JPS61214545A - Semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the slipping-off and looseness of the inner leads from generating due to the expansion of the resin by a method wherein each lead-out part of the leads for wiring of a sealing resin body is provided with protrusion parts and the volume of a part of each lead, where a lead is supported by the resin, is decreased. CONSTITUTION:Leads 2 are flat. Due to this, the expansion of the resin from the X-direction to the Y-direction largely exerts an effect on the slipping-off and looseness of inner leads 2b. Therefore, spaces 1b are provided between the adjacent leads 2 in the X-directions of the lead-out parts of the leads 2. By the spaces 1b, the expansion of the resin in the protrusion parts 1a, particularly in the Y-direction, is suppressed. the inner end of each inner lead 2b is provided with an extendedly spread part 3c, a notch 3b is provided in each protrusion part 1a and the generation of the slipping-off and looseness is prevented. In addition, space parts can be further provided up and down in the Y-directions.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor device, and particularly to a semiconductor device having wiring leads and sealed with a molding resin.

(Technical Background of the Invention) In semiconductor devices, wiring leads are often used to electrically connect elements on pellets to the outside, and
As the envelope, a molded resin body in which these are sealed with molded resin is often used. FIG. 4 shows an external view of a conventional general semiconductor device of this type. Wiring leads 2 are led out from the side surface of the molded resin body 1 to form external leads 2a. FIG. 5 is a diagram of the internal structure of this semiconductor device viewed from above, showing the state in which wiring leads 2 are supported. Of the wiring leads 2, internal leads 2b are buried inside the molded resin body 1, and external leads 2a are led out. In addition, in order to prevent the wiring lead 2 from falling out of the molded resin body and from wobbling, holes 3a and notches 3 are provided.
b, an extension section 30 and the like are provided. The inner lead 2b is compressed from its surroundings due to erosion of the mold resin seal and curing shrinkage of the resin and is very strongly fixed, and is prevented from coming off and wobbling due to the hole 3a, notch 3b, and extended portion 3C.

[Problems with background technology]

When mounting a semiconductor device on a substrate, a process is used in which the entire semiconductor device is immersed in a solder bath. In this step, the temperature of the entire semiconductor device rises to near the melting point of the solder, causing the molded resin body to expand. In this type of volumetric expansion, there is a force that tries to expand outward, so
The mold resin will move away from the internal leads.

Therefore, the adhesion between the molding resin and the internal leads is impaired, resulting in problems such as the internal leads coming off and rattling.

[Purpose of the invention]

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a semiconductor device in which internal leads do not come off or wobble due to expansion of a molded resin body.

[Summary of the Invention] The present invention is characterized by a semiconductor pellet, a wiring lead for electrically connecting an element on the semiconductor pellet to the outside, and a mold for integrally sealing the inside portion of the semiconductor pellet and the wiring lead. In a semiconductor device equipped with a resin body, the portion of the mold resin body from which the wiring leads are led out is made to protrude, the volume of the portion of the mold resin body that supports the wiring leads is reduced, and the mold resin body expands. This prevents the internal leads from coming loose or rattling due to this.

(Embodiments of the Invention) The present invention will be described below based on illustrated embodiments. 1st
The figure is an external view of a portion of a semiconductor device according to the present invention.

Wiring leads 2 are led out from the side surface of the molded resin body 1 to form external leads 2a. The molded resin body 1 has a protrusion 1a at a portion where the external lead 2a is led out. A space 1b is formed between the protrusions 1a. Generally, the wiring lead 2 is flat, so
The expansion of the resin in the horizontal direction (X direction in the diagram) is greater than the expansion in the vertical direction (Y direction in the diagram).
The expansion in this direction has a greater effect on the disconnection and wobbling of the wiring lead 2. This is because even if the wiring lead 2 expands by the same dimension, the dimension in the Y direction of the wiring lead 2 is smaller than the dimension in the X direction, so that the proportion affected becomes larger. Therefore, as in the embodiment shown in FIG.
It is effective to provide Since there is no resin expansion in the space 1b, resin expansion in the protruding portion 1a, particularly in the Y direction, is suppressed.

FIG. 2 is a diagram of the internal structure of this device, viewed from above, showing the state in which the wiring leads 2 are supported. In order to prevent the internal lead 2b from coming out and rattling,
It has an extended portion 3C at its inner end, and a notch 3 within the protruding portion 1a.
It has b. It is preferable that the notch 3b is thus provided within the protrusion 1a. This is because, as described above, the inside of the protrusion 1a is less affected by resin expansion. In order to prevent wobbling in the Y direction, it is also effective to provide cutouts 3d on the upper and lower surfaces of the internal leads 2b, as shown in FIG.

In the embodiment shown in FIG. 1, the spaces 1b are provided on both sides of the lead-out portion of the wiring lead 2 in the X direction, but spaces may also be provided above and below in the Y direction. .

〔Effect of the invention〕

As described above, according to the present invention, in the semiconductor device, the protrusion is provided in the wiring lead lead-out portion of the molded resin body, so that the volume of the portion of the molded resin body that supports the wiring leads is reduced, and the molded resin Internal reed slippage and rattling caused by body expansion are reduced.

[Brief explanation of the drawing]

FIG. 1 is an external view of a part of a semiconductor device according to an embodiment of the present invention, FIG. 2 is an internal structural diagram of the device shown in FIG. 1, and FIG.
4 is an external view of a conventional semiconductor device, and FIG. 5 is an internal structural view of the device shown in FIG. 4. 1...Mold resin body, 1a...Protrusion part, 1b...
・Space, 2... Wiring lead, 2a... External lead, 2b... Internal lead, 3a... Hole, 3b...
- Notch part, 3C... Extension part, 3d... Notch part. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5

Claims (1)

[Claims] 1. A semiconductor pellet, a wiring lead for electrically connecting an element on the semiconductor pellet to the outside, and a mold for integrally sealing the inside portion of the semiconductor pellet and the wiring lead. 1. A semiconductor device comprising a resin body, wherein the molded resin body has a protrusion in a portion where the wiring lead is led out. 2. The semiconductor device according to claim 1, wherein a portion of the wiring lead buried in the protrusion has a notch.