JPS61234058A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS61234058A JPS61234058A JP7425485A JP7425485A JPS61234058A JP S61234058 A JPS61234058 A JP S61234058A JP 7425485 A JP7425485 A JP 7425485A JP 7425485 A JP7425485 A JP 7425485A JP S61234058 A JPS61234058 A JP S61234058A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor
- mount
- mounting portion
- sink plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は半導体装置、特に樹脂封止型半導体装置に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a semiconductor device, and particularly to a resin-sealed semiconductor device.
従来のこの種の半導体装置は１例えば実願昭５４−１１
９１８３号公報に記載されている記載のようなものがあ
る。この構成は、第１０図−第１３図に示すように、ビ
ス穴を設けた放熱板取付部と半導体取付部１ｂからなる
金属基板１と、その半導体取付部１ｂ上に取付けられた
半導体素子２と、この半導体素子２および半導体取付部
１ｂを覆うように金属基板１に一体に結合された樹脂体
５と、この樹脂体５に先端部が埋設されると共に、金属
細線３を介して半導体素子２に接続されたリード線４に
より構成されている。A conventional semiconductor device of this type is 1, for example, Utility Application No.
There is a description such as that described in Publication No. 9183. As shown in FIGS. 10 to 13, this configuration includes a metal substrate 1 consisting of a heat sink mounting part with screw holes and a semiconductor mounting part 1b, and a semiconductor element 2 mounted on the semiconductor mounting part 1b. A resin body 5 is integrally bonded to the metal substrate 1 so as to cover the semiconductor element 2 and the semiconductor mounting portion 1b. 2 and a lead wire 4 connected to the terminal 2.
上記のように金属基板１に第４図に示すように放熱板７
を取付ける際は、放熱板取付部１ａのビス穴６にビス８
をねじ込むと、放熱板取付部１ａは放熱板７に締付けら
れるので、放熱板取付部１ａは放熱板７に沿って反り変
形する。As shown in FIG.
When installing, insert screw 8 into screw hole 6 of heat sink mounting part 1a.
When screwed in, the heat sink mounting portion 1a is tightened to the heat sink 7, so that the heat sink mounting portion 1a is warped and deformed along the heat sink 7.
この場合、半導体取付部１ｂはくびれることなく放熱板
取付部１ａと一体に形成されているので。In this case, the semiconductor mounting portion 1b is formed integrally with the heat sink mounting portion 1a without being constricted.
その放熱板取付部１ａと一緒に反って変形するから、半
導体素子２および樹脂体５も半導体取付部１ｂと一緒に
反って変形することになる。このた、め半導体素子２お
よび樹脂体５に大きな引張力を生じてクラックが発生す
る恐れがある。Since the heat dissipation plate attachment portion 1a is warped and deformed, the semiconductor element 2 and the resin body 5 are also warped and deformed together with the semiconductor attachment portion 1b. Therefore, there is a possibility that a large tensile force is generated in the semiconductor element 2 and the resin body 5, and cracks may occur.
本発明は上記欠点を解消するためになされたもので、樹
脂封止形半導体装置における樹脂体及び半導体素子のク
ラック等の発生しにくい構造を提供することを目的とす
るものである。The present invention was made in order to eliminate the above-mentioned drawbacks, and an object of the present invention is to provide a structure in which the resin body and the semiconductor element in a resin-sealed semiconductor device are less likely to be cracked.
本発明の半導体装置は金属基板の放熱板取付部または、
放熱板取付部と半導体取付部の間の、少なくとも一部を
薄く形成することにより、放熱板取付部に放熱板を取付
けた場合の変形を、薄く形成された部分で吸収するよう
に構成したことを特徴とするものである。The semiconductor device of the present invention includes a heat sink mounting portion of a metal substrate or
By forming at least a part of the space between the heat sink mounting part and the semiconductor mounting part thin, deformation when the heat sink is attached to the heat sink mounting part is absorbed by the thinly formed part. It is characterized by:
以下本発明の一実施例を図面を参照して説明する。第１
図〜第３図に示す符号のうち第１０図〜第１３図に示す
符号と同一のものは同一部分を示すものとする。An embodiment of the present invention will be described below with reference to the drawings. 1st
Among the reference numerals shown in FIGS. 10 to 3, the same reference numerals as those shown in FIGS. 10 to 13 indicate the same parts.
第１図〜第３図において、１は放熱板取付部１ａと半導
体取付部１ｂからなる金属基板で、前記面取付部１ａと
１ｂの間に薄肉部１ｄが設けられている。５は半導体素
子２を取付けた半導体取付部１ｂの表面およびその周囲
に一体に結合された樹脂体である。その他の構造は第２
図に示す従来例と同一であるから説明を省略する。In FIGS. 1 to 3, reference numeral 1 denotes a metal substrate consisting of a heat sink mounting portion 1a and a semiconductor mounting portion 1b, and a thin wall portion 1d is provided between the surface mounting portions 1a and 1b. Reference numeral 5 denotes a resin body integrally bonded to the surface and periphery of the semiconductor mounting portion 1b to which the semiconductor element 2 is mounted. Other structures are second
Since it is the same as the conventional example shown in the figure, the explanation will be omitted.
本実施例は上記のように放熱板取付部１ａと半導体取付
部１ｂの間に薄肉部１ｄを設けたので、放熱板取付部１
ａのビス六６にビス（図示せず）をねじ込み、放熱板、
（図示せず）に放熱板取付部１ａを締付けた場合に、放
熱板取付部１ａは放熱板に沿って反り変形する。しかし
、放熱板取付部１ａに放熱板を締付けた場合の変形は、
薄肉部１ｄで吸収される。In this embodiment, as described above, the thin wall portion 1d is provided between the heat sink mounting portion 1a and the semiconductor mounting portion 1b.
Screw the screw (not shown) into screw 6 of a, and attach the heat sink,
When the heat sink mounting portion 1a is tightened (not shown), the heat sink mounting portion 1a warps and deforms along the heat sink. However, the deformation when the heat sink is tightened to the heat sink attachment part 1a is as follows.
It is absorbed by the thin wall portion 1d.
従って、半導体素子２および樹脂体５の取付けられた半
導体取付部１ｂは変形しないから、半導体取付部１ｂと
一体に結合された半導体素子２および樹脂体５もほとん
ど変形しない。Therefore, since the semiconductor mounting portion 1b to which the semiconductor element 2 and the resin body 5 are attached is not deformed, the semiconductor element 2 and the resin body 5 that are integrally connected to the semiconductor attachment portion 1b are also hardly deformed.
第５図〜第７図と第８図〜第１０図は本発明の別の実施
例を示している。5-7 and 8-10 show other embodiments of the invention.
本実施例では、放熱板取付部１ａが薄く形成されている
１本実施例では、放熱板取付部１ａを締付けた場合の変
形が、薄い放熱板取付部１ａだけで吸収されるため、半
導体取付部１ｂは変形しない。In this embodiment, the heat sink mounting portion 1a is formed thinly. Part 1b is not deformed.
以上説明したように本発明によれば、金属基板を放熱板
に取付けた際に、半導体素子および樹脂体は変形しない
ので、その両者に生ずる引張応力は小さいからクラック
が発生するのを防止することができる。As explained above, according to the present invention, when the metal substrate is attached to the heat sink, the semiconductor element and the resin body do not deform, so the tensile stress generated in both is small, so cracks can be prevented from occurring. Can be done.
第１図〜第３図は、本発明の半導体装置の一実施例とし
て樹脂封止型パワーＩＣの要部を示すもので第１図は正
面図、第２図は横断面図、第３図は側断面図、第４図〜
第６図は１本発明の別の一実施例の要部を示すもので、
第４図は正面図、第５図は横断面図、第６図は側面図、
第７図〜第９図は、本発明の更に他の一実施例の要部を
示すもので、第７図は正面図、第８図は横断面図、第９
図は側面図、第１０ｆｆｌ〜第１３図は従来の樹脂封止
型パフ−ＩＣを示すもので、第１０図は正面図、第１１
図は横断面図、第１２図は側断面図、第１３図は樹脂封
止型パワーＩＣを放熱板に取付けた状態を示す正面図で
ある。
１・・・金属基板、１ａ・・・放熱板取付部、１ｂ・・
・半導体取付部、１ｄ・・・薄く形成した変形部。1 to 3 show the main parts of a resin-sealed power IC as an embodiment of the semiconductor device of the present invention. FIG. 1 is a front view, FIG. 2 is a cross-sectional view, and FIG. 3 is a cross-sectional view. is a side sectional view, Figure 4~
FIG. 6 shows the main part of another embodiment of the present invention,
Figure 4 is a front view, Figure 5 is a cross-sectional view, Figure 6 is a side view,
7 to 9 show essential parts of still another embodiment of the present invention, in which FIG. 7 is a front view, FIG. 8 is a cross-sectional view, and FIG. 9 is a cross-sectional view.
The figure is a side view, Figures 10ffl to 13 show conventional resin-sealed puff ICs, Figure 10 is a front view, and Figures 11
12 is a cross-sectional view, FIG. 12 is a side sectional view, and FIG. 13 is a front view showing a resin-sealed power IC mounted on a heat sink. 1... Metal board, 1a... Heat sink mounting part, 1b...
- Semiconductor mounting part, 1d... thinly formed deformed part.
Claims (1)
その半導体取付部に取付けられ、かつリード線に接続す
る半導体素子と、この半導体素子および前記半導体取付
部を覆うように金属基板に一体に結合された樹脂体から
なる半導体装置において、前記放熱板取付部と半導体取
付部の間に、少なくとも一部を薄く形成した変形手段を
有することを特徴とする半導体装置。 ２、変形手段は、放熱板取付部と半導体取付部の間に形
成した薄肉部により構成されていることを特徴とする特
許請求の範囲第１項記載の半導体装置。 ３、変形手段は、放熱板取付部の厚さを半導体取付部の
厚さより薄く形成することにより構成したことを特徴と
する半導体装置。[Claims] 1. A metal substrate comprising a heat sink mounting portion and a semiconductor mounting portion;
In a semiconductor device comprising a semiconductor element attached to the semiconductor mounting part and connected to a lead wire, and a resin body integrally bonded to a metal substrate so as to cover the semiconductor element and the semiconductor mounting part, the heat sink mounting part is attached. 1. A semiconductor device comprising a deforming means, at least a portion of which is formed thin, between the part and the semiconductor mounting part. 2. The semiconductor device according to claim 1, wherein the deforming means is constituted by a thin portion formed between the heat sink mounting portion and the semiconductor mounting portion. 3. A semiconductor device, characterized in that the deformation means is configured by forming the heat sink mounting portion to be thinner than the semiconductor mounting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7425485A JPS61234058A (en) | 1985-04-10 | 1985-04-10 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7425485A JPS61234058A (en) | 1985-04-10 | 1985-04-10 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61234058A true JPS61234058A (en) | 1986-10-18 |
Family
ID=13541832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7425485A Pending JPS61234058A (en) | 1985-04-10 | 1985-04-10 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61234058A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6018939A (en) * | 1983-07-13 | 1985-01-31 | Hitachi Micro Comput Eng Ltd | Resin seal type semiconductor device |
-
1985
- 1985-04-10 JP JP7425485A patent/JPS61234058A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6018939A (en) * | 1983-07-13 | 1985-01-31 | Hitachi Micro Comput Eng Ltd | Resin seal type semiconductor device |
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