JP3159177B2 - Flat polishing machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a planar polishing apparatus capable of processing a semiconductor wafer, a wafer with an insulating film or a metal wiring of a semiconductor circuit, a magnetic disk, a glass substrate, and other plate-like workpieces with high smoothness. About.

[0002]

2. Description of the Related Art Semiconductor wafers and magnetic disks are required to be miniaturized and highly accurate for high density and high performance, and also to be reduced in cost.

Recently, Japanese Patent Application Laid-Open Nos. 4-33336 and 5-53 disclose polishing of semiconductor wafers and magnetic disks.
Japanese Patent Application Laid-Open No. 69310/1993 or Japanese Patent Application Laid-Open No. 5-309559 discloses a planar polishing apparatus.

FIG. 4 shows an example of a conventional planar polishing apparatus similar to that described in the above publication. This plane polishing machine
The disk-shaped polishing tool 41 is arranged with its processing surface facing upward, and is driven to rotate. Then, the workpiece 42 is brought into pressure contact with the processing surface on the upper surface of the disc-shaped polishing tool 41 by the pressure holding plate 43, and the surface is polished while the polishing liquid 44 is supplied to the processing surface.

[0005]

However, in the above-mentioned conventional planar polishing apparatus, as shown in FIG. 5, the processing amount of the inner peripheral portion is smaller than the outer peripheral portion of the workpiece, and the inner peripheral portion is smaller than the outer peripheral portion. There has been a problem that the peripheral portion becomes thick and the uniformity of the wall thickness deteriorates. One of the factors is that the polishing liquid does not easily enter the center of the workpiece surface during polishing, and the second factor is the abrasion and abrasion of the polishing tool that comes into contact with the center of the workpiece. Is more intense than the part.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a planar polishing apparatus capable of polishing a large-diameter workpiece with good uniformity.

[0007]

SUMMARY OF THE INVENTION A planar polishing apparatus according to the present invention is a planar polishing apparatus in which a workpiece is brought into pressure contact with a processing surface of a rotating disk-shaped polishing tool and a polishing liquid is supplied to the processing surface. In the planar polishing apparatus, a single annular groove for supplying a polishing liquid is formed coaxially with the center of rotation of the polishing surface of the polishing tool, and the annular groove is provided at the center of rotation of the workpiece. It is characterized by passing through.

In this planar polishing apparatus, one annular groove of the polishing tool can be an aggregate of single concave grooves or small pitch concave grooves. Further, it is preferable that grooves are provided radially only in the outer peripheral portion so as to be connected to the annular grooves of the polishing tool. Further, it is preferable to provide a swing device for swinging the workpiece with a width larger than the entire width of the annular groove.
Further, it is preferable to have a polishing liquid supply device provided with a nozzle for supplying a polishing liquid to the inner peripheral portion of the polishing tool surface, the outer peripheral portion of the polishing tool surface, and the annular groove portion divided by the annular groove. Furthermore, the polishing tool may contain cashew resin. Furthermore, a tool is provided at a position in front of the workpiece with respect to the rotation direction of the polishing tool.
The tapered roller shape Dore' support having a radius entire width dressing target area and to Ken Migakuko Gugai circumferential direction on the diameter of the spread provided, in the forward position of the dresser with respect to the direction of rotation of the polishing tool,
Said radius of the total width of the polishing tool to the suction region of interest Ken Migakueki suction device is arranged, the polishing liquid suction device of the workpiece
Across the straight radial line of passing through the center Ken Migakuko instrument the dresser anti
Preferably, they are arranged in pairs . Furthermore,
The front position of the workpiece with respect to the rotation direction of the polishing tool
And the entire width of the tool radius as the sharpening target area.
A dresser that reciprocates in the direction can be provided.
You.

In the invention according to claim 1 of the present application, a single annular groove for supplying a polishing liquid passing through the center of rotation of the workpiece is provided coaxially with the center of rotation on the polishing surface of the polishing tool. The polishing liquid can be supplied to the central portion of the workpiece. Also, the deformation of the polishing tool that occurs when the workpiece is in pressure contact,
The relief can be achieved by the annular groove, and wear and abrasion of the polishing tool can be reduced.

In the invention according to the second aspect of the present invention, since one annular groove of the polishing tool is an aggregate of a single concave groove or a small pitch concave groove, the central portion of the workpiece is polished. Liquid can be supplied.

In the invention according to the third aspect of the present invention, since the grooves are provided radially only on the outer peripheral portion by being connected to the annular grooves of the polishing tool, polishing dust can be discharged.

In the invention according to claim 4 of the present application, by providing a mechanism for swinging the workpiece with a width larger than the entire width of the annular groove, the center portion of the workpiece is also uniform like the outer peripheral portion. Polished.

According to the fifth aspect of the present invention, a nozzle for supplying a polishing liquid to an inner peripheral portion of the polishing tool surface, an outer peripheral portion of the polishing tool surface, and the annular groove portion divided by the annular groove is provided. In addition, the polishing liquid can be uniformly supplied to the surface of the workpiece, and the polishing can be performed with high uniformity.

In the invention according to claim 6 of the present application, since the polishing tool contains cashew resin, the frictional force with the workpiece increases, and the polishing rate can be increased.

Further, in the invention according to claim 7, the taper roller having a diameter expanding in the outer peripheral direction of the polishing tool with the entire width of the tool radius set as a sharpening target area at a position in front of the workpiece with respect to the rotation direction of the polishing tool. by providing the Jo Dore' service can sharpen the radial overall width of the polishing tool. This
The dressing with respect to the rotation direction of the polishing tool.
The full width of the polishing tool radius is set as the suction target area
The polishing liquid suction device directly to the polishing tool passing through the center of the workpiece.
Positioned opposite to the dresser with respect to the diameter wire
Stable removal of applied polishing liquid and polishing debris by suction
Polishing can be performed.

Further, in the invention according to claim 8 of the present application, the machining is performed at a position in front of the workpiece with respect to the rotation direction of the polishing tool.
The ingredients radius entire width as dressed target region, by providing the disk-shaped dresser which reciprocates in the radial direction of the polishing tool,
The entire radial width of the polishing tool can be sharpened.

[0017]

Embodiments of the present invention will be specifically described below with reference to the accompanying drawings.

FIG. 1 is a plan view showing the configuration of a flat polishing apparatus according to a first embodiment of the present invention, and FIG. 2 is a side view thereof. 1 and 2, a disc-shaped polishing tool 11 that is rotatable with a machined surface facing upward is rotatably installed on an upper frame 2 of a gantry 1 of a plane polishing apparatus, and is rotated by a motor 20 in a direction indicated by an arrow (a). It is driven to rotate counterclockwise as viewed from above). The polishing tool 11 contains cashew resin, and a workpiece 12 is pressed against a processing surface of the polishing tool 11 by a pressure holding plate 21.

On the working surface of the polishing tool 11, an annular groove 8 composed of a single concave groove is formed coaxially with the rotation center of the polishing tool. The radius of the groove 8 is equal to the distance between the center of rotation of the polishing tool 11 and the center of rotation of the workpiece 12, so that the groove 8 passes through the center of rotation of the workpiece 12. Further, on the polishing surface of the polishing tool 11, there is provided a radial groove 9 connected to the annular groove 8 and extending radially in the outer circumferential direction of the polishing tool 11.

The pressure holding plate 21 and the workpiece 12 rest on the processing surface of the polishing tool 11, and a horizontal frame positioned in front of the workpiece 11 with respect to the rotation direction (a) of the polishing tool. The pair of support rollers 4 of the drum 3 allow the drum 3 to rotate. The pair of support rollers 4 reciprocate by a cylinder 28, whereby the workpiece 12 supported by the rollers 4 reciprocates on the polishing tool 11 in the radial direction.

Above the processing surface of the polishing tool 11, a slight gap (1 mm or less) is maintained between the polishing surface and the processing surface of the polishing tool 11. , A polishing liquid suction device 13 is provided. The polishing liquid suction device 13 suctions and recovers the polishing liquid on the processing surface of the polishing tool 11 from the small diameter hole on the bottom surface of the rectangular parallelepiped box. Tapered roller-shaped dressers 14 having a diameter expanding in the outer peripheral direction of the polishing tool are arranged symmetrically on both sides of a radial line of the polishing tool 11 in parallel with the radial direction. The tapered roller-shaped dresser 14 is driven to rotate by a motor 17 while being in contact with the polishing tool 11.

The polishing liquid supply device 15 is provided with the annular groove 8.
A nozzle 16 is provided for supplying a polishing liquid to the inner peripheral portion of the polishing tool surface, the outer peripheral portion of the polishing tool surface, and the portion of the annular groove 8 divided by the above. The polishing liquid supply device 15 includes the polishing tool 1
It is disposed at a position behind the workpiece 12 with respect to one rotation direction. The dresser 14 is disposed at a position in front of the workpiece 12 with respect to the rotation direction of the polishing tool 11. The polishing liquid suction device 13 is disposed at a position between the dresser 14 and the polishing liquid supply device 15. These polishing liquid supply device 15, polishing liquid suction device 13 and dresser 14
Is supported by the gantry 1 so as to cover the entire width of the polishing tool 11 in the radial direction.

The polishing liquid suction device 13 has three times more polishing liquid suction holes (diameter, for example, 1 mm) on the polishing liquid suction surface facing the inner and outer peripheral portions of the polishing tool 11 than the central portion. . Further, the polishing liquid suction device 13 has a plurality of shallow grooves having a depth of 1 mm or less on the outer peripheral portion of the polishing liquid suction surface facing the polishing tool 11. Further, the polishing liquid supply device 15
The outer periphery of the polishing liquid suction surface facing the polishing tool 11 is provided with a roundness (roundness radius 2 mm). The dresser 14 is a mixture of natural diamond particles (150 microns) and artificial diamond particles (100 microns) and fixed in a tapered roller shape.

As shown in FIG. 2, below the upper frame 2 of the gantry 1, a regenerating circulation for regenerating the polishing liquid absorbed and recovered by the polishing liquid suction device 13 and supplying the polishing liquid to the polishing liquid supply device 15. Circuit 5 is provided. The regeneration circuit 5 includes a polishing liquid tank 18 and a filter 23 for removing the polishing liquid. The polishing liquid tank 18 stores the collected polishing liquid, removes foreign substances by sedimentation and filtration, and simultaneously causes overflow to flow downstream to a plurality of (three in this example) sedimentation tanks 18A, 18B. 18C. In each of the sedimentation tanks 18A, 18B, and 18C, the height of the partition wall is sequentially changed so that the overflow portion flows down sequentially from the upstream settling tank to the downstream settling tank.

The polishing liquid suction device 13 is connected to the upstream settling tank 18A by a pipe 22 via a pump 25, and the polishing liquid supply device 15 is connected to the downstream settling tank 18C via a pump 24 and a filter 23. They are connected by a pipe 22. The pump 25 on the suction side is a powerful pump capable of sucking the polishing liquid together with air from the polishing liquid suction device 13.
The pump 24 on the supply side can discharge the polishing liquid at a supply rate of about 100 cc / min. The filter 23 is for removing foreign substances that could not be removed in the polishing liquid settling tanks 18A, 18B, and 18C.
And a two-stage mesh of 5 μm.

Next, the operation of the planar polishing apparatus of this embodiment will be described. The polishing liquid is supplied from the polishing liquid supply device 15 to the processing surface as the processing is started by the polishing tool 11. The polishing liquid supplied to the processing surface just before the workpiece 12 reaches the processing location of the workpiece 12 by the rotation of the polishing tool 11, and the polishing tool generated by the rotation of the polishing tool 11 and the rotation of the workpiece 12. The workpiece 12 is polished by friction between the workpiece 11 and the workpiece 12. For example, a depth of 1 mm and a width of 10 m at a position of the polishing tool radius where the rotation center of the workpiece 12 is located.
An annular groove 8 consisting of a single concave groove of m is provided, and a radial groove 9 having a depth of 1 mm and a width of 2 mm is provided in the outer circumferential direction of the polishing tool 11 by being connected to the annular groove 8.
The polishing liquid supplied from the nozzle 16 is supplied to the central portion of the workpiece 12 without excess and deficiency, and the polishing waste after processing is discharged. Further, the elastic deformation of the polishing tool that occurs when the workpiece 12 comes into contact with the polishing tool 11 under pressure is caused by the annular groove 8.
The stress is relieved at the portion, and the wear and the abrasion at the center of the polishing tool 11 can be reduced.

After passing through the workpiece 12, the polishing tool 1 is formed by a tapered roller-shaped dresser 14 located downstream of the flow.
By the first setting, the polishing liquid used for polishing is dug up from the surface of the polishing tool 11, and immediately the polishing liquid suction device 1
Suctioned by 3. Dresser 14 is composed of natural diamond particles (150 microns) and artificial diamond particles (1
(00 micron) is used, a sharpening effect is obtained at the sharp point of the cutting edge of natural diamond particles, and the dresser cost can be reduced by mixing with artificial diamond particles. Therefore, even when the processing pressure of the workpiece 12 is high, the polishing waste and the polishing tool waste on the surface of the polishing tool 11 are excavated together with the polishing liquid and are removed in-process, so that the processing surface is always kept clean. Will be kept.

The polishing liquid suction device 13 has three times more polishing liquid suction holes than the central portion on the polishing liquid suction surface facing the inner peripheral portion and the outer peripheral portion of the polishing tool 11. It is possible to efficiently suck the polishing liquid that collects in a large part and the outer peripheral part. The polishing liquid suction device 13 is provided with a plurality of shallow grooves having a depth of 1 mm or less on the outer peripheral portion of the polishing liquid suction surface facing the polishing tool 11, and tends to flow to the outer peripheral portion of the polishing tool 11 by centrifugal force. The polishing liquid can be efficiently sucked by the polishing liquid being captured by the shallow groove on the outer peripheral portion of the polishing liquid suction surface.

Further, the polishing liquid suction device 13 is used to
1 is rounded on the outer peripheral portion of the polishing liquid suction surface facing the polishing tool 1.
Even in the case of contact with 1, the polishing tool 11 can be prevented from being damaged.

Therefore, the polishing liquid is supplied to the central portion of the workpiece without any excess or shortage, and the wear and agglomeration of the polishing tool contacting the central portion of the workpiece are reduced. The peripheral portion can be processed in the same manner as the outer peripheral portion, and a large-diameter workpiece can be polished with uniformity. In this case, since the polishing liquid is supplied to the entire width of the processing surface of the polishing tool 11 and the polishing liquid is recovered from the entire width of the processing surface, the polishing can be performed under the same conditions regardless of the size of the workpiece 12. it can.

Next, a second embodiment of the present invention will be described. FIG. 3 is a plan view showing a planar polishing apparatus according to a second embodiment of the present invention. 3, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description thereof will be omitted. In the planar polishing apparatus of the second embodiment, the aggregate 30 of small pitch concave grooves is used as the annular groove. A small disk dresser 31 that reciprocates in the radial direction of the polishing tool is disposed as a dresser. In addition, small disk dresser 3
Microswitches 32 are arranged at both ends of one reciprocating movement width, and the small disk dresser 31
Is provided with a mechanism for reciprocating. Other configurations are the same as in the first embodiment.

Next, the operation of this embodiment will be described.
The polishing liquid is supplied from the polishing liquid supply device 15 to the processing surface as the processing is started by the polishing tool 11. The polishing liquid supplied to the processing surface just before the workpiece 12 reaches the processing location of the workpiece 12 by rotation of the polishing tool 11, and the polishing tool 1
Polishing tool 1 generated by rotation of workpiece 1 and rotation of workpiece 12
The workpiece 12 is polished by friction between the workpiece 1 and the workpiece 12. An annular groove 30 composed of a collection of small pitch grooves having a depth of 1 mm, a pitch of 2 mm, and a total width of 10 mm is provided at a radial position of the polishing tool where the rotation center of the workpiece 12 is located, and is connected to the annular groove 30. For example, the radial groove 9 having a depth of 1 mm and a width of 2 mm is provided in the outer peripheral direction of the workpiece 11, so that the polishing liquid supplied from the nozzle 16
2 is supplied to the center of the machine 2 without any excess or shortage, and polishing dust after processing is discharged. Further, the workpiece 12 is the polishing tool 11
The elastic deformation of the polishing tool that occurs when the polishing tool comes into contact with the surface of the polishing tool is released by the annular groove 30 to relieve the stress, thereby reducing wear and agglomeration at the center of the polishing tool 11.

After passing through the workpiece 12, the polishing liquid used for polishing is sharpened by the dressing of the polishing tool 11 by the small disk-shaped dresser 31 located downstream of the flow.
It is dug up from the surface and is immediately sucked by the polishing liquid suction device 13. The dresser 31 uses a small grindstone in which natural diamond particles (150 microns) and artificial diamond particles (100 microns) are mixed. It has a mixed configuration and a small diameter, so that the dresser cost can be reduced. Even when the processing pressure of the workpiece 12 is high, the polishing waste and the polishing tool waste on the surface of the polishing tool 11 are dug up together with the polishing liquid and are removed in-process, so that the processing surface is always kept clean. It is.

Therefore, the polishing liquid is supplied to the central portion of the workpiece without any excess or shortage, and the wear and the agglomeration of the polishing tool in contact with the central portion of the workpiece are reduced.
The inner peripheral portion of the workpiece can be processed in the same manner as the outer peripheral portion, and a large-diameter workpiece can be polished with uniformity. In this case, the polishing liquid is supplied to the entire width of the processing surface of the polishing tool 11,
Since the polishing liquid is recovered from the entire width of the processing surface, the workpiece 1
Regardless of the size of 2, polishing can be performed under the same conditions.

[0035]

Next, a description will be given of the results of a polishing test performed by a flat polishing apparatus according to an embodiment of the present invention. First,
A specific test result using the planar polishing apparatus of the first embodiment shown in FIGS. 1 and 2 will be described. In this test, a disk-shaped polishing tool 11 made of polyurethane (30 inches in diameter) was used, a colloidal silica (particle diameter of 100 Å) was used as a polishing solution, and a wafer (workpiece) with a silicon dioxide film was used. Polished.

The rotational speed of the polishing tool is 24 rpm and the working pressure is 6
00 g / cm 2, wafer swing width 40 mm
And the polishing amount of a 12-inch wafer was 150
The polishing uniformity was ± 3% at 00 ± 500 Å, and the problem that the uniformity of a large-diameter wafer which had been conventionally polished was reduced was solved.

In this method, an annular groove 8 consisting of a single concave groove is provided at a radial position of the polishing tool where the rotation center of the workpiece 12 is located.
By providing the radial groove 9 connected to the annular groove 8 in the outer peripheral direction of the polishing tool 11, the polishing liquid supplied from the nozzle 16 is supplied to the center of the workpiece 12 without excess and shortage. This is because polishing dust after processing was discharged. Furthermore, the elastic deformation of the polishing tool, which occurs when the workpiece 12 comes into contact with the polishing tool 11 under pressure, is released by the annular groove 8 to relieve the stress, thereby reducing wear and agglomeration at the center of the polishing tool 11. It is thought to be.

Next, the results of a test performed by the planar polishing apparatus of the second embodiment shown in FIG. 3 will be specifically described. This test was also performed under the same conditions as in the first embodiment. As a result, the polishing amount of a 12-inch wafer is 1500
The polishing uniformity was ± 4% at 0 ± 600 Å, and the problem that the uniformity of a large-diameter wafer which had been conventionally polished was reduced was solved.

Although the embodiment of the present invention has been described in detail with reference to the drawings, the specific structure is not limited to this embodiment, and various modifications can be made without departing from the scope of the present invention. Are also included in the scope of the present invention. For example, if an upright wall for preventing the outflow of the polishing liquid is provided at the periphery of the processing surface of the polishing tool, the polishing liquid supplied to the processing surface does not flow out of the processing surface, so that the polishing liquid collection efficiency is improved. This contributes to a reduction in running costs. Further, the workpiece is not limited to the wafer with the silicon dioxide film, and includes, for example, a wafer with metal wiring, a magnetic disk, a glass substrate, and other plate-like ones.

[0040]

As described above, according to the first aspect of the present invention, the polishing liquid can be supplied to the central portion of the workpiece without excess or shortage. In addition, deformation of the polishing tool that occurs when the workpiece is in pressure contact can be released by the annular groove, and wear and abrasion at the center of the radius of the polishing tool can be reduced. Therefore, the inner peripheral portion of the workpiece can be processed in the same manner as the outer peripheral portion, and a large-diameter workpiece can be polished with uniformity. According to the second aspect of the present invention, the polishing liquid can be supplied to the entire surface including the central portion of the workpiece.

According to the third aspect of the present invention, abrasive chips can be discharged by the radial grooves of the polishing tool.

According to the invention of claim 4 of the present application, the central portion of the workpiece can be polished uniformly similarly to the outer peripheral portion.

According to the fifth aspect of the present invention, the polishing liquid is uniformly supplied to the surface of the workpiece, and the polishing can be performed with high uniformity.

According to the invention of claim 6 of the present application, the frictional force with the workpiece increases, and the polishing rate can be increased.

According to the seventh aspect of the present invention, the entire width in the radial direction of the polishing tool can be sharpened , and the used polishing tool can be used.
Suction removal of polishing liquid and polishing debris for stable polishing
be able to.

According to the eighth aspect of the present invention, the entire width of the polishing tool in the radial direction can be sharpened.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of a planar polishing apparatus according to a first embodiment of the present invention.

FIG. 2 is a side view showing the configuration of the planar polishing apparatus.

FIG. 3 is a plan view showing a configuration of a planar polishing apparatus according to a second embodiment of the present invention.

FIG. 4 is a side view of a conventional planar polishing apparatus.

FIG. 5 is a view for explaining a shape of a workpiece after polishing in a conventional flat surface polishing apparatus.

DESCRIPTION OF SYMBOLS 5; regeneration circulation circuit 8, 30; annular groove 9; radial groove 11; polishing tool 12; workpiece 13; polishing liquid suction device 14; tapered roller dresser 15; polishing liquid supply device 16; 17; motor 18; polishing liquid tank 18A, 18B, 18C; sedimentation tank 21; pressure holding plate 23; filter 24, 25; pump 28; hydraulic cylinder 31; disk-shaped dresser 32;

Continuation of the front page (56) References JP-A-1-127265 (JP, A) JP-A-62-44370 (JP, A) JP-A-10-58315 (JP, A) JP-A-9-11117 (JP, A) , A) JP-A-11-58219 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) B24B 37/04 B24B 27/00 H01L 21/304 622

Claims (6)

(57) [Claims] 1. A planar polishing apparatus for bringing a workpiece into pressure contact with a processing surface of a rotating disk-shaped polishing tool and polishing the surface while supplying a polishing liquid to the processing surface. Is formed with a single annular groove for supplying the polishing liquid coaxially with the center of rotation thereof, the annular groove passes through the center of rotation of the workpiece, and the annular groove of the polishing tool is provided.
A flat polishing apparatus characterized in that grooves are radially provided only in the outer peripheral portion by being connected to the groove . 2. A processing surface of a disk-shaped polishing tool which is driven to rotate.
The workpiece is pressed into contact with the
In a flat-surface polishing apparatus for flat-surface polishing, the polishing tool
One polishing liquid is provided coaxially with the center of rotation
An annular groove for feeding is formed, and this annular groove is
A planar polishing apparatus, further comprising a swinging device which passes through a rotation center of the workpiece and swings the workpiece with a width larger than the entire width of the annular groove. 3. A processing surface of a disk-shaped polishing tool which is driven to rotate.
The workpiece is pressed into contact with the
In a flat-surface polishing apparatus for flat-surface polishing, the polishing tool
One polishing liquid is provided coaxially with the center of rotation
An annular groove for feeding is formed, and this annular groove is
A polishing liquid supply device that passes through the center of rotation of a workpiece and has nozzles for supplying polishing liquid to the inner peripheral portion of the polishing tool surface, the outer peripheral portion of the polishing tool surface, and the annular groove portion divided by the annular groove. A planar polishing apparatus characterized by having: 4. A machined surface of a disk-shaped polishing tool driven to rotate.
The workpiece is pressed into contact with the
In a flat-surface polishing apparatus for flat-surface polishing, the polishing tool
One polishing liquid is provided coaxially with the center of rotation
An annular groove for feeding is formed, and this annular groove is
A planar polishing apparatus , wherein the polishing tool includes a cashew resin and passes through a center of rotation of a workpiece. 5. A processing surface of a disk-shaped polishing tool which is driven to rotate.
The workpiece is pressed into contact with the
In a flat-surface polishing apparatus for flat-surface polishing, the polishing tool
One polishing liquid is provided coaxially with the center of rotation
An annular groove for feeding is formed, and this annular groove is
A tapered roller that passes through the center of rotation of the workpiece and has a diameter extending in the outer peripheral direction of the polishing tool, with the entire width of the tool radius being a sharpening target area at a position in front of the workpiece with respect to the rotation direction of the polishing tool. A dresser is provided, and a polishing liquid suction device is disposed at a position in front of the dresser with respect to a rotation direction of the polishing tool with a full width of a radius of the polishing tool as a suction target area. A flat-surface polishing apparatus, which is disposed at a position opposite to the dresser with respect to a diameter line of a polishing tool passing through a center. 6. 請 the single annular groove of said polishing tool is characterized in that it is a collection of single groove or a small pitch groove
The planar polishing apparatus according to any one of claims 1 to 5 .