JPS61209073A - Method for depositing resin to end surface of metal plate - Google Patents
Method for depositing resin to end surface of metal plateInfo
- Publication number
- JPS61209073A JPS61209073A JP5001985A JP5001985A JPS61209073A JP S61209073 A JPS61209073 A JP S61209073A JP 5001985 A JP5001985 A JP 5001985A JP 5001985 A JP5001985 A JP 5001985A JP S61209073 A JPS61209073 A JP S61209073A
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- end surface
- resin layer
- thickness
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は切断加工された金属板端面の処理方法、詳しく
は、同端面への防銹用樹脂被着方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for treating the end face of a cut metal plate, and more particularly to a method for applying a rust-proofing resin to the end face.
従来の技術
電子機器の回路基板として利用される印刷配線基板は、
広い面積の基板から所定寸法の印刷配線基板体に切断加
工されたものが多い。この場合、切断端面には適当な端
面処理が必要であり、例えば、基板本体が鉄板のもので
は、その切断端面の防銹処理が不可欠である。Conventional technologyPrinted wiring boards are used as circuit boards for electronic devices.
In many cases, a large area board is cut into a printed wiring board body of a predetermined size. In this case, the cut end surface requires appropriate end surface treatment. For example, if the substrate body is made of iron plate, it is essential that the cut end surface be rust-proofed.
金属板の防銹対策としては、従来から、クロメート処理
あるいはテフロンコート処理が実施されているが、これ
らの処理方法を切断加工された金属板端面の処理に用い
るには問題も多い。Conventionally, chromate treatment or Teflon coating treatment has been carried out as a rust-proofing measure for metal plates, but there are many problems when using these treatment methods to treat the end faces of cut metal plates.
発明が解決しようとする問題点
印刷配線基板は、広い面積の金属板上に回路配線材を形
成した後に、所定回路配線材を含む面積で切断加工され
るものであり、その切断端面に防銹処理を施すのは、な
かなか困難である。とりわけ、切断端面が複雑な稜線形
状を有するものの場合には、いっそう困難もしくは非能
率である。Problems to be Solved by the Invention Printed wiring boards are produced by forming circuit wiring materials on a large metal plate and then cutting them into areas that include a predetermined circuit wiring material. It is quite difficult to carry out treatment. This is particularly difficult or inefficient when the cut end surface has a complicated ridgeline shape.
問題点を解決するための手段
本発明は、上述の問題点を解決するために、金属板の切
断端面に対して、同端面対応の開口を有するメタルマス
クにより、樹脂ペーストを印刷被着する工程をそなえた
金属板端面への樹脂被着方法を提供するものである。Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a step of printing and applying a resin paste to the cut end face of a metal plate using a metal mask having an opening corresponding to the cut end face. The present invention provides a method for adhering resin to the end face of a metal plate having the following properties.
作 用
この発明によシ、切断加工後の金属板端面に対して、厚
目の樹脂を印刷法によって被着することが可能であり、
複雑な稜線形状を有する金属板端面に対しても、自在に
メタルマスクを準備することができるので、能率的、か
つ、均一に樹脂を被着することができる。Effect: According to the present invention, it is possible to apply a thick resin to the end face of a metal plate after cutting by a printing method,
Since a metal mask can be freely prepared even on the end face of a metal plate having a complicated ridge shape, the resin can be applied efficiently and uniformly.
実施例
第1図は本発明の実施例を概説するための展開的断面図
であり、第2図a、bは本実施例に用いた金属板の形成
工程断面図である。以下、図面を参照して、本発明を実
施例により詳しく説明する。Embodiment FIG. 1 is a developed sectional view for outlining an embodiment of the present invention, and FIGS. 2a and 2b are sectional views showing the process of forming a metal plate used in this embodiment. Hereinafter, the present invention will be explained in detail by examples with reference to the drawings.
第1図において、金属板1は、厚さ1.01111の珪
素鋼板を用い、この表面部に厚さ60μmの絶縁樹脂層
2を介して、公称厚さ35μmの銅箔を張り合わせたも
のから、配線層3をパターン形成したのち、一定寸法に
切断して、側端面4が露出されているものである。そし
て、この金属板1を載置台6上に固定する。載置台5は
、金属板1を固定したとき、その側端部4の下部に適当
な間隙ができるように窪み部6を設けておくとよい。ま
た、金属板1の周囲には、適当な間隔で、はぼ同厚の当
て板7を配設して段差をなくしておくとよい。In FIG. 1, the metal plate 1 is made of a silicon steel plate with a thickness of 1.01111 mm, and a copper foil with a nominal thickness of 35 μm is laminated on the surface of this plate through an insulating resin layer 2 with a thickness of 60 μm. After the wiring layer 3 is patterned, it is cut into a certain size so that the side end surfaces 4 are exposed. Then, this metal plate 1 is fixed on a mounting table 6. It is preferable that the mounting table 5 is provided with a recess 6 so that an appropriate gap is formed at the lower part of the side end 4 when the metal plate 1 is fixed. Further, it is preferable to arrange backing plates 7 of approximately the same thickness around the metal plate 1 at appropriate intervals to eliminate differences in level.
次に、この金属板1に対して、メタルマスク8を重ねて
、その開口9を通じて、樹脂ペースト1゜を供給し、金
属板1の端面4に樹脂層11を被着する。メタルマスク
8の開口9は、金属板1の切断端面に沿って設けられ、
同開口内部には十分な樹脂ペーストを供給し得るような
溜めを作るための段部を形成した構造が好ましい。この
メタルマスク8の形状を一例で示すと、厚さ0.2+w
の燐背銅板を用意し、これに金属板1の切断端面に沿っ
た約1.0IIl1幅の貫通溝を食刻技法で形成する。Next, a metal mask 8 is placed over the metal plate 1, and a resin paste 1° is supplied through the opening 9 to coat the end face 4 of the metal plate 1 with a resin layer 11. The opening 9 of the metal mask 8 is provided along the cut end surface of the metal plate 1,
It is preferable to have a structure in which a stepped portion is formed inside the opening to create a reservoir capable of supplying a sufficient amount of resin paste. To give an example of the shape of this metal mask 8, the thickness is 0.2+w
A phosphor-backed copper plate is prepared, and a through groove with a width of about 1.0II1 along the cut end surface of the metal plate 1 is formed therein by an etching technique.
なお、マスクの繋ぎには、約10sII間隔ごとに0.
5期幅でメタルを残しておけばよい。また、当て板7は
、たとえば、厚さ1.0麿のエポキシ樹脂成形板を用い
、金属板1の切断端面4との間隔が約1、Onになるよ
うに固定されるとよい。載置台5は、例えば、フェノー
ル樹脂成形板を用いて作り、金属板1および当て板7を
載置したとき、十分に位置固定されるように、必要に応
じ、適当な吸着補助材を併用するとよい。樹脂ペースト
1oは、スキージ12を移動させることにより、メタル
マスク8の開口9に送られ、同開口9から金属板1の端
面4に1重によって流れ移り、同面に厚さ10〜20μ
mの樹脂層11が形成されるように粘度、流動性等を調
整して、印刷塗布する。この樹脂ペースト10としては
、例えば、シェル石油社製の製品名828で知られるエ
ポキシ樹脂(主剤)に芳香族アミンアダクト(硬化剤)
を当量混合した無溶剤のものを用いることができ、印刷
塗布後、160”C,30分の加熱処理により、耐久性
のあるエポキシ樹脂層に仕上げることができる。In addition, when connecting the masks, 0.
All you have to do is leave the metal in five terms. Further, the backing plate 7 may be fixed using, for example, an epoxy resin molded plate having a thickness of 1.0 mm so that the distance from the cut end surface 4 of the metal plate 1 is approximately 1.0 On. The mounting table 5 is made of, for example, a phenol resin molded plate, and if necessary, an appropriate adsorption aid may be used in combination to ensure that the metal plate 1 and the backing plate 7 are sufficiently fixed in position when placed thereon. good. The resin paste 1o is sent to the opening 9 of the metal mask 8 by moving the squeegee 12, and flows from the opening 9 onto the end surface 4 of the metal plate 1 in a single layer, leaving a thickness of 10 to 20 μm on the same surface.
The viscosity, fluidity, etc. are adjusted so that a resin layer 11 of m is formed, and printing is applied. The resin paste 10 is made of, for example, an epoxy resin (base resin) known as product name 828 manufactured by Shell Oil Co., Ltd., and an aromatic amine adduct (curing agent).
A solvent-free epoxy resin layer can be used in which equivalent amounts of epoxy resin are mixed, and after printing and coating, a durable epoxy resin layer can be obtained by heat treatment at 160''C for 30 minutes.
第2図aは、金属板1の原材料基板であり、珪素鋼板1
に絶縁樹脂層2を介して配線用銅箔3′を張9合わせた
ものである。つぎに配線用鋼箔3′は周知の食刻技法に
より、第2図すのように、所定の回路配線パターン3に
加工され、この基板を、通常の型抜き機械によって、単
位金属板1に切断用いられるものであり、側端面4が露
出したままの状態である。FIG. 2a shows the raw material substrate of the metal plate 1, and the silicon steel plate 1
A copper foil 3' for wiring is pasted 9 on the wafer with an insulating resin layer 2 interposed therebetween. Next, the wiring steel foil 3' is processed into a predetermined circuit wiring pattern 3 using a well-known etching technique, as shown in FIG. It is used for cutting, and the side end surface 4 remains exposed.
以上の手順により、切断端面に樹脂層を被着した金属板
について、同端面の発銹性を試験したところ、室温40
°C9相対湿度90〜95%の条件下で、1000時間
以上の発銹耐久性があった。According to the above procedure, the rusting property of the cut end surface of the metal plate coated with the resin layer was tested, and it was found that
It had a rusting durability of 1000 hours or more under conditions of 90 to 95% relative humidity at 9°C.
なお、比較試験として、同樹脂層にO,OS〜0.06
−直径の小孔を設けて、同じ条件下で耐久性をみたとこ
ろ、240時間で小孔部金属端面に発銹がみられた。In addition, as a comparative test, O, OS~0.06 was added to the same resin layer.
- When a small hole of the same diameter was provided and the durability was checked under the same conditions, rusting was observed on the metal end surface of the small hole after 240 hours.
発明の効果
本発明の方法によれば、金属板の切断端面に対して、平
面印刷法を適用して、均一性のよい樹脂層を被着するこ
とができ、防銹効果を高めることができる。また、樹脂
層の形成にあたり、樹脂ペーストの調整2選択を十分に
検討することによって、切断端面に多少のパリがあって
も、これを包み込む厚目の樹脂層を設けることができ、
品質の安定性をも向上させることができる。Effects of the Invention According to the method of the present invention, a resin layer with good uniformity can be applied to the cut end surface of a metal plate by applying a plane printing method, and the rust prevention effect can be enhanced. . In addition, when forming the resin layer, by carefully considering the adjustment 2 selection of the resin paste, even if there is some burr on the cut end surface, it is possible to provide a thick resin layer that wraps it.
Quality stability can also be improved.
第1図は本発明の実施例を概説するための展開的断面図
、第2図a、bは本発明実施例に用いた金属板の形成工
程断面図である。FIG. 1 is a developed sectional view for outlining an embodiment of the present invention, and FIGS. 2a and 2b are sectional views showing the process of forming a metal plate used in the embodiment of the present invention.
1・・・・・・金属板、2・・・・・・絶縁樹脂層、3
・・・・・・配線(銅箔)、4・・・・・・端面、5・
・・・・・載置台、6・・・・・・窪み部、7・・・・
・・当て板、8・・・・・・メタルマスク、9・・・・
・・開口、10・・・・・・樹脂ペースト、11・・・
・・・樹脂層、12・・・・・・スキージ。1...Metal plate, 2...Insulating resin layer, 3
...Wiring (copper foil), 4... End surface, 5.
...Placement table, 6...Recessed part, 7...
...Packing plate, 8...Metal mask, 9...
...Opening, 10...Resin paste, 11...
...resin layer, 12...squeegee.
代理人の氏名 弁理士 中 尾 敏 男 ほか1名第1
図
第2図
マ′Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2
Claims (2)
有するメタルマスクにより、樹脂ペーストを印刷被着す
る工程をそなえた金属板端面への樹脂被着方法。(1) A method for applying resin to the cut end face of a metal plate, which includes the step of printing and applying resin paste to the cut end face of the metal plate using a metal mask having openings corresponding to the same end face.
特許請求の範囲第1項に記載の金属板端面への樹脂被着
方法。(2) The method for applying resin to an end face of a metal plate according to claim 1, wherein the metal mask has a stepped opening shape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5001985A JPS61209073A (en) | 1985-03-13 | 1985-03-13 | Method for depositing resin to end surface of metal plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5001985A JPS61209073A (en) | 1985-03-13 | 1985-03-13 | Method for depositing resin to end surface of metal plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61209073A true JPS61209073A (en) | 1986-09-17 |
Family
ID=12847281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5001985A Pending JPS61209073A (en) | 1985-03-13 | 1985-03-13 | Method for depositing resin to end surface of metal plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61209073A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012069713A (en) * | 2010-09-24 | 2012-04-05 | Casio Comput Co Ltd | Interposer, semiconductor device with chip mounting interposer, manufacturing methods of the interposer and semiconductor device |
-
1985
- 1985-03-13 JP JP5001985A patent/JPS61209073A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012069713A (en) * | 2010-09-24 | 2012-04-05 | Casio Comput Co Ltd | Interposer, semiconductor device with chip mounting interposer, manufacturing methods of the interposer and semiconductor device |
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