JPH0328825B2 - - Google Patents

Info

Publication number
JPH0328825B2
JPH0328825B2 JP57150239A JP15023982A JPH0328825B2 JP H0328825 B2 JPH0328825 B2 JP H0328825B2 JP 57150239 A JP57150239 A JP 57150239A JP 15023982 A JP15023982 A JP 15023982A JP H0328825 B2 JPH0328825 B2 JP H0328825B2
Authority
JP
Japan
Prior art keywords
copper
aluminum nitride
oxygen
thermally conductive
conductive substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57150239A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5940404A (ja
Inventor
Michasu Komatsu
Masae Nakanishi
Hiroyuki Ishizuka
Nobuyuki Mizunoya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP57150239A priority Critical patent/JPS5940404A/ja
Publication of JPS5940404A publication Critical patent/JPS5940404A/ja
Publication of JPH0328825B2 publication Critical patent/JPH0328825B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Powder Metallurgy (AREA)
  • Inorganic Insulating Materials (AREA)
JP57150239A 1982-08-30 1982-08-30 熱伝導性基板 Granted JPS5940404A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57150239A JPS5940404A (ja) 1982-08-30 1982-08-30 熱伝導性基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57150239A JPS5940404A (ja) 1982-08-30 1982-08-30 熱伝導性基板

Publications (2)

Publication Number Publication Date
JPS5940404A JPS5940404A (ja) 1984-03-06
JPH0328825B2 true JPH0328825B2 (enrdf_load_stackoverflow) 1991-04-22

Family

ID=15492597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57150239A Granted JPS5940404A (ja) 1982-08-30 1982-08-30 熱伝導性基板

Country Status (1)

Country Link
JP (1) JPS5940404A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0674194B2 (ja) * 1986-02-03 1994-09-21 住友電気工業株式会社 表面改質されたＡ▲ｌ▼Ｎ焼結体
JPS62270478A (ja) * 1986-05-16 1987-11-24 宇部興産株式会社 窒化珪素焼結体の表面処理方法
JP3529055B2 (ja) * 1994-05-18 2004-05-24 電気化学工業株式会社 絶縁放熱板
JP3845925B2 (ja) 1996-02-05 2006-11-15 住友電気工業株式会社 窒化アルミニウム基材を用いた半導体装置用部材及びその製造方法
EP0935286A4 (en) 1997-05-26 2008-04-09 Sumitomo Electric Industries COPPER CIRCUIT CONNECTING SUBSTRATE AND ITS MANUFACTURE

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5075208A (enrdf_load_stackoverflow) * 1973-11-07 1975-06-20

Also Published As

Publication number Publication date
JPS5940404A (ja) 1984-03-06

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