JPS61240666A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS61240666A JPS61240666A JP8182885A JP8182885A JPS61240666A JP S61240666 A JPS61240666 A JP S61240666A JP 8182885 A JP8182885 A JP 8182885A JP 8182885 A JP8182885 A JP 8182885A JP S61240666 A JPS61240666 A JP S61240666A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- thermal expansion
- metal substrate
- layers
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8182885A JPS61240666A (ja) | 1985-04-17 | 1985-04-17 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8182885A JPS61240666A (ja) | 1985-04-17 | 1985-04-17 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61240666A true JPS61240666A (ja) | 1986-10-25 |
JPH0322707B2 JPH0322707B2 (de) | 1991-03-27 |
Family
ID=13757332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8182885A Granted JPS61240666A (ja) | 1985-04-17 | 1985-04-17 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61240666A (de) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5939214A (en) * | 1989-05-31 | 1999-08-17 | Advanced Technology Interconnect, Incorporated | Thermal performance package for integrated circuit chip |
US7362001B2 (en) | 2002-10-28 | 2008-04-22 | Toyota Jidosha Kabushiki Kaisha | Generator-motor |
US7411324B2 (en) | 2002-10-28 | 2008-08-12 | Toyota Jidosha Kabushiki Kaisha | Generator-motor |
US7456531B2 (en) | 2003-07-24 | 2008-11-25 | Toyota Jidosha Kabushiki Kaisha | Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded |
EP2056344A1 (de) * | 2006-07-28 | 2009-05-06 | Kyocera Corporation | Lagerverpackung für elektronische komponenten und elektronische anordnung |
-
1985
- 1985-04-17 JP JP8182885A patent/JPS61240666A/ja active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5939214A (en) * | 1989-05-31 | 1999-08-17 | Advanced Technology Interconnect, Incorporated | Thermal performance package for integrated circuit chip |
US7362001B2 (en) | 2002-10-28 | 2008-04-22 | Toyota Jidosha Kabushiki Kaisha | Generator-motor |
US7411324B2 (en) | 2002-10-28 | 2008-08-12 | Toyota Jidosha Kabushiki Kaisha | Generator-motor |
US7456531B2 (en) | 2003-07-24 | 2008-11-25 | Toyota Jidosha Kabushiki Kaisha | Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded |
US7759831B2 (en) | 2003-07-24 | 2010-07-20 | Toyota Jidosha Kabushiki Kaisha | Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded |
EP2056344A1 (de) * | 2006-07-28 | 2009-05-06 | Kyocera Corporation | Lagerverpackung für elektronische komponenten und elektronische anordnung |
EP2056344A4 (de) * | 2006-07-28 | 2012-12-19 | Kyocera Corp | Lagerverpackung für elektronische komponenten und elektronische anordnung |
Also Published As
Publication number | Publication date |
---|---|
JPH0322707B2 (de) | 1991-03-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3657611A (en) | A semiconductor device having a body of semiconductor material joined to a support plate by a layer of malleable metal | |
US7951467B2 (en) | Cladding material and its manufacturing method, press-forming method, and heat sink using cladding material | |
US10068829B2 (en) | Power-module substrate unit and power module | |
US4482912A (en) | Stacked structure having matrix-fibered composite layers and a metal layer | |
US4687879A (en) | Tiered thermoelectric unit and method of fabricating same | |
JP2860037B2 (ja) | 半導体装置用放熱基板の製造方法 | |
US3261079A (en) | Fabrication of thermoelectric apparatus | |
US3248681A (en) | Contacts for semiconductor devices | |
WO2019167942A1 (ja) | 絶縁回路基板 | |
JPH0322706B2 (de) | ||
JPS61240666A (ja) | 半導体装置 | |
JPH01208876A (ja) | 熱電装置とその製造方法 | |
JP2002343911A (ja) | 基 板 | |
JPS63253677A (ja) | 多層熱電変換装置 | |
JPH05166969A (ja) | 半導体装置 | |
US5825090A (en) | High power semiconductor device and method of making same | |
JPH08153898A (ja) | 熱電素子 | |
JPS6015937A (ja) | 半導体支持電極用クラツド材 | |
JPH1012767A (ja) | 積層構造放熱基板及びその製造方法 | |
JPH05109947A (ja) | 熱伝導材料とその製造方法 | |
JPS60235430A (ja) | 半導体装置 | |
JP4146736B2 (ja) | 半導体装置の製造方法 | |
JP4256282B2 (ja) | ヒートシンク材の製造方法およびヒートシンク付きセラミックパッケージ | |
JP2019153670A (ja) | 絶縁回路基板 | |
JPH02187285A (ja) | 複合金属材料とその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |