrasive grains are embedded and held in the polishing surface plate by the polishing pressure, and the polishing liquid not mixed with the abrasive grains is used as a lubricant,
4 is a partially enlarged view of the large and deep groove 6, the small and shallow groove 6, and the workpiece 8 attached to the holder 7. The effects of the large grooves, the small grooves, and the polishing liquid 10 that does not contain abrasive grains will be explained.

The small shallow groove 6 is V-shaped. When the abrasive grains 11 embedded in the mountain portion fall off due to polishing pressure or the like, the fallen abrasive grains 12 fall into the V-shaped groove of the small and shallow groove 6. As explained in FIG. 6 above, if the polishing surface plate is a polishing surface plate without grooves, the abrasive grains will be drawn in and damage the workpiece. The abrasive grains 12 fall into small, shallow V-shaped grooves. Therefore, the abrasive grains are prevented from being caught between the workpiece and the polishing surface plate, and the workpiece is not scratched. Next, when a polishing liquid containing no abrasive grains is supplied, the workpiece 8 attached to the holder 7 comes into contact with the polishing surface plate 13 and rotates together, as shown in FIG. Therefore, due to the centrifugal force of the polishing surface plate and the rotating action of the workpiece, the abrasive grains are transferred from the small V-shaped grooves to the large deep grooves 6 so as to wash away the abrasive grains that have fallen into the small and shallow V-shaped grooves. It is washed away, flows through a larger groove, and is discharged.

As mentioned above, the dropped abrasive grains and the extra abrasive grains not directly related to processing fall into the shallow grooves and flow through the larger grooves to be discharged.
Stable embedded abrasive grains remain. In this state, when polishing is performed while supplying a polishing liquid that does not contain the abrasive grains, the abrasive grains embedded in the polishing surface plate further polish the polishing process while receiving the lubricating action of the polishing liquid. As a result, a polished surface with fewer polishing scratches can be obtained.

Effects of the Invention The present invention uses a polishing surface plate in which large deep grooves and small shallow grooves are provided on the polishing surface of the polishing surface plate, and a polishing liquid mixed with abrasive grains,
A good polished surface with few polishing scratches can be obtained by performing polishing with a polishing fluid that does not contain abrasive grains, and removing dropped abrasive grains and excess abrasive grains that are not directly related to the process. It will be done.

[Brief explanation of the drawing]

FIG. 1 is a half-sectional view of a polishing surface plate for explaining the polishing method of the present invention, FIG. 2 is an enlarged view of the polishing surface plate, and FIG. Schematic diagram of the board, No. 4
The figure is a partially enlarged view illustrating the large deep grooves and small shallow grooves of the polishing surface plate and the effect of the polishing liquid that does not contain abrasive grains. Figure 5 shows the abrasive grains embedded in the polishing surface plate in the conventional polishing method. FIG. 6 is a cross-sectional view showing the process, and FIG. 6 is a cross-sectional view showing the fallen abrasive grains. 13...Grinding surface plate, 5...Large deep groove, 6...Small and shallow groove, 7...Holder, 8.Medium...Workpiece, 9... Polishing liquid mixed with abrasive grains, 1o... Polishing liquid without abrasive particles mixed in, 11... Abrasive grains, 12... Falling off Abrasive grain. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
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Claims (1)

[Claims] The workpiece attached to the holder is placed on the polishing surface plate, which has large deep grooves and small shallow grooves on the polishing surface, and the polishing liquid mixed with abrasive grains is applied while rotating the polishing surface plate. After supplying and polishing the workpiece, by continuously supplying a polishing liquid that does not contain abrasive grains, the rotating centrifugal force of the polishing surface plate and the polishing surface plate are brought into contact with each other. A polishing method characterized in that the polishing liquid mixed with the abrasive grains is discharged from the small, shallow grooves of the polishing surface plate into the large, deep grooves by the action of a rotating workpiece.