JP3058274B1 - Flat polishing machine - Google Patents

Abstract

An object of the present invention is to provide a planar polishing apparatus capable of further reducing the size of the entire apparatus while maintaining high precision of the planar polishing processing. SOLUTION: An annular polishing tool 2 and the annular polishing tool 2 are provided.
A disk-shaped pressing member 11 that presses the workpiece 10 placed on the workpiece A toward the annular polishing tool 2 and moves integrally with the workpiece 10, and that is pressed when the annular polishing tool 2 rotates. A polishing position that allows the workpiece 10 and the pressing member 11 to rotate, and prevents the workpiece 10 and the disc-shaped pressing member 11 from moving together with the annular polishing tool 2 to maintain a predetermined polishing position. And a holding mechanism 13. Then, the outer diameter of the annular polishing tool 2 is set to a value larger than the diameter of the circumscribed circle of the workpiece 10 and smaller than twice the diameter of the circumscribed circle of the workpiece 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a planar polishing apparatus, and more particularly, to a semiconductor wafer, a wafer provided with semiconductor circuits,
The present invention relates to a planar polishing apparatus for planarly processing a disk-shaped workpiece such as a magnetic disk or a plate-shaped workpiece such as a glass substrate with a high degree of smoothness.

[0002]

2. Description of the Related Art Conventionally, in planar polishing using an annular polishing tool having an annular polishing surface, the size of an object to be processed is limited due to the property of rotating the annular polishing tool to perform planar polishing. That is, based on the width of the polishing tool surface located on one side (radial side) from the center of rotation of the annular polishing tool, planar polishing is performed only on a workpiece having a smaller diameter. .

FIGS. 6A and 6B show a conventional example. In the conventional example shown in FIGS. 6A and 6B, the turntable 10
1 is provided with an annular polishing tool 102 having a constant thickness. The diameter D0 of the annular polishing tool 102 is the same as the diameter D0 of the turntable 101. The symbol d0 indicates the diameter of the inner diameter (the central through hole) of the annular polishing tool 102. The symbol w indicates the annular polishing tool 1
02 shows the width of the polishing tool surface 102A in the radial direction 02. In the case of FIG. 4, the width w of the polishing tool surface is expressed as w =
(D0-d0) / 2.

[0004] Reference numeral 100 denotes a disk-shaped workpiece placed on the polishing tool surface 102A. This workpiece 100
The object whose diameter K0 is smaller than the width w of the polishing tool surface of the annular polishing tool 102 is the object of polishing.

The workpiece 100 is constantly pressed against the above-mentioned annular polishing tool 102 by a disk-shaped pressure holding plate 201 having the same diameter (a state in which an appropriate polishing pressure is applied). ). In the conventional example shown in FIG. 6, a pressure holding plate 201 having the same diameter K0 as the workpiece 100 is used.

The pressure holding plate 201 presses the workpiece 100 toward the annular polishing tool 102 and simultaneously rotates and moves integrally with the workpiece 100 by the annular polishing tool 102. I have. Reference numeral 202 is
The pressure holding plate 201 and the work piece 100 are
12 shows a polishing position holding mechanism that is set and held so as to be located at a predetermined position on 02A.

When the workpiece 100 is polished, first, when the turntable 101 is urged by a drive motor (not shown) to rotate in the direction of the arrow R, the workpiece placed on the polishing tool surface 102A is rotated. 100 is to rotate moved together with the annular polishing tool 102, is blocked by the polishing position holding mechanism 202 is Tomeoki the position shown in FIG.

At the same time, as shown in FIG. 6 (b), due to the difference in peripheral speed between the center axis side and the outer diameter side of the annular polishing tool 102,
The polishing tool rotates in the direction of arrow C on the polishing tool surface 102A and while being pressed by the pressure holding plate 201. For this reason, a rubbing state occurs between the polishing tool surface 102 </ b> A and the workpiece 100 is polished with high precision and uniformity by the annular polishing tool 102.

[0009] Further, the polishing tool wears as the number of times of use increases, causing irregularities or surface roughness. So, in recent years,
Attempts have been made to form a smooth polishing tool surface by performing indexing with a dresser and scraping the polishing tool surface to perform highly smooth polishing. On the other hand,
In JP-A-130688, an attempt is made to alternately repeat a polishing step and a cleaning step in order to constantly perform polishing in a clean state. The polishing liquid used for polishing is usually subjected to an operation such as dripping on a part of the polishing tool surface or spraying the entire surface of the polishing tool with a spray or the like.

[0010]

However, in the above-mentioned conventional example, since the workpiece 100 having a diameter K0 smaller than the width w of the polishing tool surface 102A in the radial direction of the annular polishing tool 102 is processed. However, as the diameter of the disk-shaped workpiece 100 increases, the size of the annular polishing tool 102 must be increased.

Further, when the disk-shaped workpiece 100 is fixed and polished at one location, the polishing tool surface that comes into contact with the workpiece 100 is repeatedly used, which often causes scratches and the like. Furthermore, when a flat polishing tool surface is created using a disk-shaped dresser in order to perform highly smooth planar polishing, the diameter of the disk-shaped dresser is often smaller than the width of the polishing tool surface 102A. There is a disadvantage that only a part of the tool surface 102A is scraped off.

Further, there is a case where the polishing process and the cleaning process are repeatedly and alternately performed on the disc-shaped workpiece 100 with the intention of always performing the polishing in a clean state. There was a problem that it took time.

When the polishing liquid is dripped on a part of the polishing tool surface 102A or the polishing liquid is sprayed on the whole,
The polishing liquid accumulates only in a part of the polishing liquid, or the polishing liquid scatters in air other than the polishing tool surface 102A, for example, in the air.

[0014]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a planar polishing apparatus which can solve the disadvantages of the prior art, and in particular, can reduce the size of the entire apparatus more reliably while maintaining high precision of the planar polishing processing. Aim.

[0015]

In order to achieve the above object, according to the first aspect of the present invention, an annular polishing tool having an annular polishing tool surface, and a workpiece mounted on the annular polishing tool are annular. A disc-shaped pressing member that uniformly presses ( presses ) the polishing tool side and moves integrally with the workpiece, and the workpiece and the disc-shaped pressing member rotate when the annular polishing tool rotates. from being allowed, and a polishing position holding mechanism in which the workpiece and the circular <br/> discotic pressure member to maintain a predetermined target polishing position by preventing the movement of an annular polishing tool described above The outer diameter of the annular polishing tool is set to a value larger than the diameter of the circumscribed circle of the workpiece and smaller than twice the diameter of the circumscribed circle of the workpiece . Further, the polishing position holding mechanism described above is
The center position of the contact area between the polishing tool and the workpiece
Align the center of gravity of the workpiece and maintain that position
A configuration is provided in which a center-of-gravity position setting function for a workpiece is provided .

Therefore, according to the first aspect of the present invention,
If you set the whole equipment in the operational state, first, annular polishing tool as in the prior art example described above is rotated in the direction indicated in (a) direction of FIG. At the same time, the workpiece and the disc-shaped pressing member on the polishing tool surface also try to rotate in the same direction, but the movement is prevented by the polishing position holding mechanism, and the polishing position holding mechanism is kept at the predetermined position shown in FIG. In this case, a predetermined friction is generated between the workpiece and the polishing tool surface, and the workpiece rotates by itself due to a difference in rotational peripheral speed between the inner diameter side and the outer diameter side. Due to the rotation, even if the diameter of the workpiece is larger than the radial width of the polishing tool surface, the protruding portion is also sequentially brought into contact with the polishing tool surface and rubbed, whereby the workpiece is polished smoothly. You. Further, as shown in FIG.
Center position (center of gravity) of the contact area between the tool and the workpiece
Since the center of gravity of the workpiece is matched,
The machined surface of the workpiece contacts the polishing tool surface more
As a result, the polishing process is performed with high accuracy in a stable state.
Continuation efficiently (in other words, increase polishing efficiency
) Can be performed. That is, this claim 1
In the described invention, the diameter of the workpiece is the radius of the polishing tool surface.
Even if the width is larger than the width of the
At this point, the entire device can be reliably reduced.
Can be typed. In addition, annular grinding tools and workpieces
Center position (center of gravity) of contact area with the center of gravity of workpiece
The diameter of the annular grinding tool is
Polishing efficiency is improved even if it is smaller than the diameter of the grinding tool.
There is an advantage that it can be increased.

According to the second aspect of the present invention, an annular polishing tool having an annular polishing tool surface and a workpiece mounted on the annular polishing tool are uniformly pressed against the annular polishing tool, and the workpiece is processed. A disk-shaped pressing member that moves integrally with the object, a workpiece and the disk-shaped pressing member that are allowed to rotate when the annular polishing tool is rotated, and that the workpiece and the disk-shaped pressing member are rotated. A polishing position holding mechanism for holding a predetermined position to be polished by preventing a member from moving together with the above-mentioned annular polishing tool. Is set to a value larger than the diameter of the circumscribed circle and smaller than twice the diameter of the circumscribed circle of the workpiece. Further, a disc-shaped dresser having a diameter larger than the width of the polishing tool surface is disposed on the polishing tool surface of the annular polishing tool, and the disc-shaped dresser is moved with respect to the rotation direction of the annular polishing tool. It is configured to be arranged on the upstream side of the workpiece. Therefore, this claim 2
In the described invention, when the entire equipment is set to the operating state, first, as in the case of the above-described conventional example, the annular polishing tool is moved to the state shown in FIG.
It rotates in the direction shown in direction a. At the same time, the workpiece and the disc-shaped pressing member on the polishing tool surface also try to rotate in the same direction, but the movement is prevented by the polishing position holding mechanism, and FIG.
At a predetermined position shown in FIG. In this case, a predetermined friction is generated between the workpiece and the polishing tool surface, and the workpiece rotates by itself due to a difference in rotational peripheral speed between the inner diameter side and the outer diameter side. Due to the rotation, even if the diameter of the workpiece is larger than the radial width of the polishing tool surface, the protruding portion is also sequentially brought into contact with the polishing tool surface and rubbed, whereby the workpiece is polished smoothly. You. Further, it is possible to avoid a situation where the polishing tool surface of the annular polishing tool is clogged, and it is possible to always maintain the polishing tool surface in a new state. In this respect, there is an advantage that the entire apparatus can be reliably reduced in size, and the work of polishing the workpiece can be efficiently continued.

According to the third aspect of the present invention, an annular polishing tool having an annular polishing tool surface and a workpiece mounted on the annular polishing tool are uniformly pressed against the annular polishing tool, and the workpiece is processed. A disk-shaped pressing member that moves integrally with the object, a workpiece and the disk-shaped pressing member that are allowed to rotate when the annular polishing tool is rotated, and that the workpiece and the disk-shaped pressing member are rotated. A polishing position holding mechanism for holding a predetermined position to be polished by preventing a member from moving together with the above-mentioned annular polishing tool. Is set to a value larger than the diameter of the circumscribed circle and smaller than twice the diameter of the circumscribed circle of the workpiece. The above-mentioned polishing position holding mechanism has a polishing position variable setting function of variably setting and holding the rotation center of the workpiece and the disc-shaped pressing member at an arbitrary position on the polishing tool surface of the annular polishing tool. I have. Further, a disc-shaped dresser having a diameter larger than the width of the polishing tool surface is disposed on the polishing tool surface of the annular polishing tool, and the disc-shaped dresser is moved with respect to the rotation direction of the annular polishing tool. It is configured to be arranged on the upstream side of the workpiece. For this reason, according to the third aspect of the present invention, when the entire equipment is set to the operating state, first, the annular polishing tool rotates in the direction indicated by the arrow A in FIG.
At the same time, the workpiece and the disc-shaped pressing member on the polishing tool surface also try to rotate in the same direction, but the movement is prevented by the polishing position holding mechanism, and the polishing position holding mechanism is kept at the predetermined position shown in FIG. In this case, a predetermined friction is generated between the workpiece and the polishing tool surface, and the workpiece rotates by itself due to a difference in rotational peripheral speed between the inner diameter side and the outer diameter side. Due to the rotation, even if the diameter of the workpiece is larger than the radial width of the polishing tool surface, the protruding portion is also sequentially brought into contact with the polishing tool surface and rubbed, whereby the workpiece is polished smoothly. You.
Then, since the workpiece and the disc-shaped pressing member can be variably set at arbitrary positions on the surface of the polishing tool, it is necessary to individually select an optimal polishing processing position according to the size of the workpiece. And can be swung over the surface of the polishing tool as needed. Further, it is possible to avoid a situation where the polishing tool surface of the annular polishing tool is clogged, and it is possible to always maintain the polishing tool surface in a new state. In this respect, there is an advantage that the entire apparatus can be reliably reduced in size, the versatility in polishing the workpiece can be enhanced, and the polishing operation of the workpiece can be continued efficiently.

According to a fourth aspect of the present invention, in the flat surface polishing apparatus of the first aspect, a disc-shaped dresser having a diameter larger than the width of the polishing tool surface is provided on the polishing tool surface of the annular polishing tool. In addition to the arrangement, the disc-shaped dresser is disposed upstream of the workpiece with respect to the rotation direction of the annular polishing tool. Therefore, according to the invention of claim 4, in addition to having the same function as the above-described invention of claim 1, clogging of the polishing tool surface of the annular polishing tool can be avoided. The polishing tool surface can always be maintained in a new state, which makes it possible to efficiently continue the work of polishing the workpiece.

According to the fifth aspect of the invention, an annular polishing tool having an annular polishing tool surface and a workpiece mounted on the annular polishing tool are uniformly pressed against the annular polishing tool, and the workpiece is processed. A disk-shaped pressing member that moves integrally with the object, a workpiece and the disk-shaped pressing member that are allowed to rotate when the annular polishing tool is rotated, and that the workpiece and the disk-shaped pressing member are rotated. A polishing position holding mechanism for holding a predetermined position to be polished by preventing a member from moving together with the above-mentioned annular polishing tool. Is set to a value larger than the diameter of the circumscribed circle and smaller than twice the diameter of the circumscribed circle of the workpiece. Further, a polishing liquid supply mechanism having a plurality of liquid injection nozzles for supplying a polishing liquid to the polishing tool surface of the annular polishing tool at predetermined intervals on the polishing tool surface of the annular polishing tool is provided. A polishing liquid suction mechanism for sucking and collecting used polishing liquid from the polishing tool surface of the annular polishing tool is provided. The polishing liquid supply mechanism is disposed upstream of the workpiece with respect to the rotation direction of the annular polishing tool, and the polishing liquid suction mechanism is disposed downstream of the workpiece with respect to the rotation direction of the annular polishing tool. To be installed.

[0021] Therefore, in the invention of claim 5, wherein the
When the entire equipment is set to the operating state, first, the annular polishing tool rotates in the direction indicated by the arrow A in FIG. At the same time, the workpiece and the disc-shaped pressing member on the polishing tool surface also try to rotate in the same direction, but the movement is prevented by the polishing position holding mechanism, and the polishing position holding mechanism is kept at the predetermined position shown in FIG. In this case, a predetermined friction is generated between the workpiece and the polishing tool surface, and the workpiece rotates by itself due to a difference in rotational peripheral speed between the inner diameter side and the outer diameter side. Due to the rotation, even if the diameter of the workpiece is larger than the radial width of the polishing tool surface, the protruding portion is also sequentially brought into contact with the polishing tool surface and rubbed, whereby the workpiece is polished smoothly. You. Further, it is possible to avoid a situation in which the used polishing liquid remains on the polishing tool surface, and therefore,
The processing conditions of the initial polishing can always be maintained. In this respect, there is an advantage that the entire apparatus can be surely miniaturized and the polishing can be continued with high accuracy for a long time.

According to the sixth aspect of the present invention, an annular polishing tool having an annular polishing tool surface and a workpiece mounted on the annular polishing tool are uniformly pressed against the annular polishing tool, and the workpiece is processed. A disk-shaped pressing member that moves integrally with the object, a workpiece and the disk-shaped pressing member that are allowed to rotate when the annular polishing tool is rotated, and that the workpiece and the disk-shaped pressing member are rotated. A polishing position holding mechanism for holding a predetermined position to be polished by preventing a member from moving together with the above-mentioned annular polishing tool. Is set to a value larger than the diameter of the circumscribed circle and smaller than twice the diameter of the circumscribed circle of the workpiece. The above-mentioned polishing position holding mechanism has a polishing position variable setting function of variably setting and holding the rotation center of the workpiece and the disc-shaped pressing member at an arbitrary position on the polishing tool surface of the annular polishing tool. I have. Further, a polishing liquid supply mechanism having a plurality of liquid injection nozzles for supplying a polishing liquid to the polishing tool surface of the annular polishing tool at predetermined intervals on the polishing tool surface of the annular polishing tool is provided. A polishing liquid suction mechanism for sucking and collecting used polishing liquid from the polishing tool surface of the annular polishing tool is provided. And
The polishing liquid supply mechanism is disposed on the upstream side of the workpiece with respect to the rotation direction of the annular polishing tool, and the polishing liquid suction mechanism is disposed on the downstream side of the workpiece with respect to the rotation direction of the annular polishing tool. , Is adopted.

[0023] Therefore, in the invention of claim 6 wherein the
When the entire equipment is set to the operating state, first, the annular polishing tool rotates in the direction indicated by the arrow A in FIG. At the same time, the workpiece and the disc-shaped pressing member on the polishing tool surface also try to rotate in the same direction, but the movement is prevented by the polishing position holding mechanism, and the polishing position holding mechanism is kept at the predetermined position shown in FIG. In this case, a predetermined friction is generated between the workpiece and the polishing tool surface, and the workpiece rotates by itself due to a difference in rotational peripheral speed between the inner diameter side and the outer diameter side. Due to the rotation, even if the diameter of the workpiece is larger than the radial width of the polishing tool surface, the protruding portion is also sequentially brought into contact with the polishing tool surface and rubbed, whereby the workpiece is polished smoothly. You. Then, since the workpiece and the disc-shaped pressing member can be variably set at arbitrary positions on the surface of the polishing tool, it is necessary to individually select an optimal polishing processing position according to the size of the workpiece. And can be swung over the surface of the polishing tool as needed. Furthermore, it is possible to avoid a situation in which the used polishing liquid remains on the polishing tool surface, and therefore, it is possible to always maintain the initial polishing processing conditions. In this respect, there is an advantage that the entire apparatus can be reliably reduced in size, versatility in polishing a workpiece can be enhanced, and polishing can be continued with high accuracy for a long time.

According to the seventh aspect of the present invention, the above-mentioned claim is provided.
In the plane polishing apparatus 1 Symbol placement, on the polishing tool surface of the annular grinding tool, a polishing liquid supply having a plurality of liquid jet nozzle for supplying a polishing liquid onto the polishing tool surface of the annular grinding tool at a predetermined distance A polishing liquid suction mechanism for mounting and collecting used polishing liquid from the polishing tool surface of the annular polishing tool is provided. The polishing liquid supply mechanism is disposed upstream of the workpiece with respect to the rotation direction of the annular polishing tool, and the polishing liquid suction mechanism is disposed downstream of the workpiece with respect to the rotation direction of the annular polishing tool. To be installed.

Therefore, according to the invention of claim 7 ,
In addition to having the above claims 1 Symbol placement invention functions equivalent can further polishing solution spent to avoid a situation where remains on the polishing tool surface, which is therefore always processed in the initial polishing The condition can be maintained, and also in this respect, there is an advantage that the polishing can be continued with high accuracy for a long time.

In the invention according to claim 8 , the aforementioned claim is provided.
In the plane polishing apparatus 2, 3 or 4, wherein supply onto the polishing tool surface of the ring <br/> shaped polishing tool described above, a predetermined polishing liquid onto the polishing tool surface of the annular grinding tool at a predetermined distance Equipped with a polishing liquid supply mechanism with a liquid injection nozzle
Equipped respectively polishing solution suction mechanism for sucking and collecting the polishing liquid spent from the polishing tool surface of the annular grinding tool. The above-mentioned polishing liquid supply mechanism is arranged on the upstream side of the above-mentioned workpiece with respect to the rotation direction of the annular polishing tool, and the polishing liquid suction mechanism is provided with the above-mentioned disc-shaped liquid crystal in the rotation direction of the annular polishing tool. It is arranged downstream of the dresser.

Therefore, in the invention according to claim 8 ,
In addition to having an inventive equivalent functions of the above claims 2, 3 or 4, further comprising disc-shaped dresser GaKen by polishing solution
Polishing of the polishing tool surface can be performed at the same time.
There is an advantage that the deterioration of the polishing ability of the polishing tool surface of the annular polishing tool over time can be effectively suppressed simultaneously with continuous use.

According to a ninth aspect of the present invention, there is provided the planar polishing apparatus of the fifth , sixth , seventh or eighth aspect , wherein the polishing liquid
A suction mechanism (specifically, a liquid suction nozzle ) is provided along the width direction of the polishing tool surface of the annular polishing tool, and a plurality of polishing liquid suction holes provided in the liquid suction nozzle are formed in the above-described annular polishing tool. The polishing tool has a configuration in which a large amount is formed in the inner diameter side region and the outer diameter side region of the surface facing the polishing tool surface of the polishing tool.

Therefore, according to the ninth aspect of the present invention,
Claim 5 described above, 6, 7 or 8 invention and other functionally equivalent to the described, further, it is possible to efficiently collect the polishing solution spent, always good polishing ability of a polishing tool surface in this respect There is an advantage that it can be maintained in a proper state.

According to a tenth aspect of the present invention, in the planar polishing apparatus according to the ninth aspect, corners at both ends of a surface of the liquid suction nozzle portion opposed to the polishing tool surface of the annular polishing tool are provided with outside air. A configuration in which a plurality of communicating shallow grooves are provided.

Therefore, the tenth aspect of the present invention has the same function as that of the ninth aspect of the present invention, and furthermore, the used polishing liquid on the polishing tool surface is collected even more efficiently. There is an advantage that can be.

According to an eleventh aspect of the present invention, in the planar polishing apparatus according to any one of the fifth to tenth aspects, the rising portion is spaced apart from the outer peripheral portion of the annular polishing tool by a predetermined distance. And a polishing liquid collection tank having a U-shaped cross section that rotates integrally with the annular polishing tool. The polishing liquid collecting tank is provided with a polishing liquid collecting mechanism for sucking out the polishing liquid collected in the polishing liquid collecting tank and sending the polishing liquid to the outside.

The polishing Therefore, in the invention as claimed in claim 11, in addition to having an inventive function equivalent according to any one of claims 5 to 10 described above, further, scattered to the outside from the polishing tool surface The liquid can be effectively collected, and surrounding contamination in the processing step can be suppressed.

According to a twelfth aspect of the present invention, in the flat surface polishing apparatus according to any one of the fifth to eleventh aspects, the polishing liquid sucked and collected by the polishing liquid suction mechanism or the like is regenerated and the above-mentioned polishing is performed. The method employs a configuration in which a recirculation circuit for polishing liquid to be supplied to the polishing liquid supply mechanism is provided.

[0035] Therefore, in the invention of claim 12, wherein, in addition to a function of the same or the like and the invention according to any one of claims 5 to 11 described above, further enables the reuse of the tool polishing solution In addition, the consumption of the polishing liquid can be reduced, and in this respect, there is an advantage that the productivity in the polishing process can be improved.

[0036]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described.
This will be described with reference to FIGS.

1 and 2, reference numeral 1 denotes a case main body, and reference numeral 1A denotes an upper floor portion of the case main body 1. At the center of the upper floor 1A, a turntable 4 that is rotated by a drive motor 3 is provided. The annular polishing tool 2 is mounted on the turntable 4 such that the polishing tool surface 2A is annular (donut-shaped) and the polishing tool surface 2A forms a horizontal plane.

The polishing tool surface 2A of the annular polishing tool 2
On the top, a disk-shaped workpiece 1 for polishing the plate surface
0 is placed. This workpiece 10
During polishing, the disk is uniformly pressed against the above-described annular polishing tool 2 by a disk-shaped pressing member 11 which is a pressing member. Therefore, so that the object to be <br/> Labs Migakumen of the workpiece 10 is polished to a uniform and high accuracy.

In this embodiment, as shown in FIGS. 1 and 2, the disk-shaped pressing member 11 having the same diameter as the diameter K2 of the workpiece 10 is used. The object 10 is pressed against the annular polishing tool 2. In this way, the workpiece 10 and the disc-shaped pressing member 11 can be easily integrated, and can be easily attached and detached. In this respect, workability can be improved.

The disc-shaped pressing member 11 is
As long as the workpiece 10 can be uniformly pressed toward the annular polishing tool, a workpiece having a diameter different from the diameter D10 of the workpiece 10 may be used. Also, in FIGS. 1 and 2, the disc-shaped pressing member 11 for pressing the workpiece 10 toward the annular polishing tool 2 by its own weight has been disclosed. A pressure member (for example, a method of forcibly pressurizing) may be used. Further, instead of the disc-shaped pressing member 11, a pressing member of another shape may be used.

A polishing position holding mechanism 13 is provided on the downstream side of the workpiece 10 with respect to the rotation direction A of the annular polishing tool 2. The polishing position holding mechanism 13 allows the workpiece 10 and the disc-shaped pressing member 11 to rotate when the annular polishing tool 2 described above is operated and the operation shifts to a rotating operation. object 10 and disc-like pressure member 11 is provided with a polishing position holding function of holding the predetermined target polishing position by preventing the movement of the annular polishing tool 2 as one body to above.

Specifically, the polishing position holding mechanism 13 allows at least two support rollers 13A, 13B which allow the workpiece 10 and the disc-shaped pressing member 11 to rotate and are arranged at a predetermined interval. And these two support rollers 1
An arm member 13C for holding 3A and 13B is provided. The base end of the arm member 13C is held by the above-described case main body 1 via a telescopic drive mechanism 13D.

The expansion / contraction drive mechanism 13D has a function to reciprocate the arm member 13C as required to extend and contract along its protruding direction as required.
Reference numeral 13E denotes an operation control unit that controls the operation of the telescopic drive mechanism 13D. Thereby, the arrangement position of the two support rollers 13A and 13B together with the above-mentioned arm member 13C is changed individually or integrally, and the above-mentioned workpiece 10 is optimally placed on the polishing tool surface 2A of the annular polishing tool 2. The polishing position can be selected.

That is, the polishing position holding mechanism 13 operates the above-described workpiece 10 by the operation of the expansion / contraction drive mechanism 13D.
The rotation center P10 of the disc-shaped pressing member 11 can be variably set and held at an arbitrary position on the polishing tool surface 2A of the annular polishing tool 2 (execution of a polishing position variable setting function). Therefore, uneven wear of the polishing tool surface 2A caused by repeatedly using the same portion corresponding to the polishing tool surface 2A can be reliably prevented.

Here, with respect to the polishing position holding mechanism 13, the telescopic drive mechanism 13D is further operated by the operation control unit 13E.
The annular polishing tool 2 and the workpiece 10 are controlled by the
A center-of-gravity position setting function for the workpiece is provided in which the center-of-gravity position P10 of the workpiece 10 described above is made coincident with the center position (center of gravity) Ps of the contact area with the workpiece and the position is maintained.
When the polishing operation is performed in a state where the center position (center of gravity) Ps of the contact area between the annular polishing tool 2 and the workpiece 10 coincides with the center of gravity P10 of the workpiece 10, a relatively stable state is obtained. It was experimentally confirmed that the polishing process could be continued with high accuracy and efficiency.

The polishing tool surface 2A of the annular polishing tool 2 described above.
On the upper side, it has a diameter larger than the width W of the polishing tool surface 2A, which is in contact with the polishing tool surface 2A and on the upstream side of the above-described workpiece 10 with respect to the rotation direction a of the annular polishing tool 2. A disk-shaped dresser 14 is provided. The disc-shaped dresser 14 is driven to rotate by a small drive motor 14A. This disk-shaped dresser 1
4 and the small drive motor 14A
B.

The clogging of the polishing tool surface 2A of the annular polishing tool 2 is constantly removed by the disc-shaped dresser 14, and the polishing tool surface 2A can be maintained in a new state at all times. Thus, it is possible to smoothly proceed without lowering the efficiency of the polishing operation of the workpiece 10.

On the polishing tool surface 2A of the annular polishing tool 2 described above, a predetermined polishing liquid is applied over substantially the entire width W of the polishing tool surface 2A at a predetermined distance from the polishing tool surface 2A. A polishing liquid supply mechanism 15 having a plurality of liquid injection nozzles 15a for supplying is provided. At the same time, a polishing liquid suction mechanism 16 for sucking and collecting used polishing liquid from almost the entire area on the width W of the polishing tool surface 2A is provided.

The polishing liquid supply mechanism 15 is disposed close to the upstream side of the workpiece 10 with respect to the rotation direction A of the annular polishing tool 2. Further, the polishing liquid suction mechanism 16 is disposed close to the downstream side of the disc-shaped dresser 14 with respect to the rotation direction A of the annular polishing tool 2 described above.

Thus, the polishing liquid sprayed on the polishing tool surface 2A on the upstream side of the workpiece 10 passes through the workpiece 10, or the workpiece 10 and the disk-shaped dresser 14, and then sucks the polishing liquid. The suction is performed by the mechanism 16. Here, when the disk-shaped dresser 14 is not provided, the polishing liquid suction mechanism 16 is disposed downstream of the workpiece 10 with respect to the rotation direction a of the annular polishing tool 2 described above.

In this embodiment, the polishing liquid suction mechanism 16 is
The annular polishing tool 2 is disposed along the width direction of the polishing tool surface 2A of the annular polishing tool 2 described above. As shown in FIG. 4, the polishing liquid suction mechanism 16 has a plurality of polishing liquid suction holes 16a in the inner diameter side region S1 and the outer diameter side region S2 of the surface facing the polishing tool surface 2A of the annular polishing tool 2. More are provided than in the central area. As a result, the used polishing liquid that easily collects in the inner diameter side area S1 and the outer diameter side area S2 of the polishing tool surface 2A during polishing can be more efficiently sucked.

Further, as shown in FIG. 4, a plurality of shallow grooves 16b communicating with the outside air are provided at both ends of the surface of the polishing liquid suction mechanism 16 facing the polishing tool surface 2A of the annular polishing tool 2 described above. I have. Thus, the used polishing liquid is easily sucked by the polishing liquid suction mechanism 16.

Here, the above-mentioned annular polishing tool 2 will be described in more detail. In the present embodiment, the outer diameter D2 of the annular polishing tool 2 described above has a workpiece 10 as shown in FIG.
Is larger than the diameter K2 of the circumscribed circle (the circle assumed when the workpiece 10 is not circular, and is assumed to rotate on the polishing tool surface 2A with the center point of the contact surface as the center of rotation) and the workpiece 10 Is set to a value smaller than twice the diameter K2 of the circumscribed circle.

For example, the annular polishing tool 2 has a diameter (outer diameter) D2 of 480 [mm] and an inner diameter d2 of 120 [m].
m] is used (see FIG. 3). On the other hand, as the disk-shaped workpiece 10, a 12-inch wafer (diameter 300 [mm] , strictly 304.8 [m
m] )). In this case, the rotational center P10 of the workpiece 10 is such that the centroid (the average center point of the contact area) Ps of the contact area with the annular polishing tool 2 is
Is disposed at a position away from the center P2 by E = 130 [mm]. Thus, in the present embodiment, when the size of the workpiece 10 is the same, the annular polishing tool 2 having an area ratio of about half that of the conventional annular polishing tool is used.
Can be provided.

When this is compared with the conventional example, for example , in the conventional example shown in FIG. 6, when a wafer having a diameter K0 = 300 [mm] is planarly polished, at least the polishing tool surface 102A is required.
Is not less than 300 [mm] and the annular polishing tool 10
Since the diameter of the circle inside 2 needs to be 120 [mm], the diameter of the annular polishing tool 102 is at least 720 mm.
[Mm] or more. According to this, just the diameter ratio,
The size is reduced to almost half of the conventional size. The area ratio is reduced by the square of the area ratio.

[0056] In this arrangement, when the outer diameter D2 of the annular grinding tool 2, the diameter K2 (the workpiece 10 of the workpiece 10 as shown in FIG. 3 is not circular, the workpiece 10 is that shown with the case where the contact surface circle is assumed when the center point and rotate on the polishing tool face 2A as the center of rotation, i.e. a two fold by <br/> Ri slightly smaller diameter of the circumscribed circle) .

In this case, the workpiece 10 is rotated by its own rotation at a predetermined position on the polishing tool surface 2A of the annular polishing tool 2 together with the rotation of the annular polishing tool 2. The workpiece 10 can be reliably polished over the entire surface.

Here, regarding the annular polishing tool 2, the outer diameter D2 of the annular polishing tool 2 is set to the diameter K of the workpiece 10 described above.
2 and the tool width W in the radial direction of the polishing tool surface 2A of the annular polishing tool 2 in the radial direction.
0 may be set smaller than the diameter K2. Even in this case, it is possible to obtain the annular polishing tool 2 having the same function as in the case of FIG. 1 described above.

The above-mentioned disk-shaped dresser 14 will be described in more detail. The disc-shaped dresser 14 disclosed in FIGS. 1 and 2 has a tool width W of the polishing tool surface 2A of 180 [mm].
In this case, a larger one having a diameter of 200 [mm] is provided. Thus, the polishing tool face 2A, so the entire width is Te conspicuous, always smooth polished tool surface 2
A can polish the disk-shaped workpiece 10.

The disk dresser 14 has the following structure.
In order to reduce costs and perform dressing with high efficiency,
In order to sharpen the expensive and wear-free abrasive tool surface 2A, a small amount of natural diamond particles (15
0 micron) and many artificial diamond particles (100) that are inexpensive and easy to wear but contribute to sharpening of the polishing tool surface 2A.
Microns) is buried on the polishing tool surface 2A side. This makes it possible to obtain the disc-shaped dresser 14 having good cost performance and good dressing efficiency. The polishing tool surface 2A is always kept smooth because sharpening is always performed when the annular polishing tool 2 rotates.

[0061] Further, the polishing solution suction mechanism 16 described above is rounded (the rounding radius 2 [mm]) is provided on the outer periphery of Migaku Ken suction surface,
An end surface (outer diameter region S1 and inner diameter region S2) of the polishing tool surface 2A where the polishing liquid easily accumulates is provided with a polishing liquid suction hole (diameter of about 1 [mm]) 16a, for example, three times more than the intermediate region. .

As a result, a clean polishing liquid is always supplied to the disk-shaped workpiece 10 on the polishing tool surface 2A, and therefore, there is no influence over time such as accumulation of foreign matter, and the like.
Planar polishing is always performed in a clean state.

Reference numeral 21 denotes a polishing liquid collecting tank formed in a U-shaped section so as to cover the periphery and the lower surface of the annular polishing tool 2. The polishing liquid collecting tank 21 is provided with the annular polishing tool 2.
An annular rising portion 21A is provided facing the outer peripheral portion at a predetermined interval and has a function of collecting a polishing liquid flowing out due to centrifugal force. Also, this polishing liquid collecting tank 2
Numeral 1 is coaxially integrated with the annular polishing tool 2 and is driven to rotate together with the annular polishing tool 2.

The polishing liquid collecting tank 21 is provided with a polishing liquid collecting mechanism 22 which sucks out the polishing liquid collected in the polishing liquid collecting tank 21 and sends it out. The polishing liquid collecting mechanism 22 is held by the case main body 1 described above, and has a state in which a distal end, which is a liquid suction part, extends to the inner bottom of the polishing liquid collection tank 21 described above.

For this reason, when the workpiece 10 is polished, the operation of the polishing liquid collecting tank 21 and the polishing liquid collecting mechanism 22 allows the polishing liquid to be collected smoothly without scattering to the outside. As a result, a larger amount of used polishing liquid and shavings on the polishing tool surface 2A are also removed.
Highly recovered.

The polishing liquid sucked and collected by the polishing liquid suction mechanism 16 and the polishing liquid collection mechanism 22 described above is regenerated by the regeneration circuit 31 so as to be supplied to the polishing liquid supply mechanism 15 again. Has become.

As shown in FIG. 2, the regenerating circuit 31 includes a liquid recovery pipe system 33 provided with a suction side pump 32 and a polishing liquid recovered by the liquid recovery pipe system 33 via a three-stage settling tank. Polishing liquid regeneration tank 34A that overflows and filters sequentially
To 34C and this polishing liquid regeneration tank (polishing liquid tank) 34A
And a liquid re-supply pipe system 36 for sucking the supernatant of the polishing liquid regenerating tank 34C located at the lowermost position of the polishing liquid supply pipe 35 again by the supply pump 35 and sending it to the polishing liquid supply mechanism 15 described above. The regeneration circulation circuit 31 is housed below the inside of the case main body 1 (below the upper floor 1A) except for a part of the liquid recovery pipe system 33 and the liquid resupply pipe system 36.

Thus, the above-mentioned polishing liquid suction mechanism 16
The polishing liquid collected by the polishing liquid recovery mechanism 22 and foreign substances such as debris on the polishing tool surface 2A are removed from the polishing liquid regeneration tanks 34A to 34A.
At 34C, the polishing liquid is regenerated.

The above-mentioned supply pump 35 has a supply capacity of, for example, about 100 [cc / min], and is provided with a filter 35A having a mesh of 50 [μm] and 5 [μm] on the output side thereof. It also has a function of removing foreign matter that could not be removed in the liquid regeneration tanks 34A to 34C. The polishing liquid regenerated in the polishing liquid regenerating tanks 34A to 34C is
The supply-side pump 35 removes finer unnecessary particles, and is sent from the liquid re-supply pipe system 36 to the polishing liquid supply mechanism 15 via the re-supply pipe 36E.

Next, the operation of the above embodiment will be described. After it placed on the polishing tool face 2A of the annular grinding tool 2 to the workpiece 10 and disc-like pressure member 11 shown in FIGS. 1 and 2, setting the entire equipment in the operational state, first, The annular polishing tool 2 rotates in the direction of FIG. Tries to rotate the workpiece 10 and also the same direction disc-shaped pressure member 11 on the same time the polishing tool surface 2A, the mobile is prevented in the polishing position holding mechanism 13, a predetermined position shown in FIG. 1 (specifically To
Is a contact surface between the annular polishing tool shown in FIG. 3 and the workpiece.
The center position (center of gravity) of the product and the center of gravity of the workpiece
Place) .

In this case, the workpiece 10 and the polishing tool surface 2A
Friction occurs between the inner diameter side and the outer diameter side of the polishing tool surface 2A due to the difference in rotational peripheral speed, and the workpiece 10 is polished by the difference. It rotates on the surface 2A in the direction of FIG. The symbol P10 in this case is the rotation center of the workpiece 10.

Here, when the workpiece 10 rotates, the rotating surface of the workpiece 10 which comes into contact with the polishing tool surface 2A is such that the diameter K2 of the workpiece 10 is larger than the radial width W of the polishing tool surface 2A. Even if it is large, the protruding portion is also sequentially brought into contact with and rubbed against the polishing tool surface 2A, whereby the workpiece 10 is polished smoothly. That is, in the present embodiment, even if the diameter K2 of the workpiece 10 is larger than the radial width W of the polishing tool surface 2A, the workpiece 10 can be effectively polished. There is an advantage that the overall size can be reduced.

The polishing position of the workpiece 10 is regulated by the polishing position holding mechanism 13 as described above. At the same time, the polishing position is moved (oscillated or periodically reciprocated) by the telescopic drive mechanism 13D . In addition, with the operation of the whole apparatus,
The small motor 14A for driving the same also operates, and at the same time, the polishing liquid supply mechanism 15 , the polishing liquid suction mechanism 16 , the polishing liquid recovery mechanism 22, and the regeneration circuit 31 also operate.

As a result, the polishing tool surface 2A is always sharpened by the action of the disk-shaped dresser 14 , and at the same time, the polishing liquid is supplied.
Supply mechanism 15 , polishing liquid suction mechanism 16 , polishing liquid recovery mechanism 22
By the operation of the regenerating circuit 31, fresh polishing liquid is always supplied to the polishing tool surface 2A. For this reason, the polishing operation is continued smoothly and accurately with no clogging of the polishing tool surface 2A.

Next, specific test results of the above embodiment will be described. In this test, a tool made of polyurethane (outside diameter: 480 [mm], inside diameter: 120 [mm]) was used as the annular polishing tool 2 , and colloidal silica (particle size: 100 Å) was used as the polishing liquid.
A wafer with a silicon dioxide film (outer diameter 300 [mm]) was polished. Polishing tool rotation speed is 24 (rpm), processing pressure 600 [g / cm], rocking Dohaba the wafer 40 by the polishing position holding mechanism 13 mm and was tested in 5 minutes polishing time.

In this case, the polishing amount of a 12-inch wafer is 15000 ± 500 Å and the polishing uniformity is ± 3.
%, And a large-diameter wafer can be polished with high precision by a miniaturized planar polishing apparatus (area ratio of polishing tool: 1/2 of conventional one).

Next, another embodiment will be described with reference to FIG. The other embodiment shown in FIG. 5 shows another example of the disc-shaped dresser 14 and the driving mechanism disclosed in the above-described embodiments of FIGS. In FIG. 5, as the disc-shaped dresser 24, a small disc dresser (for example, an outer diameter of 75 [mm]) having a diameter smaller than the tool width W of the polishing tool surface 2A described above is used. The disc dresser 24 is integrally provided with the small drive motor 24A, and is urged by a reciprocating transfer mechanism (not shown) provided on the arm member 24B to move the disc dresser 24 over a predetermined range on the arm member 24B. It is equipped to reciprocate.

In this case, the reversing operation of the disk dresser 24 is performed by transmitting micro-switches 24a and 24b provided at both ends of the arm member 24B,
The reverse movement is controlled by control means (not shown). The other configuration is the same as the embodiment shown in FIGS. 1 to 4 described above.

Also in this case, the above-described FIGS.
The same operation and effect as those of the embodiment can be obtained.

Next, specific test results of the embodiment shown in FIG. 5 will be described.

This test was also performed under the same conditions as in the above embodiment. As a result, the polishing uniformity is ± 4% when the polishing amount of a 12-inch wafer is 15000 ± 600 [angstrom], and the large-diameter wafer is polished with a downsized (polishing tool area ratio: 1/2 of conventional) polishing machine. Can be polished with high precision.

In each of the above-described embodiments, an upright wall may be provided at the periphery of the annular polishing tool 2 for preventing the outflow of the polishing liquid. By doing so, the annular polishing tool 2
The recovery efficiency of the polishing liquid supplied to the surface is improved, and a more efficient planar polishing apparatus can be provided. Further, in each of the above-described embodiments, the description is limited to the planar polishing of a 12-inch wafer. However, the present invention may be applied to a planar polishing apparatus for a 6, 8, or 14-inch wafer. By doing so, the size of the planar polishing apparatus can be reliably reduced.

Further, the disk-shaped workpiece 10 is not limited to the wafer with the silicon dioxide film described in the above embodiment, but may be, for example, a wafer with metal wiring, a magnetic disk, a glass substrate, or any other material. You may.

As described above, in the present embodiment, the diameter (the diameter of a circumscribed circle in the case of a non-disc shape) larger than the width W of the polishing tool surface 2A in the radial direction on the polishing tool surface 2A of the annular polishing tool 2 is set. The workpiece 10 to be processed can be effectively planar-polished, so that the entire apparatus can be effectively and reliably reduced in size while maintaining the performance of the polishing process.

In the above embodiment, the annular polishing tool 2 is used.
Although the case where the polished surface 2A is mounted horizontally is illustrated, it may be mounted vertically or obliquely.

[0086]

Since the present invention is constructed and functions as described above, a workpiece having a diameter larger than the outer radius of the annular polishing tool can be flat-polished to a highly accurate smooth surface, and the apparatus can be polished. This has the effect of providing an unprecedented and superior planar polishing apparatus capable of reliably reducing the size of the whole.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing a first embodiment of the present invention.

FIG. 2 is a schematic longitudinal sectional view of FIG. 1 with a part omitted;

FIG. 3 is an explanatory view showing the size of the annular polishing tool disclosed in FIG. 1 and a workpiece, a position at the time of polishing, and the like.

FIG. 4 is an explanatory view showing an example of a polishing liquid suction surface of the polishing liquid absorption mechanism disclosed in FIG. 1;

FIG. 5 is a schematic plan view showing another embodiment of the present invention.

FIG. 6 (a) is a schematic side view showing a conventional example,
FIG. 6B is a schematic plan view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Case main body 1A Upper floor part 2 Annular grinding tool 2A Polishing tool surface 3 Drive motor 4 Turntable 10 Disk-shaped workpiece 11 Disk-shaped pressing member 13 Polishing position holding mechanism 13A, 13B Support roller 13C Arm member 13D Telescopic drive mechanism Unit 13E operation control unit 14 disk-shaped dresser 15 polishing liquid supply mechanism 15a liquid injection nozzle 16 polishing liquid suction mechanism 21 polishing liquid collection tank 21A rising section 22 polishing liquid collection mechanism 31 regeneration circulation circuit

──────────────────────────────────────────────────の Continuation of the front page (51) Int.Cl. ⁷ Identification symbol FI H01L 21/304 622 H01L 21/304 622M (JP, A) JP-A-50-48593 (JP, A) JP-A-8-281551 (JP, A) JP-A-9-36071 (JP, A) JP-A-8-309659 (JP, A) Kaihei 4-75870 (JP, A) JP-A 58-852 (JP, U) JP-B 38-23595 (JP, B1) JP-B 48-5596 (JP, Y1) (58) Int.Cl. ⁷ , DB name) B24B 37/04 B24B 37/00 H01L 21/304 622

Claims (12)

(57) [Claims] 1. An annular polishing tool having an annular polishing tool surface, and a workpiece mounted on the annular polishing tool is uniformly pressed against the annular polishing tool, and is integrally formed with the workpiece. a disc-shaped pressure member to move, said when the annular polishing tool is rotated to allow the workpiece and the disc-shaped pressure member is rotated, and the workpiece and the disc-shaped pressure member is And a polishing position holding mechanism for holding a predetermined position to be polished by preventing movement with the annular polishing tool, wherein an outer diameter of the annular polishing tool is set to a circumscribed circle of the workpiece. Is set to a value larger than the diameter of the workpiece and smaller than twice the diameter of a circumscribed circle of the workpiece.
The weight of the workpiece with respect to the center position of the contact area with the workpiece
Workpiece weight that matches and maintains the center position
A planar polishing apparatus having a center position setting function . 2. An annular polishing tool having an annular polishing tool surface.
The workpiece to be mounted on the annular polishing tool is
Uniformly pressurized on the tool side and integrated with the workpiece
The moving disk-shaped pressing member and the annular polishing tool rotate.
The workpiece and the disc-shaped pressing member rotate
The work and the disk-shaped
To prevent the pressure member from moving with the annular polishing tool
A polishing position holding mechanism for holding a predetermined polishing position
An outer diameter of the annular polishing tool
Is larger than the diameter of the circumscribed circle of the workpiece and
Set to a value smaller than twice the diameter of the circumcircle of the workpiece, and the width of the polishing tool surface on the polishing tool surface of the annular polishing tool
When a disk-shaped dresser with a larger diameter is
This disk-shaped dresser is used for rotating the annular polishing tool.
Characterized in that it is arranged upstream of the workpiece with respect to the direction
Surface polishing apparatus according to. (3)An annular polishing tool with an annular polishing tool surface
The workpiece to be mounted on the annular polishing tool is
Apply uniform pressure to the tool side and Integrally with the workpiece
The moving disk-shaped pressing member and the annular polishing tool rotate.
The workpiece and the disc-shaped pressing member rotate
The work and the disk-shaped
To prevent the pressure member from moving with the annular polishing tool
A polishing position holding mechanism for holding a predetermined polishing position
An outer diameter of the annular polishing tool
Is larger than the diameter of the circumscribed circle of the workpiece and
Set the value to less than twice the diameter of the circumcircle of the workpiece, The polishing position holding mechanism includes the workpiece and the disk.
The center of rotation of the annular pressing member, the polishing tool of the annular polishing tool
Polishing position variable setting that variably sets and holds at any position on the surface
Function Further, the polishing tool is provided on the polishing tool surface of the annular polishing tool.
Arrange a disk-shaped dresser with a diameter larger than the width of the surface
In addition, this disc-shaped dresser is
It is arranged on the upstream side of the workpiece with respect to the rotation direction
Characterized by Flat polishing machine. 4. A disk-shaped dresser having a diameter larger than the width of the polishing tool surface is disposed on a polishing tool surface of the annular polishing tool, and the disk-shaped dresser is rotated in a rotating direction of the annular polishing tool. the workpiece surface polishing apparatus according to claim 1 Symbol mounting, characterized in that disposed upstream of the relative. Claim 5.An annular polishing tool with an annular polishing tool surface
The workpiece to be mounted on the annular polishing tool is
Uniformly pressurized on the tool side and integrated with the workpiece
The moving disk-shaped pressing member and the annular polishing tool rotate.
The workpiece and the disc-shaped pressing member rotate
The work and the disk-shaped
To prevent the pressure member from moving with the annular polishing tool
A polishing position holding mechanism for holding a predetermined polishing position
An outer diameter of the annular polishing tool
Is larger than the diameter of the circumscribed circle of the workpiece and
Set the value to less than twice the diameter of the circumcircle of the workpiece,  On the polishing tool surface of the annular polishing tool, at a predetermined interval
A predetermined polishing liquid is supplied to the polishing tool surface of the annular polishing tool.
Equipped with a polishing liquid supply mechanism with multiple liquid injection nozzles
And used from the polishing tool surface of the annular polishing tool.
Equipped with a polishing liquid suction mechanism that sucks and collects polishing liquid
And the polishing liquid supply mechanism is moved in the rotational direction of the annular polishing tool.
The polishing liquid is disposed on the upstream side of the workpiece and the polishing liquid
The suction mechanism is moved in the rotation direction of the annular polishing tool.
It is located downstream of the structure.RupeiSurface polishing equipment
Place. 6.An annular polishing tool with an annular polishing tool surface
The workpiece to be mounted on the annular polishing tool is
Uniformly pressurized on the tool side and integrated with the workpiece
The moving disk-shaped pressing member and the annular polishing tool rotate.
The workpiece and the disc-shaped pressing member rotate
The work and the disk-shaped
To prevent the pressure member from moving with the annular polishing tool
A polishing position holding mechanism for holding a predetermined polishing position
An outer diameter of the annular polishing tool
Is larger than the diameter of the circumscribed circle of the workpiece and
Set the value to less than twice the diameter of the circumcircle of the workpiece, The polishing position holding mechanism includes the workpiece and the disk.
The center of rotation of the annular pressing member, the polishing tool of the annular polishing tool
Polishing position variable setting that variably sets and holds at any position on the surface
Function  On the polishing tool surface of the annular polishing tool, at a predetermined interval
A predetermined polishing liquid is supplied to the polishing tool surface of the annular polishing tool.
Equipped with a polishing liquid supply mechanism,
Polishing that sucks and collects used polishing liquid from the polishing tool surface
A liquid suction mechanism is provided, and the polishing liquid supply mechanism is moved in a rotational direction of the annular polishing tool.
The polishing liquid is disposed on the upstream side of the workpiece and the polishing liquid
The suction mechanism is moved with respect to the rotation direction of the annular polishing tool.Addition
WorkIs located downstream ofRupeiSurface polishing equipment
Place. 7.On the polishing tool surface of the annular polishing tool,
At predetermined intervals on the polishing tool surface of the annular polishing tool,
Equipped with a polishing liquid supply mechanism for supplying a polishing liquid and
Suction of used polishing liquid from the polishing tool surface of the annular polishing tool
Equipped with a polishing liquid suction mechanism to collect The polishing liquid supply mechanism is moved in the rotating direction of the annular polishing tool.
The polishing liquid is disposed on the upstream side of the workpiece and the polishing liquid
The suction mechanism is moved in the rotation direction of the annular polishing tool.
Installed downstream of the structure Claims characterized by the following:1Description
Polishing equipment. 8. An annular polishing tool, comprising :
At predetermined intervals on the polishing tool surface of the annular polishing tool,
Equipped with a polishing liquid supply mechanism for supplying a polishing liquid and
Suction of used polishing liquid from the polishing tool surface of the annular polishing tool
And a polishing liquid suction mechanism for collecting and collecting the polishing liquid .
The polishing liquid is disposed on the upstream side of the workpiece and the polishing liquid
The suction mechanism is rotated in the circular direction with respect to the rotation
5. The flat polishing apparatus according to claim 2 , wherein the flat polishing apparatus is disposed downstream of the plate dresser . 9. The polishing apparatus according to claim 9, wherein said polishing liquid suction mechanism is provided with said annular polishing machine.
Along the width direction of the polishing tool surface of the tool
A plurality of polishing liquid suction holes provided in the polishing liquid suction mechanism
The inner diameter side area of the surface facing the polishing tool surface of the annular polishing tool
9. The flat-surface polishing apparatus according to claim 5, wherein the surface polishing apparatus is formed intensively in an outer diameter side region . 10. The annular polishing machine of the polishing liquid suction mechanism.
Open the outside air at both ends of the surface of the tool facing the polishing tool surface
The planar polishing apparatus according to claim 9 , wherein a plurality of shallow grooves are provided . 11. An annular polishing tool facing an outer peripheral portion of the annular polishing tool.
Having a rising portion at a predetermined interval and the annular polishing
A polishing liquid collection tank with a U-shaped cross section that rotates integrally with the tool is installed.
The polishing liquid is collected in the polishing liquid collecting tank.
A polishing liquid recovery mechanism that sucks out the polishing liquid and sends it out
11. The device according to claim 5, wherein the device is provided in parallel.
A planar polishing apparatus according to any one of the preceding claims. 12. A polishing liquid suction mechanism and the like for suction and recovery.
Polishing liquid for regenerating polishing liquid and feeding it to the polishing liquid supply mechanism
5. A regenerative circulation circuit for use in a vehicle.
12. The planar polishing apparatus according to any one of -11.