JPS6121375B2 - - Google Patents
Info
- Publication number
- JPS6121375B2 JPS6121375B2 JP14617979A JP14617979A JPS6121375B2 JP S6121375 B2 JPS6121375 B2 JP S6121375B2 JP 14617979 A JP14617979 A JP 14617979A JP 14617979 A JP14617979 A JP 14617979A JP S6121375 B2 JPS6121375 B2 JP S6121375B2
- Authority
- JP
- Japan
- Prior art keywords
- copper oxide
- oxide film
- aqueous solution
- coating
- paint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 26
- 239000005751 Copper oxide Substances 0.000 claims description 25
- 229910000431 copper oxide Inorganic materials 0.000 claims description 25
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 18
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000007864 aqueous solution Substances 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 10
- 239000000243 solution Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 5
- 229910017604 nitric acid Inorganic materials 0.000 claims description 5
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 claims description 5
- 229960002218 sodium chlorite Drugs 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 2
- 239000003973 paint Substances 0.000 description 13
- 238000011282 treatment Methods 0.000 description 7
- 239000002966 varnish Substances 0.000 description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 5
- 238000007598 dipping method Methods 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 239000008096 xylene Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- HVTHJRMZXBWFNE-UHFFFAOYSA-J sodium zincate Chemical compound [OH-].[OH-].[OH-].[OH-].[Na+].[Na+].[Zn+2] HVTHJRMZXBWFNE-UHFFFAOYSA-J 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Chemical Treatment Of Metals (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14617979A JPS5669723A (en) | 1979-11-12 | 1979-11-12 | Method of manufacturing insulated electric wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14617979A JPS5669723A (en) | 1979-11-12 | 1979-11-12 | Method of manufacturing insulated electric wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5669723A JPS5669723A (en) | 1981-06-11 |
| JPS6121375B2 true JPS6121375B2 (enrdf_load_stackoverflow) | 1986-05-27 |
Family
ID=15401915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14617979A Granted JPS5669723A (en) | 1979-11-12 | 1979-11-12 | Method of manufacturing insulated electric wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5669723A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2742919B2 (ja) * | 1987-02-06 | 1998-04-22 | 株式会社関西プラント工業 | 不活性化皮膜層を形成したステンレススチール材の製造方法 |
| JPH02236286A (ja) * | 1989-03-07 | 1990-09-19 | Furukawa Electric Co Ltd:The | 早期に緑青を形成する銅製品とその製造方法 |
| DE69209724T2 (de) * | 1991-04-29 | 1996-10-10 | Philips Electronics Nv | Erhöhung der Diffusionsbarriere einer Metallisierungsstruktur geeignet zur Herstellung von Halbleiterbauelementen |
-
1979
- 1979-11-12 JP JP14617979A patent/JPS5669723A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5669723A (en) | 1981-06-11 |
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