JPH02294095A - Printed circuit board and manufacture thereof - Google Patents
Printed circuit board and manufacture thereofInfo
- Publication number
- JPH02294095A JPH02294095A JP11554489A JP11554489A JPH02294095A JP H02294095 A JPH02294095 A JP H02294095A JP 11554489 A JP11554489 A JP 11554489A JP 11554489 A JP11554489 A JP 11554489A JP H02294095 A JPH02294095 A JP H02294095A
- Authority
- JP
- Japan
- Prior art keywords
- film
- plating
- circuit conductor
- solder resist
- ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000007747 plating Methods 0.000 claims abstract description 78
- 239000004020 conductor Substances 0.000 claims abstract description 71
- 229910000679 solder Inorganic materials 0.000 claims description 59
- 239000007788 liquid Substances 0.000 claims description 33
- 238000007650 screen-printing Methods 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 19
- 238000011161 development Methods 0.000 claims description 14
- 238000007639 printing Methods 0.000 claims description 8
- 230000007423 decrease Effects 0.000 claims description 6
- 239000000126 substance Substances 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 description 30
- 238000000576 coating method Methods 0.000 description 30
- 238000000034 method Methods 0.000 description 18
- 230000015572 biosynthetic process Effects 0.000 description 11
- 239000010931 gold Substances 0.000 description 5
- 238000013007 heat curing Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000001723 curing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 1
- -1 Silver halide Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野〕
本発明は，フォトソルダーレジスト被膜及びその製造方
法．特に回路導体上に形成するフォトソルダーレジスト
被膜の形成及び該フォトソルダーレジスト被膜の形成方
法に関する．
〔従来技術〕
プリント配線板にあっては．その上に形成されている回
路導体を剥離や酸化から保護するために，回路導体の表
面にソルダーレジスト被膜を形成する必要がある．
近年のプリント配線板にあっては．その小型軽量化及び
高性能化の要望のもとに，回路導体等の高密度化を達成
する必要がある．このため，上記ソルダーレジスト被膜
についても精度よく形成できるようにするため，フォト
ソルダーレジスト被膜を形成することが行われている．
フォトソルダーレジスト被膜としては，ドライフィルム
タイプ．液状タイプが市販されている．上記ドライフィ
ルムタイプの場合は，回路導体幅及びその間隔が狭くな
るにしたがい，その表面凹凸へのレジストの追従性に問
題があり，またコストが高い．そのため，最近は，液状
タイプのものが主流となっている．
他方，プリント配線板にあっては，表面実装方式の普及
により−．ボンディングバッドを有するもの８外部接続
用のコネクタ端子を有するものが多い．そして，これら
は接続信転性を高めるため，フォトソルダーレジスト被
膜形成後，所望の回路導体部分（例えばボンディングパ
ッド部．コネクタ端子部）に，二ッケルー金めっき，錫
めっき，半田めっき等を施すことが要求される．しかし
て．上記従来法におけるフォトソルダーレジスト被膜の
形成は．第１５図〜１７Ｂ図に示す方法により行われて
いる．
即ち．まず第１６Ｂ図の下方に示すごとく，基材３上に
おいて５その左端部には回路導体としてのコネクタ端子
２を，中央付近には回路導体としてのパッド２５を設け
たプリント配線板を準備する。そして．該基材３の上面
に液状フォトソルダーレジストインク９０を全面塗布す
る．次いで，第１６Ａ図，第１６Ｂ図に示すごとく，そ
の上方に露光用マスク８を配置し，紫外線５８を照射し
．上記インク９０の重合を行なう。該露光用マスク８は
．コネクタ端子２の上方の１部を覆う紫外線不透過部８
１，パッド２５の上方を覆う紫外線不透過部８１を有し
，その間に露光部８４を脊する．
その後，現像．熱硬化を行なうことにより．第１７Ａ図
．第１７Ｂ図に示すごとく，フォトソルダーレジスト被
ＩＩ！９１を設けたプリント配線板を得る．即ち，コネ
クタ端子２上の１部分には．フォトソルダーレジスト被
膜９１の先端部９１１が被覆されている．また．パッド
２５の周囲は，間隙９１２を置いて上記被膜９１が形成
されている．しかして，上記先端部９１１は，第１５図
に示すごとく，コネクタ端子２の上方の一部分を被覆し
ている．また，コネクタ端子２は，上記先端部９１１の
前方に．めっき膜形成用の端部２１を有し，該端部２ｌ
には．めっき膜２８が形成される．そして先端部９１１
は，下方内方に向けて浸食された状態に形成されている
．それ故，先端部９１１と回路導体としてのコネクタ端
子２との接点であるめっきつきつけ部分９５は．アンダ
ーカットされた状態にある．
〔解決しようとする課題〕
しかしながら．液状タイプを用いて形成したフォトソル
ダーレジスト被膜においては，回路導体の端部２１に形
成するめっき膜とフォトソルダーレジスト被膜の先端部
９１１とが接触するめっきつきつけ部分９５のめっき耐
性が乏しい。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a photo solder resist film and a method for manufacturing the same. In particular, the present invention relates to the formation of a photo solder resist film to be formed on a circuit conductor and the method for forming the photo solder resist film. [Prior art] For printed wiring boards, it is necessary to form a solder resist film on the surface of the circuit conductors in order to protect the circuit conductors formed thereon from peeling and oxidation. In the case of wiring boards, it is necessary to achieve higher density of circuit conductors, etc. based on the demand for smaller size, lighter weight, and higher performance.For this reason, it is necessary to achieve high density formation of the solder resist film mentioned above. To achieve this, a photo solder resist film is formed. Dry film type and liquid type photo solder resist films are commercially available. In the case of the above dry film type, the circuit conductor width and its As the spacing becomes narrower, there are problems with the ability of the resist to follow the unevenness of the surface, and the cost is also high.Therefore, recently, liquid types have become mainstream.On the other hand, in printed wiring boards, Due to the spread of surface mount systems, many of them have bonding pads and connector terminals for external connections.In order to improve connection reliability, these devices can be mounted on the desired circuit after forming a photo solder resist film. It is required to apply nickel-gold plating, tin plating, solder plating, etc. to the conductor parts (for example, bonding pad parts, connector terminal parts).However, the formation of the photo solder resist film in the above conventional method is as follows.15. This is done by the method shown in Figures 17B to 17B.That is, first, as shown in the lower part of Figure 16B, the connector terminal 2 as a circuit conductor is placed on the base material 3 at its left end, and the circuit conductor is placed near the center. A printed wiring board provided with pads 25 as conductors is prepared. Then, a liquid photo solder resist ink 90 is applied to the entire upper surface of the base material 3. Next, as shown in FIGS. 16A and 16B, An exposure mask 8 is placed in the area, and ultraviolet rays 58 are irradiated to polymerize the ink 90.
1. It has an ultraviolet opaque part 81 that covers the upper part of the pad 25, and an exposed part 84 is placed in between. After that, develop. By heat curing. Figure 17A. As shown in Figure 17B, photo solder resist coating II! Obtain a printed wiring board provided with 91. That is, in one part on the connector terminal 2. The tip 911 of the photo solder resist film 91 is covered. Also. The coating 91 is formed around the pad 25 with a gap 912 in between. As shown in FIG. 15, the tip 911 covers a portion of the upper part of the connector terminal 2. Further, the connector terminal 2 is located in front of the tip portion 911. It has an end 21 for forming a plating film, and the end 2l
for. A plating film 28 is formed. and the tip 911
is formed by erosion downward and inward. Therefore, the plated contact portion 95, which is the contact point between the tip portion 911 and the connector terminal 2 as a circuit conductor. It is in an undercut condition. [Problem to be solved] However. In the photo solder resist film formed using a liquid type, the plating resistance of the plating contact portion 95 where the plating film formed on the end portion 21 of the circuit conductor and the tip portion 911 of the photo solder resist film come into contact is poor.
即ち，フォトソルダーレジスト被膜は基材及びその表面
の回路導体上に形成されるが，ここにフォトソルダーレ
ジスト被膜と基材とは両者が共に樹脂であるためその密
着性は強固である．しかし，回路導体とフォトソルダー
レジスト被膜とは異材料（金属と樹脂）であるため密着
性はそれ程強固でない。そのため．従来は，上記めっき
つきつけ部分９５において上記被膜と回路導体との間に
めっき膜形成時にめっき薬液が浸入し，両者間の密着性
を更に弱めるという問題がある．つまりめっき耐性が低
い．
その理由は．以下のごとくである．
すなわち．フォトソルダーレジスト被膜は．インクの全
面塗布，指触乾燥，マスクを通しての露光，現像，熱硬
化工程により形成される．しかして．フォトソルダーレ
ジスト被膜においては，現像工程後の被膜の先端部の縦
断面形状は第１５図の状態となる．つまり，被膜の内部
（導体回路に近い方）がカットされたアンダーカット形
状をとる．更に．第１５図のめっきつきつけ部分９５に
おいては．回路導体とフォトソルダーレジスト被膜の密
着性は弱い．
これは，液状フォトソルダーレジストインクは，光硬化
性である為，インクの光硬化は，はじめに紫外線が照射
される表層部にはじまり，順次内部に進んでい＜．シか
し．一度光硬化した部分は，紫外線を通しにくいため．
内部のインクの紫外線照射量は少な《なり，充分な光硬
化がなされないためである．その上．めっきつきつけ部
分９５は．現像液の浸食を受けているからである．以上
のごとく，現像工程後の被膜の先端部においては．アン
ダーカット形状及び弱い密着性という問題がある．
また．現像後この被膜は．熱硬化工程により．液状フォ
トソル．ダーレジストインクを構成する骨格樹脂（一般
的にはエポキシ樹脂）のＴｇ点（１００℃〜１２０℃）
以上にて加熱される．この時．第１に．インクを構成す
る樹脂の熱膨張率と，回路導体を形成する金属のそれと
は大きな差がある．第２に，被膜の硬化ひずみ（内部応
力）は，第１５図のめっきつきつけ部分９５にかかる．
そして．該めっきつきつけ部分９５に関しては．アンダ
ーカット形杖をとっている為，単位面積当たりのインク
量は，他の部分にくらべて多い．そのため，大きなひず
みがめつきつきつけ部分９５にかかることになる．以上
２つの理由により，熱硬化工程においては，フォトソル
ダーレジスト被膜と回路導体との間で．数ｐｍオーダー
の微小な剥離を生じる．
それ故，硬化後の液状フォトソルダーレジスト被膜は．
電解めっき及び無電解めっきを行った場合，めっきつき
つけ部分において，既に発生している微小な剥離部分か
ら．めっき薬液が浸みこみ，該被膜と回路導体間の密着
性を致命的な広い範囲で低下させることとなる．
他方，上記被膜形成後のめっき耐性を向上させるため．
インク中に密着向上剤を添加する試みが種々なされてい
る．
しかし．これら密着性向上剤は．それ自身が回路導体と
反応性が高く．現像時に完全に除去できない．さらに．
インクとの相溶性が悪く，インク中へ溶かし込まれるた
めに，溶解力の強い溶剤を使う必要が有り．スクリーン
印刷版及びスキージゴムを劣化させる等の問題を発生さ
せる．以上詳記したごとく，液状タイプのフォトソルダ
ーレジスト被膜を用いる場合には，前記のごとき利点が
ある反面．上記のごときめっき耐性上の諸問題がある．
本発明はかかる従来の問題点に鑑み．めっきつきつけ部
分のめっき耐性に優れた，プリント配線板，及びその製
造方法を提供しようとするものである．
〔課題の解決手段〕
本発明のプリント配線板は，基材表面の回路導体上にめ
っき膜形成用の端部を残してフォトソルダーレジスト被
膜を形成したプリント配線板において．該フォトソルダ
ーレジスト被膜の先端部は．回路導体における上記めっ
き膜形成用の端部に向、かってその膜厚が漸減する形状
を有することを特徴とするプリント配線板にある．
本発明のプリント配線板において最も注目すべきことは
．フォトソルダーレジスト被膜の先端部が２回路導体表
面に向かってその膜厚を減少させていることにある．つ
まり，上記先端部と回路導体とが接触するめっきつきつ
け部分において．フォトソルダーレジスト被膜の先端部
が回路導体の表面に向かって傾斜しながらその膜厚を小
さくしていることである．先端部のかかる形状は，フォ
トソルダーレジスト被膜用の液状インクを塗布する際に
形成しておく．
この先端部の傾斜角度は回路導体の表面に対して３０〜
８０度とすることが好ましい．３０度未満では，レジス
ト被膜としての性能（耐熱性）が不充分である．一方，
８０度を越えると照射光が上記被膜の先端部の下方（回
路導体に近い部分）まで充分に到達しないため，めっき
つきつけ部分のめっき耐性が低下するおそれがある．つ
まり．印刷された液状インクの下方まで光が到達し難い
．次に．上記プリント配線板の製造方法としては．回路
導体上に形成すべきフォトソルダーレジスト被膜の先端
部よりも内側方向までインク不透過部分を設けたスクリ
ーン印刷版を用いて．回路導体上に上記フォトソルダー
レジスト被膜用の液状インクを印刷し，次いで印刷部分
の先端部よりも外方まで露光部を形成した露光用マスク
を用いて光照射を行い，現像，硬化処理を行い．然る後
回路導体の端部にめっき膜を形成することを特徴とする
プリント配線板の製造方法がある．
本方法において，注目すべきことは，フォトソルダーレ
ジスト被膜の先端部とスクリーン印刷版と露光用マスク
との位置関係である．
つまり，スクリーン印刷版は．形成しようとするフォト
ソルダーレジスト被膜の先端部よりも内側方向までイン
ク不透過部分を設けてある．換言すれば スクリーン印
刷版におけるインクの透過部分が，形成すべきフォトソ
ルダーレジスト被膜の先端部まで設けてなく．その内側
までしか形成されていない．上記インク不透過部分は，
乳剤を塗布することなどにより形成する．
また．ｎ光用マスクに関しては，回路導体上に印刷され
たインクの先端部よりも外方まで露光部が形成されてい
る．換言すれば．該露光用マスクは上記被膜の先端部が
充分に紫外線等の光を受けることができるように，構成
してある．また，上記先端部と露光部端部まではＯ．１
〜０．２ｍとすることが好ましい．
また．上記光照射後は，常法により，光照射しなかった
被膜不要部分を除去する現像処理，フォトソルダーレジ
スト被膜の硬化処理（加熱）を行い．その後回路導体の
端部にめっき膜を形成する．上記フォトソルダーレジス
ト被膜用の液状インクとしては．アクリル変性エボキシ
樹脂等の感光基を有する熱硬化樹脂系をベースとしたも
のがある．また，その性状として，粘度は１００ｐｓ〜
１０００ｐｓのものを用いることが好ましい．１００ｐ
ｓ以下では．印刷部分の厚みが薄《なるからであり，１
０００ｐｓ以上では，隣接する回路導体間への液状フォ
トソルダーレジスト被膜の埋設性に問題が発生するから
である。なお，更に好ましくは３００ｐｓ〜５００ｐｓ
である．更に，インクとしては，非ニュートン流体であ
ることが望ましい．ニュートン流体である場合，レベリ
ング性が大きい為，めっきつきつけ部分におけるインク
の流れこみ量は．回路導体の起伏（回路導体の高さのバ
ラツキ）に影響される．そのため．流れこみ量の制御が
難しく，めっきつきつけ部分におけるスクリーン印刷版
の乳剤塗布部分と露光用マスクの光不透過部分との間の
クリアランスの設定が困難となるからである．インク塗
布用のスクリーン印刷版の材質としては，合成樹脂，メ
タル等が使用可能である．露光用マスクとしては，銀塩
フィルム．ジアゾフィルム等が使用可能である．
本発明に適用される，めっき膜としては，電解ニッケル
ー金め一つき，無電解ニッケルー金めつき電解銅めっき
，無電解銅めっき．電解錫めっき，無電解錫めっき．電
解半田めっき等がある．なお，本発明のフォトソルダー
レジスト被膜及びその製造方法においては，前記めっき
つきつけ部分における，フォトソルダーレジスト被膜の
先端部の形状，また該先端部とスクリーン印刷版及び露
光用マスクとの関係に関する構成を前記要件とするもの
であり，実施例に示すごとく，め゜っきつきつけ部分以
外の部分における先端部の形状，先端部とスクリーン印
刷版，ｎ光用マスクとの関係は任意である．即ち，めっ
きつきつけ部分以外の部分に関しては，本発明と同様で
あっても，従来のままであっても良い。That is, the photo solder resist film is formed on the base material and the circuit conductor on its surface, and since both the photo solder resist film and the base material are made of resin, their adhesion is strong. However, since the circuit conductor and the photo solder resist film are made of different materials (metal and resin), their adhesion is not very strong. Therefore. Conventionally, there is a problem in that a plating chemical solution enters between the coating film and the circuit conductor at the plating contact portion 95 during the formation of the plating film, further weakening the adhesion between the two. In other words, plating resistance is low. The reason is. It is as follows. In other words. Photo solder resist coating. It is formed by applying ink to the entire surface, drying to the touch, exposing to light through a mask, developing, and heat curing. However. In the photo solder resist film, the vertical cross-sectional shape of the tip of the film after the development process is as shown in Figure 15. In other words, the inside of the film (closer to the conductor circuit) takes on an undercut shape. Furthermore. In the plating portion 95 in FIG. The adhesion between the circuit conductor and the photo solder resist film is weak. This is because the liquid photo solder resist ink is photo-curable, so the photo-curing of the ink begins at the surface layer where ultraviolet rays are irradiated and then progresses to the inside. Shikashi. Once photo-cured, UV rays do not easily pass through the area.
This is because the amount of ultraviolet rays irradiated to the internal ink is small, and sufficient photocuring is not achieved. On top of that. The plated contact portion 95 is. This is because it is being eroded by the developer. As mentioned above, at the tip of the film after the development process. There are problems with undercut shape and weak adhesion. Also. After development, this film looks like this. By heat curing process. Liquid photosol. Tg point (100°C to 120°C) of the skeleton resin (generally epoxy resin) that constitutes the dark resist ink
It is heated above. At this time. Firstly. There is a big difference in the coefficient of thermal expansion of the resin that makes up the ink and that of the metal that makes up the circuit conductor. Second, the hardening strain (internal stress) of the coating is applied to the plating contact portion 95 in FIG.
and. Regarding the plated contact portion 95. Because it has an undercut cane, the amount of ink per unit area is larger than other parts. Therefore, a large strain will be applied to the abutting portion 95. Due to the above two reasons, during the heat curing process, there is a risk of damage between the photo solder resist film and the circuit conductor. This causes minute peeling on the order of several pm. Therefore, the liquid photo solder resist coating after curing.
When electrolytic plating or electroless plating is performed, from minute peeling parts that have already occurred on the plated areas. The plating chemical solution will seep in, fatally reducing the adhesion between the coating and the circuit conductor over a wide range. On the other hand, to improve the plating resistance after forming the above film.
Various attempts have been made to add adhesion improvers to ink. but. These adhesion improvers are. It is highly reactive with circuit conductors. It cannot be completely removed during development. moreover.
It has poor compatibility with ink and requires the use of a strong solvent in order to dissolve into the ink. This causes problems such as deterioration of the screen printing plate and squeegee rubber. As detailed above, when using a liquid type photo solder resist film, there are advantages as mentioned above, but on the other hand. There are various problems with plating resistance as mentioned above. The present invention has been developed in view of these conventional problems. The purpose of this paper is to provide a printed wiring board with excellent plating resistance in the plating contact area, and a method for manufacturing the same. [Means for Solving the Problems] The printed wiring board of the present invention is a printed wiring board in which a photo solder resist film is formed on the circuit conductor on the surface of the base material, leaving edges for forming the plating film. The tip of the photo solder resist film is. The printed wiring board is characterized in that the circuit conductor has a shape in which the film thickness gradually decreases toward the end portion where the plating film is formed. The most noteworthy thing about the printed wiring board of the present invention is: The reason is that the thickness of the tip of the photo solder resist film decreases toward the surface of the two-circuit conductor. In other words, at the plating contact portion where the tip and the circuit conductor contact. The tip of the photo solder resist film is tilted toward the surface of the circuit conductor, reducing its thickness. The shape of the tip is created when applying the liquid ink for the photo solder resist film. The angle of inclination of this tip is 30~30° with respect to the surface of the circuit conductor.
Preferably, the angle is 80 degrees. If the temperature is less than 30 degrees, the performance (heat resistance) as a resist film is insufficient. on the other hand,
If the angle exceeds 80 degrees, the irradiation light will not fully reach the lower part of the tip of the coating (the part near the circuit conductor), which may reduce the plating resistance of the plating contact area. In other words. It is difficult for light to reach below the printed liquid ink. next. The method for manufacturing the above printed wiring board is as follows. Using a screen printing plate with an ink-impermeable part extending inward from the tip of the photo solder resist film to be formed on the circuit conductor. The liquid ink for the photo solder resist film is printed on the circuit conductor, and then light is irradiated using an exposure mask with an exposed area extending beyond the tip of the printed area, followed by development and curing. ．． There is a method for manufacturing printed wiring boards characterized by subsequently forming a plating film on the ends of the circuit conductors. What should be noted in this method is the positional relationship between the tip of the photo solder resist film, the screen printing plate, and the exposure mask. In other words, the screen printing version. An ink-impermeable part is provided to the inside of the tip of the photo solder resist film to be formed. In other words, the ink permeable part of the screen printing plate does not reach the tip of the photo solder resist film to be formed. It is only formed to the inside. The above ink impermeable part is
It is formed by applying an emulsion. Also. Regarding the n-light mask, the exposed area is formed outward from the tip of the ink printed on the circuit conductor. In other words. The exposure mask is constructed so that the tip of the coating can receive sufficient light such as ultraviolet rays. Also, the distance between the above tip and the end of the exposure section is O. 1
It is preferable to set it to ~0.2m. Also. After the above-mentioned light irradiation, a development process is performed to remove unnecessary parts of the film that were not irradiated with light, and a hardening process (heating) of the photo solder resist film is performed using conventional methods. A plating film is then formed on the ends of the circuit conductor. As a liquid ink for the above photo solder resist film. Some are based on thermosetting resins with photosensitive groups, such as acrylic-modified epoxy resins. In addition, as for its properties, the viscosity is 100 ps~
It is preferable to use one with 1000 ps. 100p
Below s. This is because the thickness of the printed part is thin, and 1
000 ps or more, problems occur in the embedding of the liquid photo solder resist film between adjacent circuit conductors. In addition, more preferably 300 ps to 500 ps
It is. Furthermore, it is desirable that the ink be a non-Newtonian fluid. In the case of Newtonian fluid, the leveling property is large, so the amount of ink flowing into the part where the plating is applied is . It is affected by the undulations of the circuit conductors (variations in the height of the circuit conductors). Therefore. This is because it is difficult to control the amount of inflow, and it is difficult to set the clearance between the emulsion-coated part of the screen printing plate and the light-opaque part of the exposure mask in the plating area. Synthetic resin, metal, etc. can be used as the material for the screen printing plate for ink application. Silver halide film is used as an exposure mask. Diazo film etc. can be used. The plating films applied to the present invention include electrolytic nickel-gold plating, electroless nickel-gold plating, electrolytic copper plating, and electroless copper plating. Electrolytic tin plating, electroless tin plating. Examples include electrolytic solder plating. In addition, in the photo solder resist film and the manufacturing method thereof of the present invention, the configuration regarding the shape of the tip of the photo solder resist film in the plated portion and the relationship between the tip and the screen printing plate and the exposure mask is determined. The above requirements are met, and as shown in the examples, the shape of the tip in areas other than the plated portion and the relationship between the tip, the screen printing plate, and the n-light mask are arbitrary. That is, the parts other than the plated parts may be the same as the present invention or may be the same as the conventional one.
本発明のプリント配線板においては，フォトソルダーレ
ジスト被膜の先端部が前記めっきつきつけ部分に向かっ
て傾斜している．そのため，紫外線等の光照射時に該先
端部に充分に光が照射される．それ故，該先端部も充分
に光硬化が行われ現像時に該先端部及びその下面側が現
像液によってエッチングされることがない．そのため，
めっき膜形成時に，めっきつきつけ部分から被膜と回路
導体との間にめっき薬液が浸入することもない。In the printed wiring board of the present invention, the tip of the photo solder resist film is inclined toward the plating portion. Therefore, when irradiating light such as ultraviolet rays, the tip is sufficiently irradiated with light. Therefore, the tip portion is also sufficiently photocured, and the tip portion and its lower surface are not etched by the developer during development. Therefore,
During the formation of the plating film, the plating chemical solution will not infiltrate between the film and the circuit conductor from the plating contact area.
また，本発明の前記製造方法においては，スクリーン印
刷版はそのインク不透過部分が，形成しようとするフォ
トソルダーレジスト被膜の先端部より内側まで設けてあ
る。そのため，該スクリーン印刷版により印刷された液
状インクの先端部は，印刷直後においては上記被膜の先
端部まで設けられていない．
しかし，該液状インクは流動性を有するため．先端部に
向かって流れ，所望する被膜先端部まで到達する．なお
，そのためインク不透過部分は使用する液状インクの流
動性を考慮して，その大きさを定めることとなる．
しかして．上記流動により．被膜用インクの先端部はめ
っきつきつけ部分に向かってその膜厚が減少する傾斜状
を呈することとなる．
次に，前記露光用マスクを用いて上記印刷された液状イ
ンクに光照射を行なう．該露光用マスクは，その露光部
が．インク印刷部分の先端部より外方まで設けてあり，
かつインク印刷部分の先端部は上記傾斜状を有している
ため，該先端部には充分に光照射が行われる．
光照射後は，通常の方法により現像．硬化処理．めっき
膜形成を行なう．
〔効果〕
本発明によれば．フォトソルダーレジスト被膜の先端部
はめっきつきつけ部分に向かってその膜厚が減少してい
るため．露光時の光照射が該先端部の下方まで充分に到
ずる．そのため，該先端部は，充分に光硬化され２上記
被膜と回路導体との密着性は強固である．
また．先端部におけるめっきつきつけ部分の被膜は膜厚
が小さいので，この部分の単位面積当たりのインク量は
他の部分に比して少ない．そのため．熱硬化時等におい
て．被膜と回路導体との間の剥離も発生しない．
したがって．硬化後において回路導体の端部にめっき膜
を形成する場合．フォトソルダーレジスト被膜と回路導
体との間にめっき薬液が浸入することもない．
また．インク塗布の際にインクのにじみ，飛び散り等に
よって被膜不要部分にインクが付着した場合においても
．かかるインクは露光用マスクによって覆われ露光され
ないので．現像時に容易に除去することができる．
したがって．本発明によれば，めっきつきつけ部分のめ
っき耐性に優れたプリント配線板を提供することができ
る．また，前記方法によればかかる優れたプリント配線
板を製造することができる．〔実施例〕
第１実施例
本発明の実施例にかかるプリント配線板及びその製造方
法につき，第１図〜第６Ｂ図を用いて説明する．
本例のプリント配線板は．メモリーモジュール用プリン
ト配線板である（第３Ａ図，第３Ｂ図）．しかして，該
プリント配線板は．フォトソルダーレジスト被膜形成前
は，第３Ａ図．第３Ｂ図に示すごとく．基材３と．その
表面上においてその端部（左方）に設けた回路導体とし
てのコネクタ端子２と．基材３の表面の中央付近に設け
た回路導体としてのパッド２５とよりなる．上記コネク
タ端子２は．第２図に示すごとくフォトソルダーレジス
ト被膜ｌの硬化後，Ｎｉ−Ａｕめっき２８を施す端子で
ある．一方．パッド２５は．半導体搭載用パッケージの
表面実装用パッドであり．この部分はＮｉ−Ａｕめっき
は施さない部分である．次に．上記プリント配線板にフ
ォトソルダーレジスト被膜を形成し．その後めっき膜を
形成する工程につき説明する．なお．以降においては．
フォトソルダーレジスト被膜は．単に「被膜」と称する
．また．該被膜を形成するための液状フォトソルダーレ
ジストインクは「液状インク」と称し，該液状インクが
印刷された部分は印刷部分と称する．したがって．印刷
部分が露光．現像．硬化されたものが被膜となり．該被
膜と回路導体との接点部会がめつきつきつけ部分である
。Further, in the manufacturing method of the present invention, the ink-impermeable portion of the screen printing plate extends to the inner side of the tip of the photo solder resist film to be formed. Therefore, the leading edge of the liquid ink printed by the screen printing plate does not reach the leading edge of the coating immediately after printing. However, since the liquid ink has fluidity. It flows toward the tip and reaches the desired coating tip. For this reason, the size of the ink-impermeable area must be determined by considering the fluidity of the liquid ink used. However. Due to the above flow. The tip of the coating ink exhibits an inclined shape in which the film thickness decreases toward the plating contact area. Next, the printed liquid ink is irradiated with light using the exposure mask. The exposure mask has an exposed area. It is provided from the tip of the ink printing part to the outside,
In addition, since the tip of the ink-printed portion has the above-mentioned slope, the tip is sufficiently irradiated with light. After irradiation with light, develop using the usual method. Hardening treatment. Form the plating film. [Effect] According to the present invention. This is because the thickness of the tip of the photo solder resist film decreases toward the plating contact area. The light irradiation during exposure reaches sufficiently below the tip. Therefore, the tip is sufficiently photocured and the adhesion between the above-mentioned coating and the circuit conductor is strong. Also. Since the film thickness of the plating contact area at the tip is small, the amount of ink per unit area in this area is smaller than in other areas. Therefore. During heat curing, etc. No peeling occurs between the coating and the circuit conductor. therefore. When forming a plating film on the edge of a circuit conductor after curing. There is no chance of plating chemicals entering between the photo solder resist film and the circuit conductor. Also. Even if the ink adheres to areas that do not require a coating due to ink bleeding or scattering during ink application. This ink is covered by the exposure mask and is not exposed to light. It can be easily removed during development. therefore. According to the present invention, it is possible to provide a printed wiring board with excellent plating resistance in the plating portion. Further, according to the method described above, such an excellent printed wiring board can be manufactured. [Embodiments] First Embodiment A printed wiring board and a manufacturing method thereof according to an embodiment of the present invention will be explained with reference to FIGS. 1 to 6B. The printed wiring board in this example is. This is a printed wiring board for memory modules (Figures 3A and 3B). However, the printed wiring board... Figure 3A before photo solder resist film formation. As shown in Figure 3B. Base material 3 and. A connector terminal 2 as a circuit conductor is provided on the surface at the end (left side). It consists of a pad 25 as a circuit conductor provided near the center of the surface of the base material 3. The above connector terminal 2 is. As shown in FIG. 2, this is a terminal to which Ni-Au plating 28 is applied after the photo solder resist film 1 is cured. on the other hand. Pad 25 is. This is a surface mounting pad for semiconductor mounting packages. This part is not coated with Ni-Au plating. next. A photo solder resist film is formed on the printed wiring board. After that, we will explain the process of forming the plating film. In addition. In the following.
Photo solder resist coating. It is simply called a "coat." Also. The liquid photo solder resist ink for forming the film is called "liquid ink," and the area printed with the liquid ink is called the printed area. therefore. The printed part is exposed. developing. The hardened material becomes a film. The contact portion between the coating and the circuit conductor is the mating portion.
しかして，第３Ａ図．第３Ｂ図に示した前記プリント配
線板に液状インクを印刷するためのスクリーン印刷版４
は，第４Ａ図．第４Ｂ図に示すごとく．インク不透過部
分４１とインクを透過させて印刷するインク通過部４２
とを有する．そして．上記インク不透過部分４ｌは，第
４Ｂ図に示すごと《，基材３上に設けた前記コネクタ端
子２上方の１部分に位置するよう構成されている．即ち
，コネクタ端子２上に形成すべき被膜の先端部１２（第
２図）よりも内側方向までインク不透過部分４１が設け
られ．その内方部にインク通過部４２がある．
なお．スクリーン印刷板４の他の部分はパッド２５の部
分も含めて被膜を形成する為．インク不遇部分４１は設
けられていない．
次に．上記プリント配線板上に，第４Ｂ図に示すごとく
，スクリーン印刷版４を配置し，次いで液状インクを用
いてスクリーン印刷を行なう。これにより，第１図．第
５Ｂ図に示すごとく，コネクタ端子２の端部２１を除い
て，上面が液状インクの印刷部分ＪＯによって被覆され
たプリント配線板を得る．上記の端部２１は５めっき膜
形成川端部である．
次に．上記プリント配線仮の上方に．第５Ａ図，第５Ｂ
図．第１図に示すごとく．ｎ光用マスク５を配置する．
該露光用マスク５は，左端及び中央部に紫外線不透過部
５１．５４を有する．該紫外線不透過部５ｌは．液状イ
ンクの印刷部分１０における先端部１２よりも外方に位
置するよう設けてある．また．紫外線不透過部５４は，
プリント配線板の中央に設けた６個のパッド２５の上方
及び周縁に位置している．その他は露光部５２を形成し
ている．
また．第１図は上記したスクリーン印刷版４ｎ充用マス
ク５とプリント配線板上の印刷部分ｌＯの先端部１２と
の位置関係を示している．第１図に示すごとく．インク
不透過部分４ｌの内方と印刷部分ｌＯの先端部ｌ２とは
長さ２ｌの，また紫外線不透過部５１の内方と印刷部分
ＩＯの先端部ｌ２とは長さｆ２の距離がある．ここに．
ｌ１は約０．３ａ＋ａ，１２は約０．４５ａｎである。However, Fig. 3A. Screen printing plate 4 for printing liquid ink on the printed wiring board shown in FIG. 3B
is shown in Figure 4A. As shown in Figure 4B. An ink-impermeable portion 41 and an ink passage portion 42 that allows ink to pass through for printing.
It has and. The ink-impermeable portion 4l is configured to be located in a portion above the connector terminal 2 provided on the base material 3, as shown in FIG. 4B. That is, the ink-impermeable portion 41 is provided to the inner side of the tip 12 (FIG. 2) of the coating to be formed on the connector terminal 2. There is an ink passage section 42 in the inner part thereof. In addition. The other parts of the screen printing plate 4, including the pad 25, are coated with a film. The ink-unfavorable portion 41 is not provided. next. A screen printing plate 4 is placed on the printed wiring board as shown in FIG. 4B, and then screen printing is performed using liquid ink. As a result, Figure 1. As shown in FIG. 5B, a printed wiring board is obtained, the upper surface of which is covered with the liquid ink printed portion JO, except for the end portion 21 of the connector terminal 2. The above end portion 21 is the end portion where the 5 plating film is formed. next. Above the tentative printed wiring above. Figure 5A, Figure 5B
figure. As shown in Figure 1. Place the n-light mask 5.
The exposure mask 5 has ultraviolet opaque parts 51 and 54 at the left end and center. The ultraviolet opaque portion 5l is . It is provided so as to be located outward from the tip 12 of the liquid ink printed portion 10. Also. The ultraviolet opaque portion 54 is
It is located above and around the six pads 25 provided in the center of the printed wiring board. The rest forms an exposed portion 52. Also. FIG. 1 shows the positional relationship between the above-mentioned screen printing plate 4n filling mask 5 and the tip 12 of the printed portion 10 on the printed wiring board. As shown in Figure 1. There is a distance of 2l between the inside of the ink-opaque portion 4l and the tip l2 of the printed portion IO, and a distance of f2 between the inside of the ultraviolet opaque portion 51 and the tip l2 of the printed portion IO. Here.
l1 is approximately 0.3a+a, and 12 is approximately 0.45an.
しかして．上記露光用マスク５は．第１図．第５Ｂ図に
示すごとく位置させて．紫外線５日を照射し，印刷部分
１０を光重合させる。そして．現像処理を施す（図示せ
ず）．これにより，光照射された部分の液状インクが除
去される．その後加熱により印刷部分１０を熱硬化させ
て被膜を形成し，更に通常の方法により該被膜上にめっ
きマスクを形成する．
第６Ａ図５第６Ｂ図は，このようにして得たプリント配
線板を示している．即ち，該プリント配線板は，コネク
タ端子２のめっき膜形成用の端部２ｌと，これに隣接す
る被膜ｌの先端部分とを除いて，その上面全体にめっき
マスク６０が設けてある．また．パッド２５，２５．２
５の間には，間隔を置いて，被膜ｌが形成されている．
上記のごとく構成されたプリント配線板は．上記コネク
タ端子２の端部２ｌに，電解メッキによりＮｉ−Ａｕの
めっき膜２８を施した（第２図参照）．
しかして．上記において，第１図及び第２図に示すごと
く，回路導体としてのコネクタ端子２上に設けた被膜ｌ
は．その先端部ｌ２がめつきつきつけ部分１５に向かっ
てその膜厚みを減少させているので，先端部ｌ２の下面
まで充分に紫外線が到達する．そのため．液状インクの
印刷部分１０の該先端部ｌ２が現像時に侵食されること
がな《．被膜１とコネクタ端子２とが強固に接着する．
また．該先端部１２は，傾斜１１を有して膜厚みを減少
させているので，先端部１２の膜厚が薄く，熱硬化時に
コネクタ端子２より剥離することがない．
したがって．めっきつきつけ部分１５のめっき耐性に優
れたプリント配線仮を得ることができる。However. The exposure mask 5 is . Figure 1. Position it as shown in Figure 5B. The printed portion 10 is photopolymerized by irradiation with ultraviolet light for 5 days. and. Perform development processing (not shown). This removes the liquid ink from the area that was irradiated with light. Thereafter, the printed portion 10 is thermally cured by heating to form a film, and a plating mask is further formed on the film by a conventional method. Figure 6A and Figure 6B show the printed wiring board obtained in this way. That is, the printed wiring board is provided with a plating mask 60 over its entire upper surface, except for the end 2l of the connector terminal 2 for forming the plating film and the tip of the coating l adjacent thereto. Also. Pad 25, 25.2
5, a coating l is formed at intervals.
The printed wiring board configured as above. A Ni-Au plating film 28 was applied to the end 2l of the connector terminal 2 by electrolytic plating (see Fig. 2). However. In the above, as shown in FIGS. 1 and 2, the coating l provided on the connector terminal 2 as a circuit conductor
teeth. Since the film thickness of the tip l2 decreases toward the mating portion 15, the ultraviolet rays sufficiently reach the lower surface of the tip l2. Therefore. The leading end l2 of the liquid ink printed portion 10 is not eroded during development. The coating 1 and the connector terminal 2 are firmly bonded.
Also. Since the tip portion 12 has the slope 11 to reduce the film thickness, the film thickness of the tip portion 12 is thin and does not peel off from the connector terminal 2 during thermosetting. therefore. It is possible to obtain a printed wiring temporary with excellent plating resistance of the plating contact portion 15.
また，上記において．液状インクとしては．溶剤現像タ
イプのＰＳＲ−１０００ （太陽インク■製）を用いた
．また．印刷部分ＩＯを形成した後のＩ旨触乾燥は約８
０“Ｃで行った．また，ｎ光世は８００ｍｊ／ｃ＋１と
した．現像はスプレー現像，硬化は１５０’Ｃ，６０分
間行った，Ｎｉ −Ａｕめっきの膜厚はＮ＋が約５μｍ
，Ａｕが杓０，５μｍであった．
次に．めっき膜形成後，めっきつきつけ部分の接合強度
を検査するため，ＪＩＳ−２１５２２に規定するセロフ
ァン粘着テープを．上記めっきつきつけ部分の方向に向
けて完全に付着させ，直ちにテープの一端を，プリント
配線板面に直角に保ち，瞬間的に引っ張った．そして，
上記粘着テープの粘着面を顕微鏡（４０倍）にて観察し
た．その結果．被膜の付着は何ら見られず．被膜１とコ
ネクタ端子２との密着性は極めて良好であることが確認
された．
第２実施例
本例は、第７Ａ図〜第１０Ｂ図に示すごとく，半導体搭
載用パッケージの表面実装型プリント配線板に本発明を
適用したものである．
まず，本例における被膜を形成した状態のプリント配線
板は．第１０Ａ図及び第１０Ｂ図に示すごとく，基材３
上に．半導体表面実装用の，回路導体としてのパッド２
６を有し．該パッド２６の外方及び内方に．被膜ｌを設
けたものである．そして．パッド２６の外方先端部２６
１は被膜ｌの先端部ｌ２によって覆われ．両者の接点部
がめつきつきつけ部分１５を形成する．また．パッド２
６の内方は．該パッド２６と間隔２６２をおいて被膜１
を有している．
次に．上記プリント配線板を形成するための基本プリン
ト配線板は．第７Ａ図，第７Ｂ図に示すごとく，基材３
上に．パッド２６を３個づつ四方向に有する．
そして．該基本プリント配線板に液状インクを印刷する
ためのスクリーン印刷版４は，第８Ａ図，第８Ｂ図に示
すごとく．インク不透過部分４３とインク通過部４２と
を有する．インク不透過部分４３は．パッド２６の外端
部２６１の上方に位置するよう構成してある．そして．
該インク不透過部分４３の内側面４３２，４３２と外側
面４３１．４３１は，形成すべき被Ｈｌ （第１０Ａ図
．第ｌＯＢ図）よりも内方にある．しかして，該スクリ
ーン印刷版４によって印刷される印刷部分ｌＯは，第９
Ｂ図に示すごとく，パッド２６の外端部２６ｌの１部を
残して形成されている．即ち．印刷部分１０の先端部１
２．１２の間に間隔がある．しかして，第９Ａ図．第９
Ｂ図に示すごとく．露光用マスク５は．紫外線不透過部
５５と露光部５２とを有する．紫外線不透過部５５は，
パッド２６の上方に位！するよう構成されている．そし
て．紫外線不透過部５５の内側面５５２はパッド２６よ
りも内方にあり．その外側面５５１はパンド２６の外端
部２６１の上方にあり．印刷部分ｌＯの先端部１２．１
２の中間部分に位置している．それ故．該露光用マスク
５を用いて紫外線照射を行い．現像．熱硬化処理を経て
得られたプリント配線板は，前記第１０Ａ図．第１０Ｂ
図に示すごとき形状となる（前記参照）．その他の構成
作用は第１実施例と同様である．
しかして．本例により得られたプリント配線板は．第１
実施例と同様の効果を有する．第３実施例
本例は．第１１Ａ図〜第１４Ｂ図に示すごと《，パート
リーアディティプ法によるプリント配線板に．本発明を
適用したものである．
即ち，該プリント配線板は，サブトラクティプ法により
外層回路導体を形成した後，液状インクの印刷を行い．
その後スルーホール部分のみ．無電解銅メッキを行うこ
とにより．導体化するものである．
まず．本例において得られる被膜を形成した状態のプリ
ント配線板は．第１４Ａ図，第１４８図に示すごとく．
基材３にスルーホール３５を設け，該スルーホールの上
方に環状の回路導体２７を設け．下方には同様の回路導
体２９を設けたものである．そして．該回路導体２９の
先端部２７１側にはめっき形成用の端部２７０を残して
被膜１を被覆し．環伏の本体の周囲には間隙２７２を隔
てて６基材３上に被膜ｌを被覆したものである．そして
．上記めっき形成用の端部２７０と被膜ｌの先端部ｌ２
との接点部にめっきつきつけ部分ｌ５を有する．
次に，上記プリント配線板を形成するための基本プリン
ト配線板は，第１１Ａ図．第１１Ｂ図に示すごとく，基
材３にスルーホール３５を穿設し，該スルーホール３５
の上方に前記回路導体２７．下方に回路導体２９を存す
る．回路導体２９は先端部２９１を有する．
次に．液状インク印刷用のスクリーン印刷版４は，第１
２Ａ図．第１２Ｂ図に示すごとく．回路導体２７の上方
の一部に位置するインク不透過部分４４を有する．！１
Ｆインク不透過部分４４の左側面４４１は回路導体２７
の先端部２７１上にあり右端面４４２は回路導体２７本
体の上方にある．そして，上記スクリーン印刷版４によ
って形成された液状インクの印刷部分１０は．第１３図
に示すごとく，その先端部ｌ２が回路導体２７の先端部
２７１を被覆しており，また回路導体２７本体は印刷部
分１０によって被覆されている。Also, in the above. As a liquid ink. A solvent-developed type PSR-1000 (manufactured by Taiyo Ink ■) was used. Also. The drying time after forming the printed part IO is about 8
0"C. Also, the n light age was set to 800mj/c+1. Development was done by spray development and curing was done at 150'C for 60 minutes. The film thickness of the Ni-Au plating was approximately 5μm for N+.
, Au was 0.5 μm thick. next. After forming the plating film, in order to test the bonding strength of the plating area, we used cellophane adhesive tape specified in JIS-21522. The tape was completely adhered in the direction of the plating area mentioned above, and immediately one end of the tape was held perpendicular to the printed wiring board surface and pulled momentarily. and,
The adhesive surface of the above adhesive tape was observed under a microscope (40x magnification). the result. No film adhesion was observed. It was confirmed that the adhesion between coating 1 and connector terminal 2 was extremely good. Second Embodiment In this embodiment, the present invention is applied to a surface-mounted printed wiring board for a semiconductor mounting package, as shown in FIGS. 7A to 10B. First, the printed wiring board with the film formed in this example is as follows. As shown in FIGS. 10A and 10B, the base material 3
above. Pad 2 as a circuit conductor for semiconductor surface mounting
It has 6. outside and inside the pad 26. A coating l is provided. and. Outer tip 26 of pad 26
1 is covered by the tip l2 of the coating l. Both contact portions form a mating portion 15. Also. pad 2
The inside of 6 is. The coating 1 is spaced apart from the pad 26 by a distance 262.
have. next. The basic printed wiring board for forming the above printed wiring board is. As shown in Figures 7A and 7B, the base material 3
above. It has three pads 26 in each of the four directions. and. The screen printing plate 4 for printing liquid ink on the basic printed wiring board is as shown in FIGS. 8A and 8B. It has an ink impermeable part 43 and an ink passage part 42. The ink-impermeable portion 43 is. It is configured to be located above the outer end 261 of the pad 26. and.
The inner surfaces 432, 432 and outer surfaces 431, 431 of the ink-impermeable portion 43 are located inward from the target H1 to be formed (FIG. 10A, FIG. 1OB). Therefore, the printed portion lO printed by the screen printing plate 4 is the ninth
As shown in Figure B, the pad 26 is formed with a portion of the outer end 26l remaining. That is. Tip part 1 of printed part 10
There is an interval between 2.12. However, Fig. 9A. 9th
As shown in Figure B. The exposure mask 5 is . It has an ultraviolet opaque section 55 and an exposed section 52. The ultraviolet opaque portion 55 is
Placed above pad 26! It is configured to do so. and. The inner surface 552 of the ultraviolet opaque portion 55 is located further inward than the pad 26. Its outer surface 551 is above the outer end 261 of the pan 26. Tip 12.1 of printed part IO
It is located in the middle of 2. Therefore. Ultraviolet rays are irradiated using the exposure mask 5. developing. The printed wiring board obtained through the thermosetting treatment is shown in FIG. 10A above. 10th B
The shape will be as shown in the figure (see above). Other structural functions are the same as in the first embodiment. However. The printed wiring board obtained in this example is. 1st
It has the same effect as the example. Third Embodiment This example is. As shown in FIGS. 11A to 14B, printed wiring boards were produced using the part-time additive method. This is an application of the present invention. That is, the printed wiring board is produced by forming an outer layer circuit conductor by a subtractive method and then printing liquid ink.
After that, only the through hole part. By performing electroless copper plating. It is made into a conductor. first. The printed wiring board with the coating obtained in this example is as follows. As shown in Figures 14A and 148.
A through hole 35 is provided in the base material 3, and an annular circuit conductor 27 is provided above the through hole. A similar circuit conductor 29 is provided below. and. The circuit conductor 29 is coated with the film 1, leaving an end 270 for plating on the tip 271 side. A coating 1 is coated on 6 base materials 3 with a gap 272 around the main body of the ring. and. The end portion 270 for forming the plating and the tip portion l2 of the coating l
It has a plated contact portion l5 at the contact point with the. Next, the basic printed wiring board for forming the above printed wiring board is shown in FIG. 11A. As shown in FIG. 11B, a through hole 35 is bored in the base material 3, and the through hole 35
above the circuit conductor 27. There is a circuit conductor 29 below. The circuit conductor 29 has a tip 291. next. The screen printing plate 4 for liquid ink printing consists of the first
Figure 2A. As shown in Figure 12B. It has an ink-impermeable portion 44 located in a part above the circuit conductor 27. ! 1
The left side surface 441 of the F ink impermeable part 44 is the circuit conductor 27
The right end surface 442 is above the circuit conductor 27 body. The liquid ink printed portion 10 formed by the screen printing plate 4 is... As shown in FIG. 13, its tip l2 covers the tip 271 of the circuit conductor 27, and the main body of the circuit conductor 27 is covered by the printed portion 10.
しかして．露光用マスク５は第１３Ａ図，第１３Ｂ図に
示すごとく，円上の紫外線不透過部５Ｇを有して，回路
導体２７の環状の本体よりも若干太き目の外周を有する
．そして，該紫外線不透過部５６の左方暖，印刷部分１
０の先端部１２よりも外方（スルーホール３５の方向）
に位置している．
それ故，上記露光用マスク５により紫外線照射を行い，
現像，熱硬化処理を行なうことにより，前記第１４Ａ図
，第１４Ｂ図に示した形状のプリント配線板を得ること
ができる．その他は，第１実施例と同様である．
本例においても第１実施例と同様の効果を得ることがで
きる．However. As shown in FIGS. 13A and 13B, the exposure mask 5 has a circular ultraviolet opaque portion 5G and has a slightly thicker outer periphery than the annular main body of the circuit conductor 27. Then, the left side of the ultraviolet opaque portion 56, the printed portion 1
0 outside the tip 12 (in the direction of the through hole 35)
It is located in Therefore, ultraviolet rays are irradiated using the exposure mask 5,
By performing development and thermosetting treatment, a printed wiring board having the shape shown in FIGS. 14A and 14B can be obtained. The rest is the same as the first embodiment. In this example as well, the same effects as in the first example can be obtained.
第１図〜第６Ｂ図は第１実施例を示し．第１図は印刷部
分とスクリーン印刷版及び露光用マスクとの位置関係を
示す説明図，第２図はフォトソルダーレジスト被膜とめ
っき膜との位置関係を示す断面図．第３Ａ図は被膜形成
前のプリント配線板の平面図．第３Ｂ図は第３Ａ図のＡ
−Ａ線矢視断而図５第４Ａ図はスクリーン印刷１版の平
面図．第４Ｂ図は第４Ａ図のＢ−Ｂ線矢視断面図，第５
Ａ図は露光用マスクの平面図，第５Ｂ図は第５Ａ図のＣ
−Ｃ線矢視断面図，第６Ａ図はめっきマスクを形成した
プリント配線板の平面図．第６Ｂ図は第６Ａ図のＤ−Ｄ
腺矢視断面図，第７Ａ図〜第ｌＯＢ図は第２実施例を示
し第７Ａ図は被膜形成ｎｉｌのプリント配線板の平面図
．第７Ｂ図は第７Ａ図のＥ−Ｅ線矢視断面図，第８Ａ図
はスクリーン印刷版の平面図．第８Ｂ図は第８Ａ図のＦ
−Ｆ線矢視断面図，第９Ａ図は露光用マスクの平面図、
第９Ｂ図は第９Ａ図のＧ−Ｇ線矢視断面図，第１０Ａ図
は被膜形成後のプリント配線板の平面図，第１０Ｂ図は
第１０Ａ図のＨ−Ｈ線矢視断面図，第１１Ａ図〜第１４
Ｂ図は第３実施例を示し，第１１Ａ図は被膜形成前のプ
リント配線板の平面図，第１１Ｂ図は第１１図の１−１
線矢視断面図．第１２Ａ図はスクリーン印刷版の平面図
，第１２Ｂ図は第１２Ａ図のＪ−Ｊ線矢視断面図．第１
３Ａ図は露光用マスクの平面図．第１３Ｂ図は第１３Ａ
図のＫ−Ｋ腺矢視断面図，第１４Ａ図は被膜形成後のプ
リント配線板の平面図．第１４Ｂ図は第１４Ａ図のＬ−
Ｌｌｉ矢視断面図，第１５図〜第１７Ｂ図は従来例一を
示し第１５図はフォトソルダーレジスト被膜の状態を示
す断面図，第１６Ａ図は露光用マスクの平面図．第１６
Ｂ図は第１６Ａ図のＭ−Ｍｌｉ矢視断面図，第１７Ａ図
は被膜形成後のプリント配線板の平面図．第１７Ｂ図は
第１７Ａ図のＮ−Ｎ線矢視断面図である．
１０．．．印刷部分，
１２．．．先端部，
１５．．．めっきつきつけ部分．
２．，．コネクタ端子
２１．．．めっき膜形成用の端部，
２５，２６．．． パッド，
２７、．．回路導体，
２８．．めっき膜
３．．．基材２
４．．．スクリーン印刷版，
４１．４３，４４．．． インク不透過部分４２．．．
インク通過部，
５． ． ． １Ｍ光用マスク
５１，５４，５５，５６．．．紫外線不透過部６０．．
．めっきマスク，
ｌ，，，フォトソルダーレジスト被膜，第１図
第４へ図
Ａ
ｖＢ図
第３Ａ図
第３Ｂ図
第弘図
第田図
弟弘図
第６Ｂ図
第門図
％
第７Ａ図
ｘｅＡ図
Ａ
，第９Ａ図
Ｃ図
第田図
ｆｌＱ３図
１１Ａ図
第１１Ｂ図
ｍｌ払図
ｄ２Ｂ図
ｆｔｃ１４Ａｔ２１
ｍｌ岨図
第１３Ａ図
ｊ７Ａ，！Ｂ図
第１５図
７８図
肩込図
剃刀図
第１７Ａ図Figures 1 to 6B show the first embodiment. Figure 1 is an explanatory diagram showing the positional relationship between the printed part, screen printing plate, and exposure mask, and Figure 2 is a sectional view showing the positional relationship between the photo solder resist film and the plating film. Figure 3A is a plan view of the printed wiring board before film formation. Figure 3B is A of Figure 3A.
- View from line A Figure 5 Figure 4A is a plan view of the first version of screen printing. Figure 4B is a sectional view taken along line B-B in Figure 4A, and
Figure A is a plan view of the exposure mask, and Figure 5B is C of Figure 5A.
- A sectional view taken along the line C and FIG. 6A are a plan view of a printed wiring board on which a plating mask is formed. Figure 6B is D-D in Figure 6A.
A cross-sectional view taken in the direction of the arrow, and FIGS. 7A to 1OB show the second embodiment, and FIG. 7A is a plan view of a printed wiring board with a nil film formed thereon. Fig. 7B is a sectional view taken along the line E-E in Fig. 7A, and Fig. 8A is a plan view of the screen printing plate. Figure 8B is F of Figure 8A.
-F line arrow sectional view, Figure 9A is a plan view of the exposure mask,
9B is a sectional view taken along the line G-G in FIG. 9A, FIG. 10A is a plan view of the printed wiring board after film formation, and FIG. 10B is a sectional view taken along the line H-H in FIG. Figure 11A ~ No. 14
Figure B shows the third embodiment, Figure 11A is a plan view of the printed wiring board before film formation, and Figure 11B is 1-1 in Figure 11.
Cross-sectional view taken along the line. Figure 12A is a plan view of the screen printing plate, and Figure 12B is a sectional view taken along the line J--J in Figure 12A. 1st
Figure 3A is a plan view of the exposure mask. Figure 13B is Figure 13A
The sectional view taken along line K--K in the figure, and Figure 14A is a plan view of the printed wiring board after film formation. Figure 14B is L- of Figure 14A.
15 to 17B show the conventional example 1, FIG. 15 is a sectional view showing the state of the photo solder resist film, and FIG. 16A is a plan view of the exposure mask. 16th
Figure B is a sectional view taken along the line M-Mli in Figure 16A, and Figure 17A is a plan view of the printed wiring board after film formation. Figure 17B is a sectional view taken along line N--N in Figure 17A. 10. ．． ．． Printed part, 12. ．． ．． Tip, 15. ．． ．． Plating part. 2. 、． Connector terminal 21. ．． ．． End portion for forming plating film, 25, 26. ．． ．． Pad, 27,. ．． circuit conductor, 28. ．． Plating film 3. ．． ．． Base material 2 4. ．． ．． Screen printing version, 41.43,44. ．． ．． Ink impermeable portion 42. ．． ．．
Ink passage section, 5. ．． ．． 1M light mask 51, 54, 55, 56. ．． ．． Ultraviolet opaque portion 60. ．．
．． Plating mask, l,,, Photo solder resist coating, Fig. 1 Fig. 4 Fig. A vB Fig. 3A Fig. 3B Fig. Hiroshi Fig. 6B Fig. 6B Fig. % Fig. 7A 9A figure C figure 田 figure flQ3 figure 11A figure 11B figure ml pay figure d2B figure ftc14At21 ml 娨 figure 13A figure j7A,! Fig. B Fig. 15 Fig. 78 Shoulder drawing Razor drawing Fig. 17A
Claims (2)
残してフォトソルダーレジスト被膜を形成したプリント
配線板において，該フォトソルダーレジスト被膜の先端
部は，回路導体における上記めっき膜形成用の端部に向
かってその膜厚が漸減する形状を有することを特徴とす
るプリント配線板。(1) In a printed wiring board in which a photo solder resist film is formed on the circuit conductor on the surface of the base material, leaving an edge for forming the plating film on the circuit conductor, the tip of the photo solder resist film is formed on the circuit conductor where the plating film is formed. 1. A printed wiring board characterized by having a shape in which the film thickness gradually decreases toward the end of the board.
被膜を形成し，その後上記回路導体の端部にめっき膜を
設ける，プリント配線板の製造方法において， 回路導体上に形成すべきフォトソルダーレジスト被膜の
先端部よりも内側方向までインク不透過部分を設けたス
クリーン印刷版を用いて，回路導体上に上記フォトソル
ダーレジスト被膜用の液状インクを印刷し， 次いで印刷部分の先端部よりも外方まで露光部を形成し
た露光用マスクを用いて光照射を行い，現像，硬化処理
を行い，然る後回路導体の端部にめっき膜を形成するこ
とを特徴とするプリント配線板の製造方法。(2) A photo solder resist to be formed on the circuit conductor in a printed wiring board manufacturing method in which a photo solder resist film is formed on the circuit conductor on the surface of the base material, and then a plating film is provided on the end of the circuit conductor. Print the liquid ink for the photo solder resist film on the circuit conductor using a screen printing plate with an ink-impermeable part extending inward from the leading edge of the film, and then printing the liquid ink for the photo solder resist film outward from the leading edge of the printed part. 1. A method for producing a printed wiring board, which comprises performing light irradiation using an exposure mask in which an exposed area has been formed, performing development and curing treatment, and then forming a plating film on the end of a circuit conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1115544A JP2838538B2 (en) | 1989-05-09 | 1989-05-09 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1115544A JP2838538B2 (en) | 1989-05-09 | 1989-05-09 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02294095A true JPH02294095A (en) | 1990-12-05 |
| JP2838538B2 JP2838538B2 (en) | 1998-12-16 |
Family
ID=14665160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1115544A Expired - Lifetime JP2838538B2 (en) | 1989-05-09 | 1989-05-09 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2838538B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183740A (en) * | 2003-12-19 | 2005-07-07 | Mitsui Mining & Smelting Co Ltd | Printed wiring board and semiconductor device |
| JP2006162886A (en) * | 2004-12-06 | 2006-06-22 | Fujikura Ltd | Method for forming permanent resist layer |
| WO2014119232A1 (en) * | 2013-01-30 | 2014-08-07 | 株式会社デンソー | Method for fabrication of multilayer substrate for bga-type component mounting |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63271997A (en) * | 1987-04-28 | 1988-11-09 | Ibiden Co Ltd | Printed wiring board |
-
1989
- 1989-05-09 JP JP1115544A patent/JP2838538B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63271997A (en) * | 1987-04-28 | 1988-11-09 | Ibiden Co Ltd | Printed wiring board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183740A (en) * | 2003-12-19 | 2005-07-07 | Mitsui Mining & Smelting Co Ltd | Printed wiring board and semiconductor device |
| JP2006162886A (en) * | 2004-12-06 | 2006-06-22 | Fujikura Ltd | Method for forming permanent resist layer |
| JP4486872B2 (en) * | 2004-12-06 | 2010-06-23 | 株式会社フジクラ | Method for manufacturing printed wiring board |
| WO2014119232A1 (en) * | 2013-01-30 | 2014-08-07 | 株式会社デンソー | Method for fabrication of multilayer substrate for bga-type component mounting |
| JP2014168039A (en) * | 2013-01-30 | 2014-09-11 | Denso Corp | Process of manufacturing multilayer substrate for mounting bga components |
| US9930790B2 (en) | 2013-01-30 | 2018-03-27 | Denso Corporation | Method for manufacturing multilayer substrate for having BGA-type component thereon |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2838538B2 (en) | 1998-12-16 |
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