JPH01270389A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH01270389A JPH01270389A JP9981288A JP9981288A JPH01270389A JP H01270389 A JPH01270389 A JP H01270389A JP 9981288 A JP9981288 A JP 9981288A JP 9981288 A JP9981288 A JP 9981288A JP H01270389 A JPH01270389 A JP H01270389A
- Authority
- JP
- Japan
- Prior art keywords
- solder resist
- wiring board
- film
- resist material
- resist film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 229910000679 solder Inorganic materials 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 10
- 239000004020 conductor Substances 0.000 claims abstract description 8
- 239000012530 fluid Substances 0.000 claims abstract description 4
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 1
- 206010011732 Cyst Diseases 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 208000031513 cyst Diseases 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野〕゛
この発明は、プリント配線板の製造方法、特に、基板に
所定の導体パターンを形成してからソルダーレジスト膜
を形成するところに特徴のあるプリント配線板の製造方
法に関するものである。Detailed Description of the Invention (Industrial Field of Application) The present invention is characterized in that it is a method for manufacturing a printed wiring board, and in particular, a solder resist film is formed after forming a predetermined conductor pattern on a board. The present invention relates to a method for manufacturing a printed wiring board.
（従来の技術）
基板の表面にソルダーレジスト膜を形成する場合、従来
は、その基板の表面に導体パターンを形成してから、そ
の上にスクリーン印刷によりソルダーレジスト膜を形成
していた。そして、この場合、上記スクリーン印刷は、
特定の印刷回路ごとにスクリーン版を生成してから行っ
ていた。(Prior Art) When forming a solder resist film on the surface of a substrate, conventionally, a conductive pattern is formed on the surface of the substrate, and then a solder resist film is formed thereon by screen printing. And in this case, the above screen printing is
This was done after generating a screen version for each specific printed circuit.
このように、従来は、スクリーン印刷によりソルダーレ
シス膜を形成していたので、次のような問題があった。As described above, conventionally, the solder resist film was formed by screen printing, which caused the following problems.
（１）処理基板に合せた寸法のスクリーン版を回路ごと
に必要とするので、作業能率が悪い。(1) Since a screen plate with dimensions matching the processing board is required for each circuit, work efficiency is poor.
（２）印刷インキの性状が変化するので、膜厚か不均一
になり、したがって耐フラツクス特性の安定しまたレジ
スト１摸を得るのがむずかしい。(2) Since the properties of the printing ink change, the film thickness becomes non-uniform, making it difficult to obtain a resist with stable flux resistance.
（３）配線板のソリやパターンの状態によりレジスト膜
の膜厚や特性が均質になりにくい。(3) It is difficult for the thickness and characteristics of the resist film to become uniform due to the warpage of the wiring board and the condition of the pattern.
この発明は、以トのような従来の問題点を解決するため
になざわたもので、（１）膜厚が平滑部でもパターンエ
・・ノシ部でも均一であり、したかって耐フラツクス特
性の安定したソルダーレジスト膜を１することかてさ、
（２）また、揮発分もボイドの蓚込みもない均質なソル
ダーレジスト膜を得ることができ、（３）さらに、作業
能率の向上をｉＪ ｆｌＦ、にするプリント配線板の製
造方法を提供することを目的とする。This invention was developed in order to solve the following conventional problems. (1) The film thickness is uniform both in the smooth part and in the pattern etched part, so that the flux resistance property is improved. The key is to create a stable solder resist film.
(2) Furthermore, it is possible to obtain a homogeneous solder resist film without inclusion of volatile matter and voids, and (3) to provide a method for manufacturing a printed wiring board that further improves work efficiency. With the goal.
（３題を解決するためのｆ段〕
この発明に係るプリント配線板の製造方法は、次の３つ
の工程を備えたものである。(Step f for solving three problems) The method for manufacturing a printed wiring board according to the present invention includes the following three steps.
（１）基板の表面に導体パターンを形成した配線板を、
感光性物質を含有し、かつ流動状態にある粉末状のソル
ダーレジスト材の中に浸漬して、その表面に同レジスト
材を付着させる工３！。(1) A wiring board with a conductor pattern formed on the surface of the board,
Step 3: Immerse in powdered solder resist material containing a photosensitive substance and in a fluid state to adhere the resist material to the surface. .
（２）表面に付着したソルダーレジスト材を溶融させて
面記配線板の表面にソルダーレジスト膜を形成する工程
。(2) A step of melting the solder resist material attached to the surface to form a solder resist film on the surface of the printed wiring board.
（３）スルーホール、フラットパッド等の部分のソルダ
ーレジスト膜を露光して除去してからその稈。(3) After exposing and removing the solder resist film in areas such as through holes and flat pads, remove the culm.
（作用）
この発明においては、流動状態にある粉末状のソルダー
レジスト材の中に、導体パターンを形成した配線板を浸
漬するので、その表面にレジスト材が均一＝に付ｍする
。したがって、こわを溶融してできるソルダーレジスト
膜は、揮発分もボイドの巻込みもない均７１な膜となる
。また、その膜ｆｙは、平滑部でも、パターンエツジ部
でも均一になる。このため、その耐フラツクス特性か安
定する。(Function) In the present invention, a wiring board on which a conductor pattern is formed is immersed in a powdered solder resist material in a fluid state, so that the resist material is uniformly applied to the surface of the wiring board. Therefore, the solder resist film formed by melting the stiffness becomes a uniform film without any volatile matter or voids. Further, the film fy is uniform both in the smooth portion and in the pattern edge portion. Therefore, its flux resistance properties are stabilized.
また、この発明によりば、配線板のソルダーレジスト材
へのｉｆ ｒｊ’？、付着した同レジスト材の溶融、ソ
ルダーレジスト膜の除去、硬化といった手順でレジスト
膜を形成できるので、従来のスクリーン印刷によらなく
てよい。このため、作業能率が向上する。Further, according to the present invention, if rj'? to the solder resist material of the wiring board? Since the resist film can be formed by the steps of melting the adhered resist material, removing the solder resist film, and curing it, conventional screen printing is not necessary. Therefore, work efficiency is improved.
（実施例）
以Ｆ、この発明の一実施例を第１〜４図により説明する
。第１〜４図は、この発明の一実施例によるソルダーレ
ジスト膜の生成道程を示す図である。(Example) Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 4. 1 to 4 are diagrams showing the process of forming a solder resist film according to an embodiment of the present invention.
工程順に説明すると、まず、基板１に所定の導体パター
ン２とスルホール３を設けた配線板を、感光性物Ｍ（例
えば、感光性樹脂）を含有した粉末状のソルダーレジス
ト材か流動している槽に浸漬して、その表面に、第１図
のように、同レジスト材４の粉末を付着させる。To explain the process in order, first, a wiring board in which a predetermined conductor pattern 2 and through holes 3 are provided on a substrate 1 is heated using a powdered solder resist material containing a photosensitive material M (for example, a photosensitive resin). The resist material 4 is immersed in a bath, and powder of the resist material 4 is adhered to the surface thereof as shown in FIG.
］二記粉末状のソルダーレジスト材は、この実施例では
、単独で槽中を流動させているが、空気との混合物とし
て流動させてもよい。また、ツルターレジスト材４の付
着は、加熱により発現する同レジスト材４の粘着性を利
用してもよいし、配線板にあらかしめ低粘度レジンを塗
布して、その粘着性を利用するようにしてもよい。] In this example, the powdered solder resist material mentioned above is made to flow alone in the tank, but it may be made to flow as a mixture with air. Further, the adhesion of the Tsulter resist material 4 may be achieved by utilizing the adhesiveness of the resist material 4 developed by heating, or by coating the wiring board with a low-viscosity resin and utilizing its adhesiveness. You may also do so.
次に、ソルダーレジスト材４を付着させた配線板を加熱
槽に通して、同レジスト材４を溶融させ、第２図のよう
に、ソルダーレジスト膜５を形成する。Next, the wiring board to which the solder resist material 4 has been adhered is passed through a heating tank to melt the resist material 4 and form a solder resist film 5 as shown in FIG.
その後、レジス）−１１！２５を形成した配線板に、第
３図に示すよう［、所定パターンのマスクフィルム６を
合わせて露光し、引き続き現像して、第４図のように、
スルホール３やフラットバッド（図示せず）等の部分の
レジスト膜５を除去し、必要な導体部を露出させる。し
かるのち、残ったレジスト膜５を硬化させる。Thereafter, a mask film 6 of a predetermined pattern is exposed to light as shown in FIG.
The resist film 5 at portions such as through holes 3 and flat pads (not shown) is removed to expose necessary conductor parts. Thereafter, the remaining resist film 5 is cured.
次に作用を説明する。Next, the effect will be explained.
１記配線板は、流動している粉末状のソルダーレジスト
材４の中に１ｉ漬するので、その表面に前記レジスト材
４の粉末が均一に４１１着する。ソルダーレジスト膜５
は、この均一に付着したレジスト材４を溶融することに
よって形成されるのて、揮発分もボイドの巻込みもない
均質な１１ｑとなる。Since the wiring board 1 is immersed in the flowing powdered solder resist material 4, the powder of the resist material 4 is evenly deposited on its surface. Solder resist film 5
is formed by melting this uniformly adhered resist material 4, resulting in a homogeneous 11q without volatile matter or inclusion of voids.
また、その膜厚は、−′Ｙ滑部においても、パターンエ
ツジ部においても均一になる。したがって、ツルターレ
ジストｎＱ ５の耐フラツクス特性か安定する。Further, the film thickness is uniform both at the -'Y slip portion and at the pattern edge portion. Therefore, the flux resistance properties of the Tsulter resist nQ5 are stabilized.
また、配線板にソルダーレジスト材４の粉末を付着させ
てから溶融し、マスクフィルム６を使用ｌ２て不要部分
のレジスト膜５を露光、除去してから硬イヒさせる、と
いう一連の作業でソルダーレジスト１ｌｉ５を形成する
ことかできる。したかつ゛Ｃ１従来のスクリーン印刷技
術を使用しなくて済み、作文能率か向トする。In addition, the solder resist is formed by a series of operations in which powder of the solder resist material 4 is attached to the wiring board, melted, exposed using a mask film 6 to remove unnecessary portions of the resist film 5, and then hardened. 1li5 can be formed. Moreover, C1 does not require the use of conventional screen printing technology, which improves writing efficiency.
以ト説明し・たまうに、この発明によりば、導体パター
ンを形成した配線板を、感光性物質を含有し、かつ流動
する粉末状のソルダーレジスト材の中に浸漬し・て、そ
の表面に同レジスト材の粉末を付着させ、こわを溶融す
ることによフてツルダート、・シスト膜をつくり、その
うちの不要部分を露光し２て除去してから、硬化させる
ようにしたので、次の諸効果を得ることかてきる。As explained below, according to the present invention, a wiring board on which a conductive pattern is formed is immersed in a flowing powdered solder resist material containing a photosensitive substance, and the same is applied to the surface of the wiring board. By attaching the powder of the resist material and melting the stiffness, a dirt/cyst film is created, and the unnecessary parts of the film are exposed and removed before being cured, resulting in the following effects: You can get it.
＜１）膜厚が平滑部でもパターンエツジ部でも均一てあ
り、したかつて耐フラツクス特性の安定したソルダーレ
ジスト膜を得ることができる。<1) It is possible to obtain a solder resist film whose film thickness is uniform both in the smooth portion and the pattern edge portion, and which has stable flux resistance characteristics.
（２）また、揮発分ｂボイドの巻込みもない均質なツル
ターレジスト膜を得ることができる。(2) Furthermore, a homogeneous sulter resist film without inclusion of volatile b voids can be obtained.
（３）スクリーン印刷技術を使用しなくてよいのて、作
業陸生か向上する。(3) It is not necessary to use screen printing technology, which improves the operational efficiency.
第１図〜第４図は、この発明の一実施例による製造方法
の丁Ｐ？［図である。
１は基板、２は導体パターン、３はスルーホール、４は
粉末状のソルダーレジスト材、５はソルダーレジスト膜
、６はマスクフィルムである。
なお、図中、同一符号は同一または相当部分を示す。FIGS. 1 to 4 show a manufacturing method according to an embodiment of the present invention. [Fig. 1 is a substrate, 2 is a conductor pattern, 3 is a through hole, 4 is a powdered solder resist material, 5 is a solder resist film, and 6 is a mask film. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
性物質を含有し、かつ流動状態にある粉末状のソルダー
レジスト材の中に浸漬して、その表面に同レジスト材を
付着させる工程と、表面に付着したソルダーレジスト材
を溶融させて前記配線板の表面にソルダーレジスト膜を
形成する工程と、スルーホール，フラットパッド等の部
分のソルダーレジスト膜を露光して除去してからその他
の部分のソルダーレジスト膜を硬化させる工程とを有す
るプリント配線板の製造方法。immersing a wiring board with a conductor pattern formed on the surface of the substrate in a powdered solder resist material containing a photosensitive substance and in a fluid state to adhere the resist material to the surface; A process of melting the solder resist material adhering to the surface to form a solder resist film on the surface of the wiring board, and a process of exposing and removing the solder resist film in areas such as through holes and flat pads, and then forming a solder resist film in other areas. A method for manufacturing a printed wiring board, comprising the step of curing a solder resist film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9981288A JPH01270389A (en) | 1988-04-22 | 1988-04-22 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9981288A JPH01270389A (en) | 1988-04-22 | 1988-04-22 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01270389A true JPH01270389A (en) | 1989-10-27 |
Family
ID=14257267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9981288A Pending JPH01270389A (en) | 1988-04-22 | 1988-04-22 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01270389A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10242243B2 (en) * | 2015-10-06 | 2019-03-26 | Samsung Electro-Mechanics Co., Ltd. | Fingerprint sensor having printed circuit board and method of manufacture |
-
1988
- 1988-04-22 JP JP9981288A patent/JPH01270389A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10242243B2 (en) * | 2015-10-06 | 2019-03-26 | Samsung Electro-Mechanics Co., Ltd. | Fingerprint sensor having printed circuit board and method of manufacture |
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