JPS61217582A - 無電解すずめつき浴とその使用方法 - Google Patents

無電解すずめつき浴とその使用方法

Info

Publication number
JPS61217582A
JPS61217582A JP5856785A JP5856785A JPS61217582A JP S61217582 A JPS61217582 A JP S61217582A JP 5856785 A JP5856785 A JP 5856785A JP 5856785 A JP5856785 A JP 5856785A JP S61217582 A JPS61217582 A JP S61217582A
Authority
JP
Japan
Prior art keywords
bath
electroless
mol
tin
tinning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5856785A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0250990B2 (sk
Inventor
Hidekatsu Kotanino
小谷野　英勝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOKYO MEKKI KK
Original Assignee
TOKYO MEKKI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOKYO MEKKI KK filed Critical TOKYO MEKKI KK
Priority to JP5856785A priority Critical patent/JPS61217582A/ja
Publication of JPS61217582A publication Critical patent/JPS61217582A/ja
Publication of JPH0250990B2 publication Critical patent/JPH0250990B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP5856785A 1985-03-25 1985-03-25 無電解すずめつき浴とその使用方法 Granted JPS61217582A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5856785A JPS61217582A (ja) 1985-03-25 1985-03-25 無電解すずめつき浴とその使用方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5856785A JPS61217582A (ja) 1985-03-25 1985-03-25 無電解すずめつき浴とその使用方法

Publications (2)

Publication Number Publication Date
JPS61217582A true JPS61217582A (ja) 1986-09-27
JPH0250990B2 JPH0250990B2 (sk) 1990-11-06

Family

ID=13088018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5856785A Granted JPS61217582A (ja) 1985-03-25 1985-03-25 無電解すずめつき浴とその使用方法

Country Status (1)

Country Link
JP (1) JPS61217582A (sk)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993025060A1 (en) * 1992-06-02 1993-12-09 Ibiden Co., Ltd. Solder-precoated wiring board and method for manufacturing the same
JPH06181381A (ja) * 1992-12-11 1994-06-28 Nec Corp はんだ膜形成方法
CN102925878A (zh) * 2012-10-25 2013-02-13 南京大地冷冻食品有限公司 一种常温化学锡镀液

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993025060A1 (en) * 1992-06-02 1993-12-09 Ibiden Co., Ltd. Solder-precoated wiring board and method for manufacturing the same
US5532070A (en) * 1992-06-02 1996-07-02 Ibiden Co., Ltd. Solder-precoated conductor circuit substrate and method of producing the same
JPH06181381A (ja) * 1992-12-11 1994-06-28 Nec Corp はんだ膜形成方法
CN102925878A (zh) * 2012-10-25 2013-02-13 南京大地冷冻食品有限公司 一种常温化学锡镀液

Also Published As

Publication number Publication date
JPH0250990B2 (sk) 1990-11-06

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