JPS61227035A - セラミツクス回路基板 - Google Patents

セラミツクス回路基板

Info

Publication number
JPS61227035A
JPS61227035A JP6753585A JP6753585A JPS61227035A JP S61227035 A JPS61227035 A JP S61227035A JP 6753585 A JP6753585 A JP 6753585A JP 6753585 A JP6753585 A JP 6753585A JP S61227035 A JPS61227035 A JP S61227035A
Authority
JP
Japan
Prior art keywords
copper plate
bonding
oxygen concentration
copper
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6753585A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0575577B2 (enrdf_load_stackoverflow
Inventor
水野谷　信幸
忠 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP6753585A priority Critical patent/JPS61227035A/ja
Publication of JPS61227035A publication Critical patent/JPS61227035A/ja
Publication of JPH0575577B2 publication Critical patent/JPH0575577B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP6753585A 1985-03-30 1985-03-30 セラミツクス回路基板 Granted JPS61227035A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6753585A JPS61227035A (ja) 1985-03-30 1985-03-30 セラミツクス回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6753585A JPS61227035A (ja) 1985-03-30 1985-03-30 セラミツクス回路基板

Publications (2)

Publication Number Publication Date
JPS61227035A true JPS61227035A (ja) 1986-10-09
JPH0575577B2 JPH0575577B2 (enrdf_load_stackoverflow) 1993-10-20

Family

ID=13347767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6753585A Granted JPS61227035A (ja) 1985-03-30 1985-03-30 セラミツクス回路基板

Country Status (1)

Country Link
JP (1) JPS61227035A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01251781A (ja) * 1988-03-31 1989-10-06 Narumi China Corp セラミック回路基板およびセラミック回路基板の製造方法
JPH0429390A (ja) * 1990-05-25 1992-01-31 Toshiba Corp セラミックス回路基板の製造方法
JP2001274534A (ja) * 2000-03-27 2001-10-05 Toshiba Corp セラミックス銅回路基板およびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5237914A (en) * 1975-07-30 1977-03-24 Gen Electric Method of directly combining metal to ceramics and metal

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5237914A (en) * 1975-07-30 1977-03-24 Gen Electric Method of directly combining metal to ceramics and metal

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01251781A (ja) * 1988-03-31 1989-10-06 Narumi China Corp セラミック回路基板およびセラミック回路基板の製造方法
JPH0429390A (ja) * 1990-05-25 1992-01-31 Toshiba Corp セラミックス回路基板の製造方法
JP2001274534A (ja) * 2000-03-27 2001-10-05 Toshiba Corp セラミックス銅回路基板およびその製造方法

Also Published As

Publication number Publication date
JPH0575577B2 (enrdf_load_stackoverflow) 1993-10-20

Similar Documents

Publication Publication Date Title
EP0681322A2 (en) Bonded ceramic metal composite substrates and circuit boards constructed therewith
JPH0429390A (ja) セラミックス回路基板の製造方法
JPS644668B2 (enrdf_load_stackoverflow)
US5047371A (en) Glass/ceramic sealing system
JPS6272576A (ja) セラミツクス−金属接合体
JP2003055058A (ja) セラミック体と銅板の接合方法
JPS60173900A (ja) セラミツクス回路基板
JPH01248648A (ja) セラミックス回路基板
JPS63238994A (ja) 半田組成物
US4737416A (en) Formation of copper electrode on aluminum nitride
JPS61227035A (ja) セラミツクス回路基板
JPS59121890A (ja) セラミツクスと金属との接合体
JPS6046976A (ja) セラミツクスの接着方法
JPS59156974A (ja) セラミツクスとケイ素との接合方法
JPH0328825B2 (enrdf_load_stackoverflow)
JP4557354B2 (ja) セラミックス銅回路基板の製造方法
JPH02100346A (ja) 半導体装置用基板
JPH0575576B2 (enrdf_load_stackoverflow)
JPS60117792A (ja) セラミックス回路基板
JPH0455148B2 (enrdf_load_stackoverflow)
JPS60107845A (ja) 半導体用回路基板
JPS6272575A (ja) セラミツクス−金属接合体の製造方法
JPH0294648A (ja) 半導体装置用基板
JPH0245354B2 (ja) Kinzokukairoojusuruseramitsukusukibannoseizohoho
JPS61296788A (ja) 回路基板

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term