JPS6254666A - Polishing surface plate - Google Patents
Polishing surface plateInfo
- Publication number
- JPS6254666A JPS6254666A JP60190795A JP19079585A JPS6254666A JP S6254666 A JPS6254666 A JP S6254666A JP 60190795 A JP60190795 A JP 60190795A JP 19079585 A JP19079585 A JP 19079585A JP S6254666 A JPS6254666 A JP S6254666A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- grooves
- surface plate
- abrasive grains
- polishing surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は研摩機に研摩定盤を取り付けて行なう研摩加工
において、研摩傷の少ない研摩加工面を得るために考案
した研摩定盤に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a polishing surface plate devised for obtaining a polished surface with fewer polishing scratches during polishing in which the polishing surface plate is attached to a polishing machine.
従来の技術
研摩定盤による研摩加工は、第7図に示すごとく研摩定
盤1と加工物2の間に入った砥粒3が研摩圧力&により
、前記加工物2に比べ硬度の低い前記研摩定盤1に埋り
込み、前記研摩定盤の研摩面に無数の切刃を形成するこ
とになる。結果、切刃となった砥粒によって、研摩加工
が行なわれる。In the conventional polishing process using a polishing surface plate, as shown in FIG. It is embedded in the polishing surface plate 1, and countless cutting edges are formed on the polishing surface of the polishing surface plate. As a result, the abrasive grains that have become cutting edges perform the polishing process.
また、埋り込んだ砥粒は脱落、生成を繰返すとされてい
る。以上が研摩定盤による研摩加工の概要である。Furthermore, embedded abrasive grains are said to repeatedly fall off and form. The above is an overview of the polishing process using the polishing surface plate.
発明が解決しようとする問題点
研摩定盤による研摩加工において、研摩傷の少ない研摩
加工面を得るためには、脱落した砥粒、又は加工に直接
関係しない余分な砥粒により生じる、研摩傷を無くすこ
とが課題とされている。第8図は脱落した砥粒4が研摩
定盤1と加工物2の間に巻込まれて加工物2に傷を付け
る様子を示したものである。又加工に直接関係しない余
分な砥粒による研摩傷も、前記脱落砥粒と同じように、
前記第8図のごとく加工物と研摩定盤の間に巻き込まれ
て研摩傷を付けると考えられている。Problems to be Solved by the Invention In order to obtain a polished surface with fewer polishing scratches during polishing using a polishing surface plate, it is necessary to eliminate polishing scratches caused by dropped abrasive grains or extra abrasive grains that are not directly related to the machining process. The challenge is to eliminate it. FIG. 8 shows how the fallen abrasive grains 4 are caught between the polishing surface plate 1 and the workpiece 2 and damage the workpiece 2. Also, polishing scratches caused by extra abrasive grains that are not directly related to processing can be caused by the same as the falling abrasive grains mentioned above.
As shown in FIG. 8, it is thought that the particles get caught between the workpiece and the polishing surface plate and cause polishing scratches.
問題点を解決するだめの手段
本発明は以上の原因で生じる研摩傷を少なくするため、
研摩定盤本体の研摩面に溝間距離が大きく深い溝を同心
円状又は、螺旋状に形成し、更に前記溝と交差するよう
に溝間距離が小さく浅い溝を螺旋状に形成することによ
り、前記問題を解決するものである。Means for Solving the Problems The present invention aims to reduce the abrasive scratches caused by the above-mentioned causes.
By forming concentrically or spirally deep grooves with a large distance between the grooves on the polishing surface of the polishing surface plate body, and further forming shallow grooves with a small distance between the grooves in a spiral shape to intersect with the grooves, This solves the above problem.
作用
本発明の前記研摩定盤の上に加工物を置き、砥粒を混入
した研摩液を供給し研摩加工したのち、ひきつづいて砥
粒を混入していない研摩液を供給することにより、脱落
した砥粒及び加工に直接関係しない余分な砥粒を溝間距
離が小さく浅い螺旋状の溝と溝間距離が大きく深い同心
円状又は螺旋状の溝に洗い流し、更に前記溝を通じて研
摩定盤の外に排出することにより、脱落した砥粒及び加
工に直接関係しない余分な砥粒による研摩傷を防ぐとと
もに、研摩定盤に埋り込んだ安定した砥粒により研摩加
工を促進することにより研摩傷の少ない研摩面が得られ
る。Operation A workpiece is placed on the polishing surface plate of the present invention, and after polishing by supplying a polishing liquid mixed with abrasive grains, by subsequently supplying a polishing liquid not mixed with abrasive grains, the workpiece is removed. Abrasive grains and excess abrasive grains that are not directly related to processing are washed away into shallow spiral grooves with a small distance between grooves and deep concentric or spiral grooves with a large distance between grooves, and are further flushed out of the polishing surface plate through the grooves. By discharging, it prevents polishing scratches caused by dropped abrasive grains and extra abrasive grains that are not directly related to processing, and also reduces polishing scratches by promoting the polishing process with stable abrasive grains embedded in the polishing surface plate. A polished surface is obtained.
実施例 以下本発明の実施例を図面を参照して説明する。Example Embodiments of the present invention will be described below with reference to the drawings.
第1図は研摩定盤本体12の研摩面に溝間距離が大きく
深い溝5を同心円状に形成し、更に溝間距離が小さく浅
い溝6を螺旋状に形成した状態を示した概要図である。FIG. 1 is a schematic diagram showing a state in which deep grooves 5 with large distances between grooves are formed concentrically on the polishing surface of the polishing surface plate main body 12, and shallow grooves 6 with small distances between grooves are formed in a spiral shape. be.
第2図は研摩定盤の研摩面に溝間距離が大きく深い溝5
′を螺旋状に形成し、更に溝間距離が小さく浅い溝6′
を螺旋状に形成した状態を示した概要図であり、前記第
1図及び第2図で示した溝5.6.5’、6’はいずれ
も交差している。Figure 2 shows grooves 5 with large and deep grooves on the polishing surface of the polishing surface plate.
' is formed in a spiral shape, and the groove 6' is further shallower with a smaller distance between the grooves.
FIG. 2 is a schematic diagram showing a state in which the grooves 5, 6, 5' and 6' shown in FIGS. 1 and 2 intersect with each other.
第3図は前記研摩定盤の半断面図で第4図は研摩面すに
形成した前記溝間距離が大きく深い溝と溝間距離が小さ
く浅い溝の拡大図である。FIG. 3 is a half-sectional view of the polishing surface plate, and FIG. 4 is an enlarged view of the deep grooves with a large distance between the grooves and the shallow grooves with a small distance between the grooves formed on the polishing surface.
前記第1図から第4図で説明した実施例の研摩方法と作
用を第5図で説明する。研摩定盤本体12の上にホルダ
ー7に取り付けた加工物8を置き、前記研摩定盤本体1
を回転軸心Cを中心に回転させながら、砥粒を混入した
研摩液9を供給することにより、前記加工物8を研摩加
工したのち、前記研摩液9の供給を止め、次に砥粒を混
入していない研摩液10を供給することにより、前記研
摩定盤本体12の回転する遠心力と、前記研摩定盤の研
摩面すに接触して、前記ホルダー7の回転軸心dを中心
に回転している。The polishing method and operation of the embodiment described in FIGS. 1 to 4 will be explained with reference to FIG. The workpiece 8 attached to the holder 7 is placed on the polishing surface plate main body 12, and the polishing surface plate main body 1
The workpiece 8 is polished by supplying polishing liquid 9 mixed with abrasive grains while rotating around the rotation axis C. After that, the supply of polishing liquid 9 is stopped, and then the abrasive grains are By supplying the unmixed polishing liquid 10, it comes into contact with the rotating centrifugal force of the polishing surface plate main body 12 and the polishing surface of the polishing surface plate, and rotates around the rotation axis d of the holder 7. It's rotating.
前記ホルダー7に取付けた加工物8の作用により、脱落
した砥粒及び加工に直接関係しない余分な砥粒を前記溝
間距離が小さく浅い螺旋状の溝6と溝間距離が大きく深
い同心円状又は螺旋状の溝已に洗い流し更に前記溝を通
じて研摩定盤本体12の外に排出する。更に前記大きく
深い溝5と小さく浅い溝6の効果を第6図で説明する。Due to the action of the workpiece 8 attached to the holder 7, dropped abrasive grains and excess abrasive grains not directly related to processing are removed between the shallow spiral grooves 6 with a small distance between the grooves and the deep concentric grooves with a large distance between the grooves. It is washed away in a spiral groove and further discharged to the outside of the polishing surface plate main body 12 through the groove. Furthermore, the effects of the large and deep grooves 5 and the small and shallow grooves 6 will be explained with reference to FIG.
第6図は前記大きく深い溝6と小さく浅い溝6と前記ホ
ルダー7に取付けた加工物8の部分拡大図である。前記
小さく浅い溝60山の部分に埋り込んだ砥粒は研摩圧力
等により脱落すると、その脱落砥粒11は前記小さく浅
い溝6の中に落ちる。FIG. 6 is a partially enlarged view of the large deep groove 6, the small shallow groove 6, and the workpiece 8 attached to the holder 7. When the abrasive grains embedded in the peaks of the small and shallow grooves 60 fall off due to polishing pressure, etc., the fallen abrasive grains 11 fall into the small and shallow grooves 6.
前記第8図で説明したごとく、研摩定盤本体に溝のない
定盤であると砥粒を巻き込み加工物に傷を付けることに
なるが、前記のごとく小さく浅い溝を設けることにより
、前記脱落砥粒11が前記溝に落ちることになり、結果
加工物に傷をつけることを防ぐ、加工に直接関係しない
砥粒も同じように前記溝の中に落ち、結果研摩傷が防げ
ることになる。As explained in FIG. 8 above, if the polishing surface plate does not have grooves on its main body, the abrasive grains will get caught up in the workpiece and cause damage to the workpiece. The abrasive grains 11 fall into the grooves, thereby preventing scratches on the workpiece, and the abrasive grains not directly related to processing also fall into the grooves, thereby preventing abrasive scratches.
次に砥粒を混入していない研摩液を供給すると、前記第
5図で示したごとく、前記ホルダーアに取り付けた加工
物8は、前記研摩定盤と接触してともに回転しているの
で、前記研摩定盤の遠心力と加工物の回転する作用によ
り、前記小さく浅い溝に落ちた砥粒を洗い流すように前
記小さく浅い溝6から犬きく深い溝6へ砥粒が流され最
後には研摩定盤本体12の外に排出される。Next, when a polishing liquid containing no abrasive grains is supplied, as shown in FIG. Due to the centrifugal force of the polishing surface plate and the rotating action of the workpiece, the abrasive grains are flowed from the small and shallow grooves 6 to the deep grooves 6 so as to wash away the abrasive particles that have fallen into the small and shallow grooves, and are finally polished. It is discharged outside the board body 12.
以上のごとく脱落した砥粒及び加工に直接関係しない余
分な砥粒が浅い溝に落ち更に大きな溝を通じて排出され
ることにより、前記砥粒に研摩傷を防ぐとともに、研摩
定盤に埋り込んだ安定した砥粒により研摩加工を促進し
研摩傷の少ない研摩面が得られる。As mentioned above, the dropped abrasive grains and extra abrasive grains not directly related to the processing fall into the shallow grooves and are discharged through the larger grooves, thereby preventing polishing scratches on the abrasive grains and preventing the abrasive particles from being embedded in the polishing surface plate. Stable abrasive grains facilitate polishing and provide a polished surface with fewer scratches.
発明の効果
本発明は研摩定盤の研摩面に小さく浅い溝と大きく深い
溝を螺旋状又は同心円状に形成することにより脱落砥粒
及び加工に直接関係しない余分な砥粒を効果的に排出す
ることにより、研摩傷の少ない研摩面が得られる効果が
ある。Effects of the Invention The present invention effectively discharges fallen abrasive grains and excess abrasive grains not directly related to processing by forming small, shallow grooves and large, deep grooves in a spiral or concentric pattern on the polishing surface of a polishing surface plate. This has the effect of providing a polished surface with fewer polishing scratches.
第1図、第2図はそれぞれ本発明の実施例における研摩
定盤平面図、第3図は同研摩定盤の半断面図、第4図は
同大きく深い溝と小さく浅い溝の拡大図、第6図は同研
摩加工の状態を示した概要図、第6図は間溝の効果を説
明した拡大図、第7図、第8図は従来の研摩定盤による
研摩状態を説明するための断面図である。
5・・・・・・犬きく深い溝、6・・・・・・小さく浅
い溝、7・・・・・・ホルダー、8・・・・・・加工物
、9・・・・・・砥粒を混入した研摩液、10・・・・
・・砥粒が混入していない研摩液、11・・・・・・脱
落砥粒、12・・・・・・研摩定盤本体。
代理人の氏名 弁理士 中 尾 敏 男 ほか1名第1
図
第3図
第4図
第5図1 and 2 are plan views of the polishing surface plate according to an embodiment of the present invention, FIG. 3 is a half-sectional view of the same polishing surface plate, and FIG. 4 is an enlarged view of the same large deep groove and small shallow groove, Fig. 6 is a schematic diagram showing the state of the polishing process, Fig. 6 is an enlarged view explaining the effect of the groove, and Figs. FIG. 5... Deep groove, 6... Small shallow groove, 7... Holder, 8... Workpiece, 9... Grind. Polishing liquid mixed with grains, 10...
... Polishing liquid with no abrasive particles mixed in, 11 ... Fallen abrasive grains, 12 ... Polishing surface plate body. Name of agent: Patent attorney Toshio Nakao and 1 other person 1st
Figure 3 Figure 4 Figure 5
Claims (1)
心円状又は螺旋状に形成し、更に前記溝と交差するよう
に溝間距離が小さく浅い溝を螺旋状に形成した研摩定盤
。A polishing surface plate in which concentric or spiral grooves with large distances between grooves are formed on the polishing surface of the polishing surface plate body, and shallow grooves with short distances between grooves are formed in a spiral manner to intersect with the grooves. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60190795A JPS6254666A (en) | 1985-08-29 | 1985-08-29 | Polishing surface plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60190795A JPS6254666A (en) | 1985-08-29 | 1985-08-29 | Polishing surface plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6254666A true JPS6254666A (en) | 1987-03-10 |
Family
ID=16263865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60190795A Pending JPS6254666A (en) | 1985-08-29 | 1985-08-29 | Polishing surface plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6254666A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5078801A (en) * | 1990-08-14 | 1992-01-07 | Intel Corporation | Post-polish cleaning of oxidized substrates by reverse colloidation |
JP2001054856A (en) * | 1999-07-09 | 2001-02-27 | Applied Materials Inc | Polishing pad having grooved pattern for chemical mechanical polishing device |
JP2005224937A (en) * | 2004-01-30 | 2005-08-25 | Rohm & Haas Electronic Materials Cmp Holdings Inc | Grooved polishing pad having grooves and polishing method |
JP2008188768A (en) * | 1997-05-15 | 2008-08-21 | Applied Materials Inc | Polishing pad having pattern with groove for use in chemical mechanical polishing device |
-
1985
- 1985-08-29 JP JP60190795A patent/JPS6254666A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5078801A (en) * | 1990-08-14 | 1992-01-07 | Intel Corporation | Post-polish cleaning of oxidized substrates by reverse colloidation |
JP2008188768A (en) * | 1997-05-15 | 2008-08-21 | Applied Materials Inc | Polishing pad having pattern with groove for use in chemical mechanical polishing device |
JP2001054856A (en) * | 1999-07-09 | 2001-02-27 | Applied Materials Inc | Polishing pad having grooved pattern for chemical mechanical polishing device |
JP2005224937A (en) * | 2004-01-30 | 2005-08-25 | Rohm & Haas Electronic Materials Cmp Holdings Inc | Grooved polishing pad having grooves and polishing method |
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